公开(公告)号：US07709371B2

公开(公告)日：2010-05-04

申请号：US10940682

申请日：2004-09-15

申请人： Anil S. Bhanap ,  Teresa A. Ramos ,  Nancy Iwamoto ,  Roger Y. Leung ,  Ananth Naman

发明人： Anil S. Bhanap ,  Teresa A. Ramos ,  Nancy Iwamoto ,  Roger Y. Leung ,  Ananth Naman

IPC分类号： H01L21/4763 ,  H01L21/302 ,  H01L21/31

CPC分类号： H01L21/31058 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/76801

摘要： A method for restoring hydrophobicity to the surfaces of organosilicate glass dielectric films which have been subjected to an etchant or ashing treatment. These films are used as insulating materials in the manufacture of integrated circuits to ensure low and stable dielectric properties in these films. The method deters the formation of stress-induced voids in these films. An organosilicate glass dielectric film is patterned to form vias and trenches by subjecting it to an etchant or ashing reagent in such a way as to remove at least a portion of previously existing carbon containing moieties and reduce hydrophobicity of said organosilicate glass dielectric film. The vias and trenches are thereafter filled with a metal and subjected to an annealing treatment. After the film is subjected to the etchant or ashing reagent, but before being subjected to an annealing treatment, the film is contacted with a toughening agent composition to restore some of the carbon containing moieties and increase the hydrophobicity of the organosilicate glass dielectric film.

摘要翻译： 用于恢复已进行蚀刻剂或灰化处理的有机硅酸盐玻璃介电膜表面的疏水性的方法。 这些膜在集成电路的制造中用作绝缘材料，以确保这些膜中的低和稳定的介电性能。 该方法阻止了这些膜中应力诱发的空隙的形成。 通过使有机硅酸盐玻璃电介质膜经受蚀刻剂或灰化试剂以形成通孔和沟槽，以除去至少一部分先前存在的含碳部分并降低所述有机硅酸盐玻璃电介质膜的疏水性。 之后通过通孔和沟槽填充金属并进行退火处理。 在将薄膜进行蚀刻剂或灰化试剂之后，但在进行退火处理之前，使薄膜与增韧剂组合物接触以还原一些含碳部分并增加有机硅酸盐玻璃电介质薄膜的疏水性。

公开(公告)号：US08475666B2

公开(公告)日：2013-07-02

申请号：US10940686

申请日：2004-09-15

申请人： Teresa A. Ramos ,  Robert R. Roth ,  Anil S. Bhanap ,  Paul G. Apen ,  Denis H. Endisch ,  Brian J. Daniels ,  Ananth Naman ,  Nancy Iwamoto ,  Roger Y. Leung

发明人： Teresa A. Ramos ,  Robert R. Roth ,  Anil S. Bhanap ,  Paul G. Apen ,  Denis H. Endisch ,  Brian J. Daniels ,  Ananth Naman ,  Nancy Iwamoto ,  Roger Y. Leung

IPC分类号： H01L21/30

CPC分类号： H01L21/02216 ,  H01L21/02126 ,  H01L21/316 ,  H01L21/31695 ,  H01L21/76814 ,  H01L21/76826

摘要： A toughening agent composition for increasing the hydrophobicity of an organosilicate glass dielectric film when applied to said film. It includes a component capable of alkylating or arylating silanol moieties of the organosilicate glass dielectric film via silylation, and an activating agent selected from the group consisting of an amine, an onium compound and an alkali metal hydroxide.

摘要翻译： 一种增韧剂组合物，用于在施加到所述膜时增加有机硅酸盐玻璃介电膜的疏水性。 它包括能够通过甲硅烷基化将有机硅酸盐玻璃介电膜的硅烷醇部分烷基化或芳基化的组分和选自胺，鎓化合物和碱金属氢氧化物的活化剂。

公开(公告)号：US20090026924A1

公开(公告)日：2009-01-29

申请号：US11931088

申请日：2007-10-31

申请人： Roger Y. Leung ,  De-Ling Zhou ,  Wenya Fan ,  Peter A. Smith ,  Paul G. Apen ,  Brian J. Daniels ,  Ananth Naman ,  Teresa A. Ramos ,  Robert R. Roth

发明人： Roger Y. Leung ,  De-Ling Zhou ,  Wenya Fan ,  Peter A. Smith ,  Paul G. Apen ,  Brian J. Daniels ,  Ananth Naman ,  Teresa A. Ramos ,  Robert R. Roth

IPC分类号： H01L51/54 ,  H01L33/00 ,  B32B3/26 ,  B05D5/06 ,  H01L27/15

CPC分类号： C09D183/02 ,  H01L51/5262 ,  Y10T428/249953

摘要： A method for forming a substantially transparent nanoporous organosilicate film on a substantially transparent substrate, for use in optical lighting devices such as organic light emitting diodes (OLEDs). The method includes first preparing a composition comprising a silicon containing pre-polymer, a porogen, and a catalyst. The composition is coated onto a substrate which is substantially transparent to visible light, forming a film thereon. The film is then gelled by crosslinking and cured by heating, such that the resulting cured film is substantially transparent to visible light. It is preferred that both the substrate and the nanoporous film are at least 98% transparent to visible light. Optical devices which include the resulting structures of this invention exhibit improved light extraction and illuminance where the nanoporous organosilicate film has a low refractive index in the range of 1.05 to 1.4, serving as an impedance matching layer in such devices.

摘要翻译： 一种在基本上透明的基底上形成基本透明的纳米多孔有机硅酸盐膜的方法，用于诸如有机发光二极管（OLED）的光学照明装置中。 该方法包括首先制备包含含硅预聚物，致孔剂和催化剂的组合物。 将组合物涂布在对可见光基本透明的基底上，在其上形成膜。 然后通过交联使膜凝胶化并通过加热固化，使得所得固化膜对可见光基本上是透明的。 优选的是，衬底和纳米多孔膜对可见光透明至少98％。 包括本发明所得结构的光学器件表现出改进的光提取和照度，其中纳米多孔有机硅酸盐膜具有在1.05至1.4范围内的低折射率，用作这种器件中的阻抗匹配层。

公开(公告)号：US07915159B2

公开(公告)日：2011-03-29

申请号：US11203558

申请日：2005-08-12

申请人： Anil S. Bhanap ,  Boris A. Korolev ,  Roger Y. Leung ,  Beth C. Munoz

发明人： Anil S. Bhanap ,  Boris A. Korolev ,  Roger Y. Leung ,  Beth C. Munoz

IPC分类号： H01L21/4763 ,  C08J5/12 ,  C04B28/36 ,  C04B28/26 ,  C09D7/00

CPC分类号： H01L21/02216 ,  H01L21/02126 ,  H01L21/316 ,  H01L21/31695 ,  H01L21/76814 ,  H01L21/76826

摘要： A treating agent composition for increasing the hydrophobicity of an organosilicate glass dielectric film when applied to said film. It includes a component capable of alkylating or arylating silanol moieties of the organosilicate glass dielectric film via silylation, and an activating agent which may be an acid, a base, an onium compound, a dehydrating agent, and combinations thereof, and a solvent or mixture of a main solvent and a co-solvent.

摘要翻译： 一种用于在施加到所述膜上时增加有机硅酸盐玻璃介电膜的疏水性的处理剂组合物。 它包括能够通过甲硅烷基化将有机硅酸盐玻璃介电膜的硅烷醇部分烷基化或芳基化的组分，以及可以是酸，碱，鎓化合物，脱水剂及其组合的活化剂和溶剂或混合物 的主要溶剂和共溶剂。

公开(公告)号：US07011889B2

公开(公告)日：2006-03-14

申请号：US10078919

申请日：2002-02-19

申请人： William B. Bedwell ,  Nigel P. Hacker ,  Roger Y. Leung ,  Nancy Iwamoto ,  Jan Nedbal ,  Songyuan Xie ,  Lorenza Moro ,  Shyama P. Mukherjee

发明人： William B. Bedwell ,  Nigel P. Hacker ,  Roger Y. Leung ,  Nancy Iwamoto ,  Jan Nedbal ,  Songyuan Xie ,  Lorenza Moro ,  Shyama P. Mukherjee

IPC分类号： B32B9/04

CPC分类号： C08G77/04 ,  C08G77/12 ,  G03F7/0751 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3121 ,  H01L21/3122 ,  H01L21/76807 ,  H01L21/76829 ,  H01L21/76835 ,  Y10T428/265 ,  Y10T428/31663

摘要： The present invention provides an organosiloxane comprising at least 80 weight percent of Formula I: [Y0.01-1.0SiO1.5-2]a[Z0.01-1.0SiO1.5-2]b[H0.01-1.0SiO1.5-2]c where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula I; b is from 2 percent to 50 percent of Formula I; and c is from 20 percent to 80 percent of Formula I. The present composition is useful in semiconductor devices and may be advantageously used as an etch stop.

摘要翻译： 本发明提供了包含至少80重量％的式I的有机硅氧烷：[Y 0.01-1.0 SiO 2 1.5-2] 0.01-1.0 SiO <1.5-2 其中Y是芳基; Z是烯基; a是一级方程式的15％至70％; b是式I的2％至50％; 并且c为式I的20％至80％。本发明的组合物可用于半导体器件，并且可有利地用作蚀刻停止层。