公开(公告)号：US07161273B2

公开(公告)日：2007-01-09

申请号：US10287355

申请日：2002-11-04

申请人： Akira Akiba ,  Keisuke Uno ,  Masao Jojima ,  Tomonori Seki ,  Koji Sano

发明人： Akira Akiba ,  Keisuke Uno ,  Masao Jojima ,  Tomonori Seki ,  Koji Sano

IPC分类号： H02N1/00

CPC分类号： H01H59/0009 ,  H01H2001/0084 ,  H01H2059/0018 ,  H01H2059/0072

摘要： A fixed voltage and a movable electrode are placed face to face with each other, and an insulating film is formed on the surface of the fixed electrode. The insulating film is made of a nitride film (SiN) as a main material, with oxide films (SiO2) being formed on the front and rear surfaces of the nitride film. Moreover, a plurality of protrusions are formed on an area facing the movable electrode of the upper face of the insulating film. The charge quantity in the insulating film is mainly determined by a film thickness of the oxide film, and the nitride film is used for maintaining a sufficient film thickness required for the voltage proof characteristic. Thereby, it is possible to suppress variations in operational voltage characteristics such as on-voltage and off-voltage in an electrostatic actuator so as to prevent phenomena in which the electrostatic actuator fails to turn on even when a rated voltage is applied to the electrostatic actuator and in which the electrostatic actuator fails to turn off even when the driving voltage is turned off.

摘要翻译： 固定电压和可动电极彼此面对地放置，并且在固定电极的表面上形成绝缘膜。 绝缘膜由氮化物膜（SiN）作为主要材料制成，在氮化膜的正面和背面形成有氧化物膜（SiO 2/2）。 此外，在与绝缘膜的上表面的可动电极相对的区域上形成多个突起。 绝缘膜中的电荷量主要由氧化膜的膜厚确定，并且氮化膜用于保持耐电压特性所需的足够的膜厚度。 由此，可以抑制静电致动器中的导通电压和截止电压等工作电压特性的变化，从而防止静电致动器即使向静电致动器施加额定电压也不能接通的现象 并且即使当驱动电压关闭时静电致动器也不能关闭。

公开(公告)号：US07489223B2

公开(公告)日：2009-02-10

申请号：US11957465

申请日：2007-12-16

申请人： Takeshi Yokoyama ,  Yoshikiyo Usui ,  Tomonori Seki

发明人： Takeshi Yokoyama ,  Yoshikiyo Usui ,  Tomonori Seki

IPC分类号： H01F5/00

CPC分类号： H01F17/0033 ,  H01F1/342 ,  H01F27/292 ,  H01F41/046 ,  H01F2017/002 ,  Y10T29/4902

摘要： An inductor and a method of manufacture results in external electrodes that prevent generation of flashes. The inductor has a ferrite substrate, external electrodes, and a coil. The cross-sectional area of the external electrodes extending across the cutting line is reduced to suppress generation of flashes during the cutting process. Pairs of through-holes are formed at positions in line symmetry about the cutting line. A connection conductor is formed in each of the through-holes, and the external electrodes are formed on the front and back surfaces of the substrate, with the connection conductor connecting each of the pairs of external electrodes on the front and back surfaces. Through-holes can be oblong holes extending across the cutting line, and the external electrodes can extend away from the cutting line.

摘要翻译： 电感器和制造方法导致防止产生闪光的外部电极。 电感器具有铁氧体衬底，外部电极和线圈。 减少延伸穿过切割线的外部电极的横截面积，以抑制在切割过程中产生闪光。 成对的通孔形成在与切割线对称的位置处。 在每个通孔中形成连接导体，并且在基板的前表面和后表面上形成外部电极，其中连接导体在前表面和后表面上连接两对外部电极。 通孔可以是穿过切割线延伸的长孔，并且外部电极可以远离切割线延伸。

公开(公告)号：US06734513B2

公开(公告)日：2004-05-11

申请号：US09999250

申请日：2001-11-01

申请人： Tomonori Seki ,  Tomonari Kogure

发明人： Tomonori Seki ,  Tomonari Kogure

IPC分类号： H01L4300

CPC分类号： B81C1/00269 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： In one embodiment, a semiconductor device having single or multi-layer intermediate layers that easily adhere to a glass frit and lead lines of respective interconnections is disclosed. In general, the single or multi-layer intermediate layers are formed on at least the top surfaces of portions of the respective lead lines on which the glass frit is placed.

摘要翻译： 在一个实施例中，公开了一种半导体器件，其具有易于粘附到玻璃料的单层或多层中间层以及相应互连的引线。 通常，单层或多层中间层形成在其上放置玻璃料的相应导线的部分的至少顶表面上。

公开(公告)号：US06603238B2

公开(公告)日：2003-08-05

申请号：US10128542

申请日：2002-04-24

申请人： Minoru Sakata ,  Takuya Nakajima ,  Tomonori Seki ,  Teruhiko Fujiwara ,  Masashi Takeuchi

发明人： Minoru Sakata ,  Takuya Nakajima ,  Tomonori Seki ,  Teruhiko Fujiwara ,  Masashi Takeuchi

IPC分类号： H01L3700

CPC分类号： H01H1/0036 ,  B81B7/0077 ,  B81B2201/016 ,  B81B2207/095 ,  B81C2203/0118 ,  H01H1/20 ,  H01H9/52 ,  H01H57/00 ,  H01H59/0009 ,  H01H61/02 ,  H01H67/22 ,  H01H2001/0042 ,  H01H2001/0084 ,  H01H2057/006 ,  H01H2061/006

摘要： A thin plate-shaped substrate 21 comprised of a monocrystal is provided with a piezoelectric element 24, and both ends of a movable piece 20 whose one surface is provided with a movable contact 25 are fixed and supported to a base 11. Then, by curving the movable piece 20 via the piezoelectric element 24, the movable contact 25 is brought in and out of contact with a pair of fixed contacts 38 and 39 that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.

公开(公告)号：US10125237B2

公开(公告)日：2018-11-13

申请号：US12993307

申请日：2009-05-22

申请人： Noriji Tashiro ,  Michiaki Yajima ,  Tomonori Seki ,  Atsushi Fujita ,  Tooru Yoshikawa ,  Rei Yamamoto

发明人： Noriji Tashiro ,  Michiaki Yajima ,  Tomonori Seki ,  Atsushi Fujita ,  Tooru Yoshikawa ,  Rei Yamamoto

IPC分类号： F28F7/00 ,  C08K3/04 ,  C08L21/00 ,  C08L33/08 ,  H01L23/373 ,  C08K5/00 ,  C08K5/521 ,  C08L13/00 ,  C08L15/00 ,  C08K3/016

摘要： A heat radiation sheet having high heat-radiation property and excellent handleability and having sheet properties permitting the sheet to cope with changes in use temperature thereof. Also provided is a heat radiation device using the sheet. The heat radiation sheet comprises: a binder component comprising: (A) a thermoplastic rubber component; (B) a thermosetting rubber component; and (C) a thermosetting rubber curing agent crosslinkable with the thermosetting rubber component (B); and an anisotropic graphite powder oriented into a specified direction in the binder component.

公开(公告)号：US07629668B2

公开(公告)日：2009-12-08

申请号：US12078323

申请日：2008-03-28

申请人： Jun Yabuzaki ,  Takeshi Yokoyama ,  Tomonori Seki

发明人： Jun Yabuzaki ,  Takeshi Yokoyama ,  Tomonori Seki

IPC分类号： H01L29/00

CPC分类号： H01L23/50 ,  H01G4/228 ,  H01G4/306 ,  H01G4/40 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/016 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The electrode of a thin-type capacitor is connected to the rear surface of a p-type semiconductor substrate which is brought to a ground potential, by a conductive DAF (Die Attach Film) or by a conductive adhesive, and the electrodes of the front surface of the p-type semiconductor substrate are respectively connected with and stacked on the terminals of a thin-type inductor by bumps, whereby manufacturing costs can be reduced while the occurrence of noise can be suppressed and packaging area can be made small.

摘要翻译： 薄型电容器的电极通过导电DAF（Die Attach Film）或导电粘合剂连接到被引导到地电位的p型半导体衬底的背面，并且前面的电极 p型半导体基板的表面通过凸块分别与薄型电感器的端子连接并堆叠在一起，从而可以降低制造成本，同时可以抑制噪声的发生，并且可以使封装面积小。

公开(公告)号：US20080237790A1

公开(公告)日：2008-10-02

申请号：US12078323

申请日：2008-03-28

申请人： Jun Yabuzaki ,  Takeshi Yokoyama ,  Tomonori Seki

发明人： Jun Yabuzaki ,  Takeshi Yokoyama ,  Tomonori Seki

IPC分类号： H01L29/86

CPC分类号： H01L23/50 ,  H01G4/228 ,  H01G4/306 ,  H01G4/40 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/016 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The electrode of a thin-type capacitor is connected to the rear surface of a p-type semiconductor substrate which is brought to a ground potential, by a conductive DAF (Die Attach Film) or by a conductive adhesive, and the electrodes of the front surface of the p-type semiconductor substrate are respectively connected with and stacked on the terminals of a thin-type inductor by bumps, whereby manufacturing costs can be reduced while the occurrence of noise can be suppressed and packaging area can be made small.

摘要翻译： 薄型电容器的电极通过导电DAF（Die Attach Film）或导电粘合剂连接到被引导到地电位的p型半导体衬底的背面，并且前面的电极 p型半导体基板的表面通过凸块分别与薄型电感器的端子连接并堆叠在一起，从而可以降低制造成本，同时可以抑制噪声的发生，并且可以使封装面积小。

公开(公告)号：US06794078B1

公开(公告)日：2004-09-21

申请号：US10148799

申请日：2002-06-05

申请人： Noriji Tashiro ,  Atsushi Fujita ,  Tomonori Seki ,  Harufumi Hasuda

发明人： Noriji Tashiro ,  Atsushi Fujita ,  Tomonori Seki ,  Harufumi Hasuda

IPC分类号： H01M802

CPC分类号： H01M8/0226 ,  H01M8/0213 ,  H01M8/0221 ,  H01M8/026 ,  H01M2008/1095 ,  Y02P70/56 ,  Y10T29/49108 ,  Y10T442/2426

摘要： A fuel-cell separator comprising a resin and an electric conductor dispersed in the resin is produced by thermally molding a mixture comprising the electric conductor and the resin.

摘要翻译： 通过将包含导电体和树脂的混合物热成型来制造包含分散在树脂中的树脂和电导体的燃料电池分离器。

公开(公告)号：US06407482B2

公开(公告)日：2002-06-18

申请号：US09254030

申请日：1999-02-26

申请人： Minoru Sakata ,  Takuya Nakajima ,  Tomonori Seki ,  Teruhiko Fujiwara

发明人： Minoru Sakata ,  Takuya Nakajima ,  Tomonori Seki ,  Teruhiko Fujiwara

IPC分类号： H01L4108

CPC分类号： H01H1/0036 ,  B81B7/0077 ,  B81B2201/016 ,  B81B2207/095 ,  B81C2203/0118 ,  H01H1/20 ,  H01H9/52 ,  H01H57/00 ,  H01H59/0009 ,  H01H61/02 ,  H01H67/22 ,  H01H2001/0042 ,  H01H2001/0084 ,  H01H2057/006 ,  H01H2061/006

摘要： A thin plate-shaped substrate 21 comprised of a monocrystal is provided with a piezoelectric element 24, and both ends of a movable piece 20 whose one surface is provided with a movable contact 25 are fixed and supported to a base 11. Then, by curving the movable piece 20 via the piezoelectric element 24, the movable contact 25 is brought in and out of contact with a pair of fixed contacts 38 and 39 that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.

摘要翻译： 由单晶构成的薄板状基板21设置有压电元件24，并且其一个表面设置有可动触点25的可动件20的两端固定并支撑在基座11上。然后，通过弯曲 经由压电元件24的可动片20与可动触点对置的一对固定触点38,39接触而脱离接触。 通过这种布置，可以获得具有机械接触机构的小型微型继电器，其具有接通触点的小电阻和期望的振动阻抗，频率特性和绝缘性能。

公开(公告)号：US20140202838A1

公开(公告)日：2014-07-24

申请号：US14236639

申请日：2012-07-18

申请人： Akihiko Sano ,  Takeshi Fujiwara ,  Hidenori Maruyama ,  Tomonori Seki

发明人： Akihiko Sano ,  Takeshi Fujiwara ,  Hidenori Maruyama ,  Tomonori Seki

IPC分类号： H01H59/00

CPC分类号： H01H59/0009 ,  B81B2201/018 ,  B81B2207/012 ,  B81B2207/095 ,  B81C1/00238 ,  B81C2203/035 ,  H01H2001/0078

摘要： An electronic component has a first member in which an electrostatic actuator is provided, a second member in which a drive integrated circuit for driving the electrostatic actuator is provided, and join parts that joins the first member and the second member while a surface on which the electrostatic actuator is provided in the first member and a surface on which the drive integrated circuit is provided in the second member are opposed to each other. The electrostatic actuator and the drive integrated circuit are disposed in a space surrounded by the first member, the second member, and the join parts.

摘要翻译： 电子部件具有设置有静电致动器的第一部件，设置有用于驱动静电致动器的驱动集成电路的第二部件和与第一部件和第二部件连接的接合部， 静电致动器设置在第一构件中，并且在第二构件中设置有驱动集成电路的表面彼此相对。 静电致动器和驱动集成电路设置在由第一构件，第二构件和接合部包围的空间中。