公开(公告)号：US5604330A

公开(公告)日：1997-02-18

申请号：US366250

申请日：1994-12-29

申请人： Altaf Hasan ,  J. D. Wilson ,  Siva Natarajan

发明人： Altaf Hasan ,  J. D. Wilson ,  Siva Natarajan

IPC分类号： H01L23/498 ,  H05K3/36 ,  H01L23/02 ,  H01R9/00

CPC分类号： H05K3/363 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K2201/0394 ,  H05K2201/09709 ,  H05K2201/10681

摘要： A package for a semiconductor device. The device is packaged using tape-automated bonding (TAB) to bond an integrated circuit chip to a package substrate of any type. The land pads on the substrate are staggered such that they are arranged in two rows with adjacent pads alternating. In this way, the effective overall pitch of the land pads is smaller than that of each row.

摘要翻译： 用于半导体器件的封装。 该装置使用带自动键合（TAB）封装，以将集成电路芯片连接到任何类型的封装衬底。 衬底上的焊盘交错，使得它们被布置成两排，其中相邻焊盘交替。 以这种方式，焊盘的有效整体间距小于每行的有效整体间距。

公开(公告)号：US5646441A

公开(公告)日：1997-07-08

申请号：US631600

申请日：1996-04-18

申请人： Altaf Hasan ,  J. D. Wilson ,  Tor Kalleberg

发明人： Altaf Hasan ,  J. D. Wilson ,  Tor Kalleberg

IPC分类号： H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H01L23/495

CPC分类号： H01L23/4985 ,  H01L2224/05554 ,  H01L2224/49175 ,  H01L2924/09701 ,  H05K1/118 ,  H05K3/361

摘要： An integrated circuit package which has a plurality of inner surface pads located on a substrate and arranged in an angular pattern about an integrated circuit. The inner surface pads of the package are coupled to the outer surface pads of the integrated circuit with a TAB tape. The TAB tape has a plurality of conductors which each have a first end attached to the outer pads of the integrated circuit and a land portion attached to the inner surface pads of the substrate. The land portions of the tape are also arranged in an angular pattern about the integrated circuit.

摘要翻译： 一种集成电路封装，其具有位于基板上的多个内表面焊盘，并且围绕集成电路以角度图案布置。 封装的内表面焊盘用TAB带耦合到集成电路的外表面焊盘。 TAB带具有多个导体，每个导体具有连接到集成电路的外部焊盘的第一端和附接到衬底的内表面焊盘的焊盘部分。 磁带的接地部分也围绕集成电路以角度图案布置。

公开(公告)号：US20050266607A1

公开(公告)日：2005-12-01

申请号：US10856371

申请日：2004-05-27

申请人： Michael Lee ,  Mun Loke ,  Soon Ong ,  Hooi Teng ,  Lisa Hui Lee ,  Altaf Hasan

发明人： Michael Lee ,  Mun Loke ,  Soon Ong ,  Hooi Teng ,  Lisa Hui Lee ,  Altaf Hasan

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/60 ,  H01L21/673

CPC分类号： H01L21/563 ,  H01L21/50 ,  H01L21/6735 ,  H01L23/04 ,  H01L23/055 ,  H01L23/562 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.

摘要翻译： 一种包装方法包括在加工过程中将限制器放置在包装上。 该方法包括将限制器固定就位，然后将包装暴露于高温。 处理后，限制器被移除。 替代方法将组件模具附接到在第一表面中具有腔的衬底。 然后，该方法可以包括在空腔中分配和固化底部填充材料，以及将盖附接到基底的第一表面。

公开(公告)号：US20070205501A1

公开(公告)日：2007-09-06

申请号：US11687759

申请日：2007-03-19

申请人： Michael Lee ,  Mun Leong Loke ,  Soon Chuan Ong ,  Hooi Jin Teng ,  Lisa Lee ,  Altaf Hasan

发明人： Michael Lee ,  Mun Leong Loke ,  Soon Chuan Ong ,  Hooi Jin Teng ,  Lisa Lee ,  Altaf Hasan

IPC分类号： H01L23/12

CPC分类号： H01L21/563 ,  H01L21/50 ,  H01L21/6735 ,  H01L23/04 ,  H01L23/055 ,  H01L23/562 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.

摘要翻译： 一种包装方法包括在加工过程中将限制器放置在包装上。 该方法包括将限制器固定就位，然后将包装暴露于高温。 处理后，限制器被移除。 替代方法将组件模具附接到在第一表面中具有腔的衬底。 然后，该方法可以包括在空腔中分配和固化底部填充材料，以及将盖附接到基底的第一表面。

公开(公告)号：US20070155059A1

公开(公告)日：2007-07-05

申请号：US11687154

申请日：2007-03-16

申请人： Michael Lee ,  Mun Loke ,  Soon Ong ,  Hooi Teng ,  Lisa Lee ,  Altaf Hasan

发明人： Michael Lee ,  Mun Loke ,  Soon Ong ,  Hooi Teng ,  Lisa Lee ,  Altaf Hasan

IPC分类号： H01L21/00 ,  H01L23/12

CPC分类号： H01L21/563 ,  H01L21/50 ,  H01L21/6735 ,  H01L23/04 ,  H01L23/055 ,  H01L23/562 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.

公开(公告)号：US07208342B2

公开(公告)日：2007-04-24

申请号：US10856371

申请日：2004-05-27

申请人： Michael Keat Lye Lee ,  Mun Leong Loke ,  Soon Chuan Ong ,  Hooi Jin Teng ,  Lisa Yung Hui Lee ,  Altaf Hasan

发明人： Michael Keat Lye Lee ,  Mun Leong Loke ,  Soon Chuan Ong ,  Hooi Jin Teng ,  Lisa Yung Hui Lee ,  Altaf Hasan

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/12 ,  H01L23/40

CPC分类号： H01L21/563 ,  H01L21/50 ,  H01L21/6735 ,  H01L23/04 ,  H01L23/055 ,  H01L23/562 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.

摘要翻译： 一种包装方法包括在加工过程中将限制器放置在包装上。 该方法包括将限制器固定就位，然后将包装暴露于高温。 处理后，限制器被移除。 替代方法将组件模具附接到在第一表面中具有腔的衬底。 然后，该方法可以包括在空腔中分配和固化底部填充材料，以及将盖附接到基底的第一表面。