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    Detector assembly thermal management system and method
    1.
    发明授权
    Detector assembly thermal management system and method 失效
    检测器总成热管理系统及方法

    公开(公告)号：US07062008B2

    公开(公告)日：2006-06-13

    申请号：US10610163

    申请日：2003-06-30

    申请人： Ashutosh Joshi ,  William Edward Burdick, Jr. ,  Sandeep Shrikant Tonapi ,  Joseph Lacey

    发明人： Ashutosh Joshi ,  William Edward Burdick, Jr. ,  Sandeep Shrikant Tonapi ,  Joseph Lacey

    IPC分类号： G01T1/00

    CPC分类号： A61B6/035 ,  A61B6/4488

    摘要： A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object. A detector array comprises a plurality of detector assemblies. A gantry secured to the X-ray radiation source and the detector array rotates around a longitudinal axis. Further, each of the detector assembly comprises a detector subassembly adapted to detect the X-ray beams. These detector subassemblies are further adapted to convert the X-ray beams to a plurality of electrical signals. At least one circuit board assembly is coupled to the detector subassembly. The circuit board assembly typically comprises an integrated circuit array, such as, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array further comprises a plurality of integrated circuit chips, for example, data acquisition chips mounted on at least one printed circuit board. A thermal management system is adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control the thermal environment of each detector assembly. A processor is typically configured to process the electrical signals to generate a plurality of projection measurements. The processor is further adapted to perform computations on the projection measurements to construct an image of the object therefrom.

    摘要翻译： 计算机断层摄影（CT）系统包括通过物体投影多个X射线束的X射线辐射源。 检测器阵列包括多个检测器组件。 固定到X射线辐射源的台架和检测器阵列围绕纵向轴线旋转。 此外，每个检测器组件包括适于检测X射线束的检测器子组件。 这些检测器子组件还适于将X射线束转换成多个电信号。 至少一个电路板组件耦合到检测器子组件。 电路板组件通常包括集成电路阵列，例如数据采集芯片阵列，以获取对应于电信号的数据。 集成电路阵列还包括多个集成电路芯片，例如安装在至少一个印刷电路板上的数据采集芯片。 热管理系统适用于数据采集芯片阵列与散热器组件之间的热通信，以控制每个探测器组件的热环境。 处理器通常被配置为处理电信号以产生多个投影测量。 处理器还适于对投影测量执行计算以从其构建对象的图像。

    System and method for thermal management of CT detector circuitry
    2.
    发明授权
    System and method for thermal management of CT detector circuitry 失效
    CT检测器电路的热管理系统和方法

    公开(公告)号：US06931092B2

    公开(公告)日：2005-08-16

    申请号：US10609755

    申请日：2003-06-30

    申请人： Ashutosh Joshi ,  William Edward Burdick, Jr. ,  Sandeep Shrikant Tonapi ,  Joseph Lacey

    发明人： Ashutosh Joshi ,  William Edward Burdick, Jr. ,  Sandeep Shrikant Tonapi ,  Joseph Lacey

    IPC分类号： A61B6/03 ,  G01N23/083

    CPC分类号： A61B6/032 ,  A61B6/4233 ,  A61B6/4411 ,  A61B6/4488 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object and a detector array comprising a plurality of detector assemblies. Each of the detector assembly further comprises a detector subassembly adapted to detect the X-ray beams and further adapted to convert the X-ray beams to a plurality of electrical signals and at least one integrated circuit array, for example, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array, for example, data acquisition chip array further comprises a plurality of integrated circuits, such as, data acquisition chips mounted on at least one printed circuit board and a thermal management system adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control thermal environment of each detector assembly. The heat sink further comprises a spreader plate extending over 2 or more data acquisition chips to reduce the temperature difference within the data acquisition chips.

    摘要翻译： 计算机断层摄影（CT）系统包括通过物体投射多个X射线束的X射线辐射源和包括多个检测器组件的检测器阵列。 每个检测器组件还包括检测器子组件，其适于检测X射线束，并且还适于将X射线束转换成多个电信号和至少一个集成电路阵列，例如数据采集芯片阵列 获取对应于电信号的数据。 集成电路阵列，例如数据采集芯片阵列还包括多个集成电路，例如安装在至少一个印刷电路板上的数据采集芯片和适于在数据采集芯片阵列和 用于控制每个检测器组件的热环境的散热器组件。 散热器还包括延伸超过2个或更多个数据采集芯片的扩展板，以减少数据采集芯片内的温差。