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    HIGH DENSITY, HIGH SPEED ELECTRICAL CONNECTOR
    1.
    发明公开
    HIGH DENSITY, HIGH SPEED ELECTRICAL CONNECTOR 审中-公开

    公开(公告)号：US20240097360A1

    公开(公告)日：2024-03-21

    申请号：US18339708

    申请日：2023-06-22

    申请人： Amphenol Corporation

    发明人： Marc B. Cartier, JR. ,  John Robert Dunham ,  Mark W. Gailus ,  John Pitten

    IPC分类号： H01R9/24 ,  H01R13/6585

    CPC分类号： H01R9/24 ,  H01R13/6585

    摘要： A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.

    MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
    2.
    发明申请
    MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR 有权

    公开(公告)号：US20230113153A1

    公开(公告)日：2023-04-13

    申请号：US18079956

    申请日：2022-12-13

    申请人： Amphenol Corporation

    发明人： Mark W. Gailus ,  Marc B. Cartier, JR. ,  Vysakh Sivarajan ,  David Levine

    IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H01R43/20

    摘要： A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE
    3.
    发明申请
    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE 有权

    公开(公告)号：US20210257788A1

    公开(公告)日：2021-08-19

    申请号：US17159855

    申请日：2021-01-27

    申请人： Amphenol Corporation

    发明人： Marc B. Cartier, JR. ,  John Robert Dunham ,  Mark W. Gailus ,  David Levine ,  Allan Astbury ,  Vysakh Sivarajan ,  Daniel B. Provencher ,  Eric Leo

    IPC分类号： H01R13/6587 ,  H01R13/6471 ,  H01R12/71 ,  H01R12/51

    摘要： An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

    ELECTRICAL INTERCONNECTION SYSTEM
    8.
    发明申请
    ELECTRICAL INTERCONNECTION SYSTEM 审中-公开

    公开(公告)号：US20200350718A1

    公开(公告)日：2020-11-05

    申请号：US16933936

    申请日：2020-07-20

    申请人： Amphenol Corporation

    发明人： Tom Pitten ,  Mark W. Gailus ,  Marc B. Cartier, JR. ,  David Levine ,  Donald A. Girard

    IPC分类号： H01R13/03 ,  H01R13/05 ,  H01R13/42 ,  H01R13/646

    摘要： Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.