公开(公告)号：US6064112A

公开(公告)日：2000-05-16

申请号：US47350

申请日：1998-03-25

申请人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda ,  Kunihiro Tsubosaki ,  Asao Nishimura

发明人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda ,  Kunihiro Tsubosaki ,  Asao Nishimura

IPC分类号： H01L23/50 ,  H01L23/48 ,  H01L23/495 ,  H01L25/10 ,  H01L25/18 ,  H01L25/11

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351

摘要： A semiconductor device in which inner leads among a plurality of leads are arranged on a circuit formation face of a semiconductor chip encapsulated by a resin encapsulating body and bonding pads formed on the circuit formation face of the chip and the inner leads are electrically connected. An adhesive is selectively applied only to the inner leads on the outermost sides arranged on both ends of the chip among the plurality of inner leads. The circuit formation face of the chip and the inner leads of the selected leads are joined with the adhesive Each of the selected leads has a step on the main face of the semiconductor chip and the leads except for the selected leads have almost straight shapes without being processed to have steps.

摘要翻译： 一种半导体器件，其中多个引线中的内部引线布置在由树脂封装体封装的半导体芯片的电路形成面上，并且形成在芯片的电路形成面上的接合焊盘和内部引线电连接。 粘合剂仅选择性地仅施加在布置在多个内引线中的芯片两端的最外侧的内引线上。 芯片的电路形成面和所选引线的内引线与粘合剂接合每个所选择的引线在半导体芯片的主面上具有台阶，除了所选择的引线之外的引线具有几乎直的形状，而不是 加工成有步骤。

公开(公告)号：US06392295B1

公开(公告)日：2002-05-21

申请号：US09421274

申请日：1999-10-20

申请人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

发明人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/4866 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/4876 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part and an outer part, and including a plurality of first leads having inner end portions extended on the main surface of the semiconductor chip and a plurality of second leads having inner end portions terminating near the semiconductor chip; bonding wires electrically connecting the bonding pads to bonding portions of the inner parts of the first and the second leads; and a sealing member sealing the semiconductor chip therein. A first bending portion is formed in the inner part of each second lead to prevent the sealing member from transformation by forming the sealing member in satisfactory resin balance between an upper portion and a lower portion of the sealing member.

公开(公告)号：US06576994B2

公开(公告)日：2003-06-10

申请号：US10115986

申请日：2002-04-05

申请人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

发明人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/4866 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/4876 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part and an outer part, and including a plurality of first leads having inner end portions extended on the main surface of the semiconductor chip and a plurality of second leads having inner end portions terminating near the semiconductor chip; bonding wires electrically connecting the bonding pads to bonding portions of the inner parts of the first and the second leads; and a sealing member sealing the semiconductor chip therein. A first bending portion is formed in the inner part of each second lead to prevent the sealing member from transformation by forming the sealing member in satisfactory resin balance between an upper portion and a lower portion of the sealing member.

公开(公告)号：US06545349B2

公开(公告)日：2003-04-08

申请号：US09779609

申请日：2001-02-09

申请人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

发明人： Akihiko Iwaya ,  Tamaki Wada ,  Masachika Masuda

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/4866 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/4876 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part and an outer part, and including a plurality of first leads having inner end portions extended on the main surface of the semiconductor chip and a plurality of second leads having inner end portions terminating near the semiconductor chip; bonding wires electrically connecting the bonding pads to bonding portions of the inner parts of the first and the second leads; and a sealing member sealing the semiconductor chip therein. A first bending portion is formed in the inner part of each second lead to prevent the sealing member from transformation by forming the sealing member in satisfactory resin balance between an upper portion and a lower portion of the sealing member.

公开(公告)号：US07233058B2

公开(公告)日：2007-06-19

申请号：US11203969

申请日：2005-08-16

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

公开(公告)号：US07012321B2

公开(公告)日：2006-03-14

申请号：US10377713

申请日：2003-03-04

申请人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

发明人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01R43/00

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

公开(公告)号：US20050184380A1

公开(公告)日：2005-08-25

申请号：US11114175

申请日：2005-04-26

申请人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

发明人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

IPC分类号： G11C8/00 ,  H01L23/02 ,  H01L23/495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.

公开(公告)号：US07122883B2

公开(公告)日：2006-10-17

申请号：US11002247

申请日：2004-12-03

申请人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

发明人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC分类号： H01L23/495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

公开(公告)号：US07053471B2

公开(公告)日：2006-05-30

申请号：US10267784

申请日：2002-10-10

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  H05K5/00

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小型存储卡1也可以用于设计为处理现有存储卡的设备中。

公开(公告)号：US06885092B1

公开(公告)日：2005-04-26

申请号：US09453171

申请日：1999-12-02

申请人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

发明人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

IPC分类号： G11C8/00 ,  H01L23/02 ,  H01L23/495 ,  H01L23/28 ,  H01L23/04 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.

摘要翻译： 半导体器件通过层叠两个半导体芯片与其背面面对面设置而形成。 每个半导体芯片设置有用于时钟使能的外部引线，时钟使能信号和芯片选择信号被单独地输入。 在访问一个半导体芯片的情况下，通过将时钟使能信号和芯片选择信号设置为非活动状态，将另一个半导体芯片设置为低功耗模式。