利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.012 秒)

    EPITAXIAL WAFER MANUFACTURING DEVICE AND MANUFACTURING METHOD
    1.
    发明申请
    EPITAXIAL WAFER MANUFACTURING DEVICE AND MANUFACTURING METHOD 有权
    外延式制造装置和制造方法

    公开(公告)号：US20140230722A1

    公开(公告)日：2014-08-21

    申请号：US14236272

    申请日：2012-08-03

    申请人： Yoshiaki Kageshima ,  Daisuke Muto ,  Kenji Momose

    发明人： Yoshiaki Kageshima ,  Daisuke Muto ,  Kenji Momose

    IPC分类号： C30B25/02 ,  C30B25/10 ,  C30B25/12

    CPC分类号： C30B25/02 ,  C23C16/4401 ,  C30B25/10 ,  C30B25/12 ,  C30B29/36 ,  H01L21/02378 ,  H01L21/02529

    摘要： An epitaxial wafer manufacturing device, including a shield (12), which in addition to being removably attached inside a chamber, is arranged in close proximity to the lower surface of a top plate (3). The shield has a substrate (12a) having an opening (13) in the central portion thereof that forces a gas inlet (9) to face the inside of a reaction space (K), and a thin film (12b) that covers the lower surface of the substrate. The surface of the thin film has the shape of surface irregularities corresponding to fine surface irregularities formed in the lower surface of the substrate. When the shield has undergone thermal deformation as a result of being heated by heating means (8), deposits deposited on the lower surface of the shield are inhibited from falling off by the shape of the surface irregularities.

    摘要翻译： 一种外延晶片制造装置，其包括除了可移除地附接在室内之外的屏蔽件（12），其紧邻顶板（3）的下表面布置。 该屏蔽体具有在其中心部分具有开口（13）的基板（12a），其迫使气体入口（9）面向反应空间（K）的内部，并且覆盖下部的薄膜（12b） 基板的表面。 薄膜的表面具有对应于形成在基板的下表面中的细小表面凹凸的表面凹凸的形状。 当屏蔽体被加热装置（8）加热而发生热变形时，由于表面凹凸的形状，沉积在屏蔽层下表面的沉积物被抑制掉。

    SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME
    4.
    发明申请
    SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME 有权
    SIC外延波形及其制造方法

    公开(公告)号：US20140175461A1

    公开(公告)日：2014-06-26

    申请号：US14240662

    申请日：2012-09-04

    申请人： Kenji Momose ,  Michiya Odawara ,  Daisuke Muto ,  Yoshiaki Kageshima

    发明人： Kenji Momose ,  Michiya Odawara ,  Daisuke Muto ,  Yoshiaki Kageshima

    IPC分类号： H01L21/02 ,  H01L29/16

    CPC分类号： H01L21/02617 ,  C30B25/186 ,  C30B25/20 ,  C30B29/36 ,  H01L21/02024 ,  H01L21/02046 ,  H01L21/02378 ,  H01L21/02433 ,  H01L21/02529 ,  H01L21/0262 ,  H01L21/02634 ,  H01L21/02658 ,  H01L29/045 ,  H01L29/1608 ,  H01L29/32

    摘要： Provided are a SiC epitaxial wafer in which the surface density of stacking faults is reduced, and a manufacturing method thereof. The method for manufacturing such a SiC epitaxial wafer comprises a step of determining a ratio of basal plane dislocations (BPD), which causes stacking faults in a SiC epitaxial film of a prescribed thickness which is formed on a SiC single crystal substrate having an off angle, to basal plane dislocations which are present on a growth surface of the SiC single crystal substrate, a step of determining an upper limit of surface density of basal plane dislocations on the growth surface of a SiC single crystal substrate used based on the above ratio, and a step of preparing a SiC single crystal substrate which has surface density equal to or less than the above upper limit, and forming a SiC epitaxial film on the SiC single crystal substrate under the same conditions as the growth conditions of the epitaxial film used in the step of determining the ratio.

    摘要翻译： 提供了一种其中堆垛层错密度降低的SiC外延晶片及其制造方法。 制造这种SiC外延晶片的方法包括确定基板面位错比（BPD）的步骤，其导致形成在具有偏角的SiC单晶衬底上的规定厚度的SiC外延膜中的堆垛层错 存在于SiC单晶基板的生长面上的基面位错，基于上述比例确定使用的SiC单晶基板的生长面上的基面位错的表面密度的上限的步骤， 以及制备具有等于或小于上述上限的表面密度的SiC单晶衬底的步骤，并且在与所述SiC单晶衬底中使用的外延膜的生长条件相同的条件下，在SiC单晶衬底上形成SiC外延膜 确定比例的步骤。

    EPITAXIAL WAFER MANUFACTURING DEVICE AND MANUFACTURING METHOD
    6.
    发明申请
    EPITAXIAL WAFER MANUFACTURING DEVICE AND MANUFACTURING METHOD 有权
    外延式制造装置和制造方法

    公开(公告)号：US20140190400A1

    公开(公告)日：2014-07-10

    申请号：US14236951

    申请日：2012-08-02

    申请人： Yoshiaki Kageshima ,  Tomoyuki Noguchi ,  Daisuke Muto ,  Kenji Momose

    发明人： Yoshiaki Kageshima ,  Tomoyuki Noguchi ,  Daisuke Muto ,  Kenji Momose

    IPC分类号： H01L21/02 ,  C30B25/08

    CPC分类号： H01L21/02634 ,  C23C16/4401 ,  C30B25/08 ,  C30B29/36 ,  H01L21/02378 ,  H01L21/02529

    摘要： Provided is an epitaxial wafer manufacturing device (1) that deposits and grows epitaxial layers on the surfaces of wafers W while supplying a raw material gas to a chamber, wherein a shield (12), arranged in close proximity to the lower surface of a top plate (3) so as to prevent deposits from being deposited on the lower surface of the top plate (3), is removably attached inside the chamber, has an opening (13) in the central portion thereof that forces a gas inlet (9) to face the inside of a reaction space K, and has a structure in which it is concentrically divided into a plurality of ring plates (16), (17) and (18) around the opening (13).

    摘要翻译： 提供了一种外延晶片制造装置（1），其在将原料气体供应到室中的同时，在晶片W的表面上沉积和生长外延层，其中屏蔽（12）布置成靠近顶部的下表面 板（3），以防止沉积物沉积在顶板（3）的下表面上，可移除地附接在室内，在其中心部分具有迫使气体入口（9）的开口（13） 面对反应空间K的内部，并且具有其周围围绕开口（13）同心地分为多个环板（16），（17）和（18）的结构。