公开(公告)号：US08563362B2

公开(公告)日：2013-10-22

申请号：US13255799

申请日：2010-03-10

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： H01L21/44

CPC分类号： H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32057 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method for producing a semiconductor chip laminate, which comprises applying an adhesive to a substrate or other semiconductor chip; laminating the semiconductor chip on the substrate or other semiconductor chip via the adhesive; uniformly wetting and spreading the adhesive on an entire region for bonding the semiconductor chip on the substrate or other semiconductor chip; and curing the adhesive. In the application step, an area for applying adhesive is 40% to 90% of the region for bonding the semiconductor chip located on the substrate or other semiconductor chip, immediately after laminating, an area with the adhesive thereon is 60% to less than 100% of the region for bonding the semiconductor chip on the substrate or other semiconductor chip, and in wetting and spreading the adhesive, a viscosity of adhesive between the substrate or other semiconductor chips and the semiconductor chip at 0.5 rpm is 1 Pas to 30 Pas.

摘要翻译： 一种半导体芯片层叠体的制造方法，其特征在于，在基板或其他半导体芯片上涂布粘合剂; 通过粘合剂将半导体芯片层叠在基板或其他半导体芯片上; 在粘合半导体芯片的基板或其他半导体芯片的整个区域均匀地润湿和铺展粘合剂; 并固化粘合剂。 在涂敷工序中，涂布粘合剂的区域是层叠后的刚刚层叠后的位于基板或其他半导体芯片上的半导体芯片的区域的40〜90％，粘合剂的面积为60〜小于100 用于将半导体芯片接合在基板或其他半导体芯片上的区域的％，并且在润湿和扩散粘合剂时，基板或其它半导体芯片与半导体芯片之间的粘合剂的粘度为0.5rpm为1Pa·s至30Pa·s。

公开(公告)号：US20120021233A1

公开(公告)日：2012-01-26

申请号：US13255799

申请日：2010-03-10

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： B32B37/02 ,  B32B27/28

CPC分类号： H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32057 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： It is an object of the present invention to provide a method for producing a semiconductor chip laminate, which adjusts the amount of an adhesive for semiconductor components extending from a bonded region of a semiconductor chip and provides a smaller but highly-precise and highly-reliable semiconductor chip laminate.The present invention relates to a method for producing a semiconductor chip laminate, the semiconductor chip being bonded to a substrate or an other semiconductor chip via an adhesive for semiconductor components, the method comprising the steps of: (1) applying the adhesive for semiconductor components to the substrate or the other semiconductor chip; (2) laminating the semiconductor chip on the substrate or the other semiconductor chip via the applied adhesive for semiconductor components; (3) uniformly wetting and spreading the adhesive for semiconductor components on an entire region for bonding the semiconductor chip located on the substrate or the other semiconductor chip; and (4) curing the adhesive for semiconductor components, wherein, in the application step (1), an area for applying the adhesive for semiconductor components is 40% to 90% of the region for bonding the semiconductor chip located on the substrate or the other semiconductor chip, immediately after the semiconductor chip laminating step (2), an area with the adhesive for semiconductor components wetting and spreading thereon is 60% or more and less than 100% of the region for bonding the semiconductor chip located on the substrate or the other semiconductor chip, and in the step (3) of uniformly wetting and spreading the adhesive for semiconductor components, when measured by an E-type viscometer, a viscosity of the adhesive for semiconductor components between the substrate or the other semiconductor chips and the semiconductor chip at 0.5 rpm is 1 Pa·s to 30 Pa·s.

公开(公告)号：US20120016057A1

公开(公告)日：2012-01-19

申请号：US13146571

申请日：2010-01-29

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： C09J133/14 ,  C09J11/04 ,  C09J11/08

CPC分类号： C09J171/02 ,  C08L33/062 ,  C08L63/00 ,  C08L2666/04 ,  C08L2666/14 ,  C09J133/062 ,  C09J163/00 ,  H01L23/295 ,  H01L24/29 ,  H01L2924/15788 ,  H01L2924/00

摘要： It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

摘要翻译： 本发明的一个目的是提供一种用于电子部件的粘合剂，即使在接合薄的电子部件的情况下也能够防止电子部件的翘曲和回流裂纹。 本发明涉及一种电子部件用粘合剂，其包含：具有脂肪族聚醚主链和缩水甘油醚基的环氧化合物; 含环氧基的丙烯酸聚合物; 环硫化合物; 和固化剂，其中相对于100重量份具有脂族聚醚主链和缩水甘油醚基团的环氧化合物，环硫化合物的量为1重量份以上，小于30重量份。

公开(公告)号：US07838577B2

公开(公告)日：2010-11-23

申请号：US12669081

申请日：2008-07-17

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： B22F1/00 ,  H01L21/00 ,  C08G59/50 ,  B60C1/00

CPC分类号： H01L23/295 ,  C08G59/42 ,  C08K3/36 ,  C09J11/04 ,  C09J163/08 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.

摘要翻译： 本发明的目的是提供一种用于电子部件的粘合剂，涂布性优异，粘合的电子部件中的污渍的防止性高，并且能够提供高可靠性的电子部件。 本发明涉及一种电子部件用液体粘合剂，其含有：固化性化合物; 固化剂; 和无机细颗粒，所述液体粘合剂中的溶解度参数（SP值）在8至11（包括8并且不包括11）的范围内的液体部分，所述无机细颗粒至少包括无机细颗粒 A）和无机微粒（B），平均一次粒径为50nm以下的疏水化度（M值）为30〜50（包括30〜50）的无机微粒（A） 和平均一次粒径为50nm以下，疏水度（M值）为60以上的无机微粒（B）。

公开(公告)号：US08901207B2

公开(公告)日：2014-12-02

申请号：US13146571

申请日：2010-01-29

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： C09J171/02 ,  C09J163/00 ,  C09J133/06 ,  H01L23/29 ,  H01L23/00 ,  C08L33/06 ,  C08L63/00

CPC分类号： C09J171/02 ,  C08L33/062 ,  C08L63/00 ,  C08L2666/04 ,  C08L2666/14 ,  C09J133/062 ,  C09J163/00 ,  H01L23/295 ,  H01L24/29 ,  H01L2924/15788 ,  H01L2924/00

摘要： It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

摘要翻译： 本发明的一个目的是提供一种用于电子部件的粘合剂，即使在接合薄的电子部件的情况下也能够防止电子部件的翘曲和回流裂纹。 本发明涉及一种电子部件用粘合剂，其包含：具有脂肪族聚醚主链和缩水甘油醚基的环氧化合物; 含环氧基的丙烯酸聚合物; 环硫化合物; 和固化剂，其中相对于100重量份具有脂族聚醚主链和缩水甘油醚基团的环氧化合物，环硫化合物的量为1重量份以上，小于30重量份。

公开(公告)号：US20100197830A1

公开(公告)日：2010-08-05

申请号：US12669081

申请日：2008-07-17

申请人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

发明人： Akinobu Hayakawa ,  Hideaki Ishizawa ,  Kohei Takeda ,  Ryohei Masui

IPC分类号： C09J163/00

CPC分类号： H01L23/295 ,  C08G59/42 ,  C08K3/36 ,  C09J11/04 ,  C09J163/08 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.

摘要翻译： 本发明的目的是提供一种用于电子部件的粘合剂，涂布性优异，粘合的电子部件中的污渍的防止性高，并且能够提供高可靠性的电子部件。 本发明涉及一种电子部件用液体粘合剂，其含有：固化性化合物; 固化剂; 和无机细颗粒，所述液体粘合剂中的溶解度参数（SP值）在8至11（包括8并且不包括11）的范围内的液体部分，所述无机细颗粒至少包括无机细颗粒 A）和无机微粒（B），平均一次粒径为50nm以下的疏水化度（M值）为30〜50（包括30〜50）的无机微粒（A） 和平均一次粒径为50nm以下，疏水度（M值）为60以上的无机微粒（B）。

公开(公告)号：US20100076119A1

公开(公告)日：2010-03-25

申请号：US12522755

申请日：2008-01-11

申请人： Hideaki Ishizawa ,  Akinobu Hayakawa ,  Kohei Takeda

发明人： Hideaki Ishizawa ,  Akinobu Hayakawa ,  Kohei Takeda

IPC分类号： C09J163/00

CPC分类号： H01L24/83 ,  C08G59/226 ,  C08G59/38 ,  C08L63/00 ,  C08L2666/22 ,  C09J163/00 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/83136 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention has its object to provide an adhesive for bonding electronic components with a constant distance between them, which makes it possible to maintain a distance between bonded electronic components at high accuracy and to provide a highly reliable electronic apparatus, and which can be stably and continuously applied with a jet dispenser. The present invention is an adhesive for bonding electronic components, including spacer particles, an epoxy compound (A), and a curing agent. The spacer particles have a CV value of 10% or less. The epoxy compound (A) has a molecular structure including 10 or less monomer units with an aromatic ring in each repeating unit, is in a state of crystalline solid at 25° C., and has a viscosity of 1 Pa·s or less measured by an E-type viscometer at a temperature of 50 to 80° C.

摘要翻译： 本发明的目的是提供一种用于将它们之间具有恒定距离的电子部件接合的粘合剂，这使得可以以高精度保持接合的电子部件之间的距离并提供高可靠性的电子设备，并且其可以是稳定的 并连续地使用喷射器。 本发明是用于粘合电子部件的粘合剂，包括间隔剂颗粒，环氧化合物（A）和固化剂。 间隔物颗粒的CV值为10％以下。 环氧化合物（A）在每个重复单元中具有包含10个或更少个具有芳环的单体单元的分子结构，在25℃下处于结晶固体的状态，并且具有1Pa·s以下的粘度 通过E型粘度计在50〜80℃的温度下进行。

公开(公告)号：US20090311827A1

公开(公告)日：2009-12-17

申请号：US12309324

申请日：2007-07-19

申请人： Hideaki Ishizawa ,  Akinobu Hayakawa

发明人： Hideaki Ishizawa ,  Akinobu Hayakawa

IPC分类号： H01L21/50 ,  C09J163/02 ,  C09J163/00

CPC分类号： C09J11/04 ,  C08G59/42 ,  C08L63/00 ,  C09J11/08 ,  C09J163/00 ,  C09J2203/326 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/26135 ,  H01L2224/26165 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83138 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199

摘要： It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts.The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25° C. by using an E type viscometer, and a viscosity at 0.5 rpm being 1.4 to 3 times as large as the viscosity at 1 rpm, and the viscosity at 1 rpm being 2 to 5 times as large as the viscosity at 10 rpm.

摘要翻译： 本发明的目的是提供：一种用于电子部件的粘合剂，其可以在连接诸如两个或更多个半导体芯片的电子部件之后准确地保持电子部件之间的距离，并且还获得可靠的电子部件，例如半导体 设备; 一种使用电子部件用粘合剂制造半导体芯片层叠体的方法; 以及使用电子部件用粘合剂的半导体装置。 本发明是一种用于连接电子部件的电子部件的粘合剂，其包含：包含固化化合物和固化剂的粘合剂组合物; CV值为10％以下的间隔物颗粒，在25℃，25℃下测定时，1rpm下的粘度为200Pa·s以下，10rpm下的粘度为100Pa·s以下。 E型粘度计，0.5rpm时的粘度为1rpm时的粘度的1.4〜3倍，1rpm的粘度为10rpm时的粘度的2〜5倍。

公开(公告)号：US07915743B2

公开(公告)日：2011-03-29

申请号：US12309324

申请日：2007-07-19

申请人： Hideaki Ishizawa ,  Akinobu Hayakawa

发明人： Hideaki Ishizawa ,  Akinobu Hayakawa

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/00

CPC分类号： C09J11/04 ,  C08G59/42 ,  C08L63/00 ,  C09J11/08 ,  C09J163/00 ,  C09J2203/326 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/26135 ,  H01L2224/26165 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83138 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199

摘要： It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts.The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25° C. by using an E type viscometer, and a viscosity at 0.5 rpm being 1.4 to 3 times as large as the viscosity at 1 rpm, and the viscosity at 1 rpm being 2 to 5 times as large as the viscosity at 10 rpm.

摘要翻译： 本发明的目的是提供：一种用于电子部件的粘合剂，其可以在连接诸如两个或更多个半导体芯片的电子部件之后准确地保持电子部件之间的距离，并且还获得可靠的电子部件，例如半导体 设备; 一种使用电子部件用粘合剂制造半导体芯片层叠体的方法; 以及使用电子部件用粘合剂的半导体装置。 本发明是一种用于连接电子部件的电子部件的粘合剂，其包含：包含固化化合物和固化剂的粘合剂组合物; CV值为10％以下，1rpm时的粘度为200Pa·s以下，10rpm下的粘度为100Pa·s以下的间隔物颗粒，在25℃下使用 E型粘度计，0.5rpm时的粘度为1rpm时的粘度的1.4〜3倍，1rpm的粘度为10rpm时的粘度的2〜5倍。

公开(公告)号：US20130237018A1

公开(公告)日：2013-09-12

申请号：US13883641

申请日：2012-03-08

申请人： Carl Alvin Dilao ,  Akinobu Hayakawa ,  Shujiro Sadanaga ,  Munehiro Hatai

发明人： Carl Alvin Dilao ,  Akinobu Hayakawa ,  Shujiro Sadanaga ,  Munehiro Hatai

IPC分类号： H01L23/00

CPC分类号： H01L24/26 ,  C08K9/04 ,  C08K9/06 ,  C09J11/04 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/13099

摘要： An object of the present invention is to provide an adhesive for electronic components that allows suppression of occurrence of voids and is prevented from wicking up to an upper surface of a semiconductor chip. Another object of the present invention is to provide a production method for a semiconductor chip mount using the adhesive for electronic components. The present invention is an adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in FIG. 1 wherein a viscosity at 5 rpm measured at 25° C. using an E type viscometer is A1 (Pa·s) and a viscosity at 0.5 rpm measured at 25° C. using an E type viscometer is A2 (Pa·s), the range including values on the solid lines but not including values on the dashed line, and a blending amount of the curing agent is 5 to 150 parts by weight and a blending amount of the inorganic filler is 60 to 400 parts by weight based on 100 parts by weight of the curable compound.

摘要翻译： 本发明的目的是提供一种用于电子部件的粘合剂，其能够抑制空隙的发生，并且防止了向半导体芯片的上表面的排水。 本发明的另一个目的是提供一种使用电子部件用粘合剂的半导体芯片安装件的制造方法。 本发明是一种电子部件用粘合剂，其包含固化性化合物，固化剂和无机填料，其中，A1和A2 / A1落在由实线和虚线围绕的范围内。 1其中使用E型粘度计在25℃下测定的5rpm下的粘度为A1（Pa·s），使用E型粘度计在25℃下测定的0.5rpm下的粘度为A2（Pa·s） 实线上的值但不包括虚线值的范围和固化剂的配合量为5〜150重量份，无机填料的配合量为100〜100重量份，基于100 重量份的可固化化合物。