摘要:
Power supplied to an information handling system electronic component through a circuit board has component package inductance parasitic effects compensated by configuring connections to the electronic component to have increased parasitic capacitance. For instance, power and ground vias that connect a processor to power and ground planes of the circuit board are aligned to create a desired parasitic capacitance that reduces the impact of parasitic inductance relating to signal compensation, power delivery and high speed decoupling. The desired distributed capacitance is modeled by altering the radius associated with the equivalent line charge of the power via, the distance associated with the line charges between power and ground vias, and the via barrel length.
摘要:
Power supplied to an information handling system electronic component through a circuit board has component package inductance parasitic effects compensated by configuring connections to the electronic component to have increased parasitic capacitance. For instance, power and ground vias that connect a processor to power and ground planes of the circuit board are aligned to create a desired parasitic capacitance that reduces the impact of parasitic inductance relating to signal compensation, power delivery and high speed decoupling. The desired distributed capacitance is modeled by altering the radius associated with the equivalent line charge of the power via, the distance associated with the line charges between power and ground vias, and the via barrel length.
摘要:
Power supplied to an information handling system electronic component through a circuit board has component package inductance parasitic effects compensated by configuring connections to the electronic component to have increased parasitic capacitance. For instance, power and ground vias that connect a processor to power and ground planes of the circuit board are aligned to create a desired parasitic capacitance that reduces the impact of parasitic inductance relating to signal compensation, power delivery and high speed decoupling. The desired distributed capacitance is modeled by altering the radius associated with the equivalent line charge of the power via, the distance associated with the line charges between power and ground vias, and the via barrel length.
摘要:
An information handling system that includes a circuit board for mounting and coupling components of the information handling system. The circuit board includes a trace, a via coupled to the trace, and a cutout region surrounding the via and having a first diameter selected to minimize a loading effect of a via on a signal conveyed on the trace.
摘要:
A system for pre-boot authentication of a virtual appliance includes one or more subsystems to receive a command to power-on an information handling system (IHS). After receiving the command to power-on the IHS, the system initializes a power-on self test (POST), passes control of the IHS to a hypervisor, loads a concurrent service environment (CSE), requests user credentials, receives user credentials, authenticates user credentials using the CSE and authorizes a specific operating system image from a plurality of images to run on the IHS via the virtual appliance after the user credentials are authenticated.
摘要:
A methodology may be used that takes into account the inductive coupling of current transients on the power rails of a printed circuit board (PCB) that may be coupled to the barrel of a via. By taking into account the coupling of the current transients on the power rails of the PCB, more accurate and realistic modeling results may be obtained. Inductive coupling of the current transients from the power rails may be more pronounced at higher frequencies and may be additive for more layer transitions (e.g., more via transitions) of the PCB.
摘要:
Systems and methods for executing tasks on a managed node remotely coupled to a management node are provided. A management controller of the management node may be configured to determine at least one execution policy for a task, schedule the task for execution, receive system information data from the managed node, based at least on the received system information, determine if the received system information complies with the at least one execution policy, and if the received information complies with the at least one execution policy, forward the task from the management controller to the managed node for execution.
摘要:
Systems and methods for executing tasks on a managed node remotely coupled to a management node are provided. A management controller of the management node may be configured to determine at least one execution policy for a task, schedule the task for execution, receive system information data from the managed node, based at least on the received system information, determine if the received system information complies with the at least one execution policy, and if the received information complies with the at least one execution policy, forward the task from the management controller to the managed node for execution.
摘要:
A computer system includes a microprocessor, an an input coupled to provide signal inputs to the microprocessor, a mass storage coupled to the microprocessor, a video controller for coupling the microprocessor to a display, a memory coupled to provide storage to facilitate execution of computer programs by the microprocessor, and a multilayer printed circuit board for mounting the microprocessor thereon. The multilayer printed circuit board provides for reduced electromagnetic interference (EMI) and includes at least two layers. The multilayer printed circuit board further includes a first conductive segment on a first layer, a second conductive segment on the first layer, the second segment being separated from the first segment by a primary gap, and a conductive interconnect on a second layer, the interconnect for carrying a high frequency signal therein. The second layer is disposed laterally from and substantially parallel to the first layer. The interconnect is further disposed for crossing over the first segment to the second segment in a cross-over region and wherein the first segment and the second segment are further characterized by a secondary gap in the cross-over region, the secondary gap being less than the primary gap for providing an increased coupling in the cross-over region. A method for reducing a source of EMI in a multilayer printed circuit board is also disclosed.
摘要:
In a computer including two buses, a main memory, a write back cache, and a peripheral device, a method and apparatus for providing an inter-bus buffer to support successive main memory accesses from the peripheral device is disclosed. The buffer is included in a bridge device for interfacing the two computer buses and controlling when the peripheral device may access the main memory. When the peripheral device attempts to read data from the main memory that is duplicated in the cache and that has become stale, the bridge device initiates a write back operation to update specific data portions of the main memory corresponding to the read request. The bridge device uses look-ahead techniques such as bursting or pipelining to streamline the data coming from the cache to the main memory and to the peripheral device. When the peripheral device requests a misaligned memory read operation, upon termination of the read access due to preemption of the peripheral device, the cache line containing the remainder of the requested data is written back to the main memory, and stored in the buffler. The bridge device can then use the data stored in the buffer to respond to subsequent memory access requests from the peripheral device.