METROLOGY METHOD, TARGET AND SUBSTRATE
    6.
    发明申请
    METROLOGY METHOD, TARGET AND SUBSTRATE 审中-公开
    计量方法,目标和底物

    公开(公告)号:US20160061589A1

    公开(公告)日:2016-03-03

    申请号:US14835504

    申请日:2015-08-25

    IPC分类号: G01B11/14

    摘要: A diffraction measurement target that has at least a first sub-target and at least a second sub-target, and wherein (1) the first and second sub-targets each include a pair of periodic structures and the first sub-target has a different design than the second sub-target, the different design including the first sub-target periodic structures having a different pitch, feature width, space width, and/or segmentation than the second sub-target periodic structure or (2) the first and second sub-targets respectively include a first and second periodic structure in a first layer, and a third periodic structure is located at least partly underneath the first periodic structure in a second layer under the first layer and there being no periodic structure underneath the second periodic structure in the second layer, and a fourth periodic structure is located at least partly underneath the second periodic structure in a third layer under the second layer.

    摘要翻译: 具有至少第一子目标和至少第二子目标的衍射测量目标,并且其中(1)所述第一和第二子目标各自包括一对周期性结构,并且所述第一子目标具有不同的 设计比第二子目标,不同的设计包括具有与第二子目标周期结构不同的间距,特征宽度,空间宽度和/或分割的第一子目标周期性结构,或(2)第一和第二子目标周期结构 子目标分别包括第一层中的第一和第二周期性结构,并且第三周期性结构至少部分地位于第一层下面的第二层中的第一周期性结构下方,并且在第二层周期结构之下不存在周期性结构 并且第四周期性结构至少部分地位于第二层下面的第三层中的第二周期性结构下方。

    Device manufacturing method and associated lithographic apparatus, inspection apparatus, and lithographic processing cell
    9.
    发明授权
    Device manufacturing method and associated lithographic apparatus, inspection apparatus, and lithographic processing cell 有权
    器件制造方法及相关光刻设备,检验设备和光刻处理单元

    公开(公告)号:US09163935B2

    公开(公告)日:2015-10-20

    申请号:US13687569

    申请日:2012-11-28

    摘要: Disclosed is a device manufacturing method, and accompanying inspection and lithographic apparatuses. The method comprises measuring on the substrate a property such as asymmetry of a first overlay marker and measuring on the substrate a property such as asymmetry of an alignment marker. In both cases the asymmetry is determined. The position of the alignment marker on the substrate is then determined using an alignment system and the asymmetry information of the alignment marker and the substrate aligned using this measured position. A second overlay marker is then printed on the substrate; and a lateral overlay measured on the substrate of the second overlay marker with respect to the first overlay marker using the determined asymmetry information of the first overlay marker.

    摘要翻译: 公开了一种器件制造方法,以及伴随的检查和光刻设备。 该方法包括在衬底上测量诸如第一覆盖标记的不对称性和在衬底上测量诸如对准标记的不对称性的特性。 在这两种情况下,确定不对称性。 然后使用对准系统确定对准标记在衬底上的位置,并使用该测量位置对准对准标记和衬底的不对称信息。 然后将第二覆盖标记印刷在基底上; 以及使用所确定的所述第一覆盖标记的不对称信息相对于所述第一覆盖标记在所述第二覆盖标记的基板上测量的横向覆盖。

    Metrology method and apparatus, and device manufacturing method
    10.
    发明授权
    Metrology method and apparatus, and device manufacturing method 有权
    计量方法和装置以及装置制造方法

    公开(公告)号:US09158194B2

    公开(公告)日:2015-10-13

    申请号:US13628697

    申请日:2012-09-27

    摘要: An approach is used to estimate and correct the overlay variation as function of offset for each measurement. A target formed on a substrate includes periodic gratings. The substrate is illuminated with a circular spot on the substrate with a size larger than each grating. Radiation scattered by each grating is detected in a dark-field scatterometer to obtain measurement signals. The measurement signals are used to calculate overlay. The dependence (slope) of the overlay as a function of position in the illumination spot is determined. An estimated value of the overlay at a nominal position such as the illumination spot's center can be calculated, correcting for variation in the overlay as a function of the target's position in the illumination spot. This compensates for the effect of the position error in the wafer stage movement, and the resulting non-centered position of the target in the illumination spot.

    摘要翻译: 一种方法用于估计和校正覆盖变化作为每个测量的偏移函数。 形成在衬底上的靶包括周期性光栅。 在衬底上用圆形点照射衬底,其尺寸大于每个光栅。 在暗场散射仪中检测由每个光栅散射的辐射,以获得测量信号。 测量信号用于计算叠加。 确定覆盖层与照明点中位置的函数关系(斜率)。 可以计算在诸如照明点中心的标称位置处的覆盖物的估计值,以根据目标在照明点中的位置的函数来校正覆盖物的变化。 这补偿了晶片台移动中的位置误差的影响,以及目标在照明点中产生的非居中位置。