公开(公告)号：US20120280409A1

公开(公告)日：2012-11-08

申请号：US13509163

申请日：2010-09-23

申请人： Achim Trautmann ,  Ralf Reichenbach

发明人： Achim Trautmann ,  Ralf Reichenbach

IPC分类号： H01L23/48 ,  H01L21/30

CPC分类号： B81C1/00269 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/26145 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30177 ,  H01L2224/30505 ,  H01L2224/30515 ,  H01L2224/32054 ,  H01L2224/32145 ,  H01L2224/32501 ,  H01L2224/83007 ,  H01L2224/83095 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/83815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/1631 ,  H01L2924/165 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/00014

摘要： A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.

摘要翻译： 用于接合半导体衬底的微机械组件包括具有多个半导体芯片的芯片图案的半导体衬底，每个半导体芯片具有功能区域和围绕功能区域的边缘区域。 存在由边缘区域中的至少两个合金部件制成的接合合金的接合框架，与功能区域间隔开。 在围绕接合框架和功能区域之间的接合框架的边缘区域的部分内，存在至少一个由至少一个合金部件制成的止挡框架，其被构造成使得当接合合金的熔体接触 在接合期间的停止框架，粘结合金固化。

公开(公告)号：US08638000B2

公开(公告)日：2014-01-28

申请号：US13509163

申请日：2010-09-23

申请人： Achim Trautmann ,  Ralf Reichenbach

发明人： Achim Trautmann ,  Ralf Reichenbach

IPC分类号： H01L23/48

CPC分类号： B81C1/00269 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/26145 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30177 ,  H01L2224/30505 ,  H01L2224/30515 ,  H01L2224/32054 ,  H01L2224/32145 ,  H01L2224/32501 ,  H01L2224/83007 ,  H01L2224/83095 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/83815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/1631 ,  H01L2924/165 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01049 ,  H01L2924/00014

摘要： A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.

摘要翻译： 用于接合半导体衬底的微机械组件包括具有多个半导体芯片的芯片图案的半导体衬底，每个半导体芯片具有功能区域和围绕功能区域的边缘区域。 存在由边缘区域中的至少两个合金部件制成的接合合金的接合框架，与功能区域间隔开。 在围绕接合框架和功能区域之间的接合框架的边缘区域的部分内，存在至少一个由至少一个合金部件制成的止挡框架，其被构造成使得当接合合金的熔体接触 在接合期间的停止框架，粘结合金固化。

公开(公告)号：US20120292641A1

公开(公告)日：2012-11-22

申请号：US13446531

申请日：2012-04-13

申请人： Frederik Schrey ,  Achim Trautmann ,  Joachim Rudhard

发明人： Frederik Schrey ,  Achim Trautmann ,  Joachim Rudhard

IPC分类号： H01L29/161 ,  H01L21/28

CPC分类号： H01L21/28506 ,  H01L21/048 ,  H01L21/7688 ,  H01L29/1608

摘要： A semiconductor device having a substrate, and at least one contact, situated on and/or above a surface of the substrate, having at least one layer made of a conductive material, the conductive material including at least one metal. The layer made of the conductive material is sputtered on, and has tear-off marks on at least one outer side area between an outer base area facing the surface and an outer contact area facing away from the surface. A manufacturing method for a semiconductor device having at least one contact is also described.

摘要翻译： 一种半导体器件，其具有位于衬底表面上和/或上表面上的衬底和至少一个触点，该衬底具有至少一层由导电材料制成的层，该导电材料包括至少一种金属。 由导电材料制成的层被溅射在面向表面的外部基底区域和背离表面的外部接触区域之间的至少一个外侧区域上并具有撕裂痕迹。 还描述了具有至少一个接触的半导体器件的制造方法。

公开(公告)号：US20100308475A1

公开(公告)日：2010-12-09

申请号：US12733861

申请日：2008-09-02

申请人： Achim Trautmann ,  Ando Feyh

发明人： Achim Trautmann ,  Ando Feyh

IPC分类号： H01L23/488 ,  H01L21/768

CPC分类号： H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/038 ,  H01L21/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/33 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/32057 ,  H01L2224/32506 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1631 ,  H01L2924/164 ,  H01L2924/01014 ,  H01L2924/00

摘要： A composite, including a first semiconductor substrate that is secured by soldering material to at least one second semiconductor substrate, a eutectic being formed between the soldering material and the second semiconductor substrate and/or at least one layer possibly provided on the semiconductor substrate. It is provided that the eutectic is formed between the soldering material and a microstructure, which is formed in the region of contact with the soldering material on the second semiconductor substrate and/or the layer. Also described is a production method.

摘要翻译： 一种复合材料，包括通过焊接材料固定到至少一个第二半导体衬底的第一半导体衬底，在焊料和第二半导体衬底之间形成的共晶体和/或可能设置在半导体衬底上的至少一层。 提供了在焊接材料和在与第二半导体衬底和/或层上的焊料接触的区域中形成的微结构体之间形成共晶体。 还描述了一种生产方法。

公开(公告)号：US20130098154A1

公开(公告)日：2013-04-25

申请号：US13635581

申请日：2011-01-19

申请人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

发明人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

IPC分类号： G01P15/09

CPC分类号： G01P15/09 ,  G01P15/0802 ,  G01P15/12 ,  G01P15/123

摘要： A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

摘要翻译： 压阻微机电传感器部件包括基板，抗震块，至少一个压阻棒和测量装置。 地震质量从基板悬挂使其能够偏转。 所述至少一个压阻棒设置在所述基底和所述抗震块之间，并且当所述地震质量被偏转时，所述至少一个压阻棒经受阻力的变化。 至少一个压阻棒具有至少部分地覆盖压阻棒并延伸到衬底的区域中的横向和/或上部和/或下部导体轨道。 测量装置电连接到基板和导体轨道，并且被配置成测量电路的电阻变化，该电阻通过基板通过压阻棒和从压阻棒通过横向和/或上部和/ 或下导体轨道。

公开(公告)号：US20120038049A1

公开(公告)日：2012-02-16

申请号：US12998868

申请日：2009-10-20

申请人： Achim Trautmann ,  Thorsten Mueller

发明人： Achim Trautmann ,  Thorsten Mueller

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

摘要： A component including a via for electrical connection between a first and a second plane of a substrate is provided. The substrate has a borehole having an inner wall that is coated with a conductive layer made of an electrically conductive material, an intermediate layer being disposed between the inner wall and the conductive layer. The intermediate layer includes electrically insulating SiC.

摘要翻译： 提供了包括用于基板的第一和第二平面之间的电连接的通孔的部件。 衬底具有内壁的内壁，该内壁涂覆有由导电材料制成的导电层，中间层设置在内壁和导电层之间。 中间层包括电绝缘的SiC。

公开(公告)号：US09110090B2

公开(公告)日：2015-08-18

申请号：US13635581

申请日：2011-01-19

申请人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

发明人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

IPC分类号： G01P15/12 ,  G01P15/09 ,  G01P15/08

CPC分类号： G01P15/09 ,  G01P15/0802 ,  G01P15/12 ,  G01P15/123

摘要： A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

摘要翻译： 压阻微机电传感器部件包括基板，抗震块，至少一个压阻棒和测量装置。 地震质量从基板悬挂使其能够偏转。 所述至少一个压阻棒设置在所述基底和所述抗震块之间，并且当所述地震质量被偏转时，所述至少一个压阻棒经受阻力的变化。 至少一个压阻棒具有至少部分地覆盖压阻棒并延伸到衬底的区域中的横向和/或上部和/或下部导体轨道。 测量装置电连接到基板和导体轨道，并且被配置成测量电路的电阻变化，该电阻通过基板通过压阻棒和从压阻棒通过横向和/或上部和/ 或下导体轨道。

公开(公告)号：US09202702B2

公开(公告)日：2015-12-01

申请号：US13446531

申请日：2012-04-13

申请人： Frederik Schrey ,  Achim Trautmann ,  Joachim Rudhard

发明人： Frederik Schrey ,  Achim Trautmann ,  Joachim Rudhard

IPC分类号： H01L29/15 ,  H01L21/285 ,  H01L21/768 ,  H01L21/04 ,  H01L29/16

CPC分类号： H01L21/28506 ,  H01L21/048 ,  H01L21/7688 ,  H01L29/1608

摘要： A semiconductor device having a substrate, and at least one contact, situated on and/or above a surface of the substrate, having at least one layer made of a conductive material, the conductive material including at least one metal. The layer made of the conductive material is sputtered on, and has tear-off marks on at least one outer side area between an outer base area facing the surface and an outer contact area facing away from the surface. A manufacturing method for a semiconductor device having at least one contact is also described.

摘要翻译： 一种半导体器件，其具有位于衬底表面上和/或上表面上的衬底和至少一个触点，该衬底具有至少一层由导电材料制成的层，该导电材料包括至少一种金属。 由导电材料制成的层被溅射在面向表面的外部基底区域和背离表面的外部接触区域之间的至少一个外侧区域上并具有撕裂痕迹。 还描述了具有至少一个接触的半导体器件的制造方法。

公开(公告)号：US20110233750A1

公开(公告)日：2011-09-29

申请号：US13133521

申请日：2009-10-19

申请人： Achim Trautmann ,  Ando Feyh

发明人： Achim Trautmann ,  Ando Feyh

IPC分类号： H01L23/52 ,  H01L21/50

CPC分类号： H01L23/10 ,  B81B2207/012 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/038 ,  H01L2924/0002 ,  H01L2924/1433 ,  H01L2924/00

摘要： An arrangement having a first and a second substrate is disclosed, wherein the two substrates are connected to one another by means of an SLID (Solid Liquid InterDiffusion) bond. The SLID bond exhibits a first metallic material and a second metallic material, wherein the SLID bond comprises the intermetallic Al/Sn-phase.

摘要翻译： 公开了一种具有第一和第二基板的装置，其中两个基板通过SLID（固体液体互扩散）粘合而彼此连接。 SLID键显示第一金属材料和第二金属材料，其中SLID键包括金属间Al / Sn相。

公开(公告)号：US09111787B2

公开(公告)日：2015-08-18

申请号：US13133521

申请日：2009-10-19

申请人： Achim Trautmann ,  Ando Feyh

发明人： Achim Trautmann ,  Ando Feyh

IPC分类号： H01L21/58 ,  H01L23/10 ,  B81C1/00 ,  H01L21/447

CPC分类号： H01L23/10 ,  B81B2207/012 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/038 ,  H01L2924/0002 ,  H01L2924/1433 ,  H01L2924/00

摘要： An arrangement having a first and a second substrate is disclosed, wherein the two substrates are connected to one another by means of an SLID (Solid Liquid InterDiffusion) bond. The SLID bond exhibits a first metallic material and a second metallic material, wherein the SLID bond comprises the intermetallic Al/Sn-phase.

摘要翻译： 公开了一种具有第一和第二基板的装置，其中两个基板通过SLID（固体液体互扩散）粘合而彼此连接。 SLID键显示第一金属材料和第二金属材料，其中SLID键包括金属间Al / Sn相。