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    Solder alloy of electrode for joining electronic parts and soldering method
    1.
    发明授权
    Solder alloy of electrode for joining electronic parts and soldering method 失效
    用于接合电子零件的电极焊接合金和焊接方法

    公开(公告)号：US06325279B1

    公开(公告)日：2001-12-04

    申请号：US09569064

    申请日：2000-05-10

    申请人： Yoshinori Sakai ,  Kenichiro Suetsugu ,  Atsushi Yamaguchi

    发明人： Yoshinori Sakai ,  Kenichiro Suetsugu ,  Atsushi Yamaguchi

    IPC分类号： B23K3102

    CPC分类号： B23K35/262 ,  B23K2101/36 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/10909

    摘要： A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy of electrode for joining electronic parts comprising Sn, Ag and Cu as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 92 to 97 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.

    摘要翻译： 提出了一种无电极焊接合金，用于接合电子部件质地细腻，耐热疲劳特性优异的电极。 这是用于接合包含Sn，Ag和Cu的电子部件作为主要成分的电极用焊料合金，更具体地说，是用于接合含有92〜97重量％的电子部件的电极用焊料合金。 Sn的％，3.0〜6.0重量％ 的Ag，0.1〜2.0重量％。 ％的铜。 通过向主要由Sn组成的焊料中添加少量的Ag，形成微细的合金织构，并且纹理变化减小，从而获得耐热疲劳性优异的合金。 此外，通过添加少量的Cu，形成金属间化合物，结合强度提高。

    Solder alloy of electrode for joining electronic parts and soldering method
    2.
    发明授权
    Solder alloy of electrode for joining electronic parts and soldering method 失效
    用于接合电子零件的电极焊接合金和焊接方法

    公开(公告)号：US6077477A

    公开(公告)日：2000-06-20

    申请号：US011393

    申请日：1998-02-05

    申请人： Yoshinori Sakai ,  Kenichiro Suetsugu ,  Atsushi Yamaguchi

    发明人： Yoshinori Sakai ,  Kenichiro Suetsugu ,  Atsushi Yamaguchi

    IPC分类号： B23K35/26 ,  H05K3/34 ,  C22C13/02

    CPC分类号： B23K35/262 ,  H05K3/3463 ,  B23K2201/36 ,  H05K2201/10909 ,  H05K3/3442

    摘要： A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy for joining electronic parts comprising Sn, Ag, Bi, Cu and In as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 81 to 91 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.

    摘要翻译： PCT No.PCT / JP97 / 01969 Sec。 371日期：1998年2月5日 102（e）日期1998年2月5日PCT提交1997年6月6日PCT公布。 公开号WO97 / 46350 PCT 日期1997年12月11日提出了一种用于接合电子部件质地细小且耐热疲劳特性优异的电极的无铅焊料合金。 这是用于连接包含Sn，Ag，Bi，Cu和In的电子部件作为主要组分的焊料合金，更具体地说，用于接合含有81至91重量％的电子部件的电极用焊料合金。 Sn的％，3.0〜6.0重量％ 的Ag，0.1〜2.0重量％。 ％的铜。 通过向主要由Sn组成的焊料中添加少量的Ag，形成微细的合金织构，并且纹理变化减小，从而获得耐热疲劳性优异的合金。 此外，通过添加少量的Cu，形成金属间化合物，结合强度提高。

    Method of soldering using lead-free solder and bonded article prepared through soldering by the method
    3.
    发明授权
    Method of soldering using lead-free solder and bonded article prepared through soldering by the method 失效
    使用该方法通过焊接制备的使用无铅焊料和接合制品的焊接方法

    公开(公告)号：US06702175B1

    公开(公告)日：2004-03-09

    申请号：US10009168

    申请日：2001-12-07

    申请人： Kazumi Matsushige ,  Toshihisa Horiuchi ,  Takashi Ikari ,  Kenichiro Suetsugu ,  Masato Hirano ,  Shunji Hibino ,  Atsushi Yamaguchi

    发明人： Kazumi Matsushige ,  Toshihisa Horiuchi ,  Takashi Ikari ,  Kenichiro Suetsugu ,  Masato Hirano ,  Shunji Hibino ,  Atsushi Yamaguchi

    IPC分类号： B23K106

    CPC分类号： B23K1/06 ,  B23K1/20 ,  B23K35/262 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3463

    摘要： There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

    摘要翻译： 提供了一种焊接无铅焊料的方法，其降低无铅焊料的熔点并防止在由无铅焊料接合的部分处的接合强度的劣化，以及使用 焊接方法。 作为不含铅的锡的合金的无铅焊料熔化，并且当熔融的铅 - 铅焊料作为熔融的铅 - 铅焊料时，超声波振动至少与通过无铅焊料接合的接合体或无铅焊料起作用， 自由焊料固化。 因此，无铅焊料中含有的成分的晶体变细，并且防止了被包含的部件在接合物的接合界面处偏析，从而可以提高接合界面处的接合强度。

    Solder, solder paste and soldering method
    8.
    发明授权
    Solder, solder paste and soldering method 有权
    焊锡，焊膏和焊接方法

    公开(公告)号：US06428745B2

    公开(公告)日：2002-08-06

    申请号：US09818905

    申请日：2001-03-28

    申请人： Atsushi Yamaguchi ,  Tetsuo Fukushima ,  Kenichiro Suetsugu ,  Akio Furusawa

    发明人： Atsushi Yamaguchi ,  Tetsuo Fukushima ,  Kenichiro Suetsugu ,  Akio Furusawa

    IPC分类号： C22C1302

    CPC分类号： B23K35/262 ,  B23K35/025

    摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

    摘要翻译： 公开了用于将电子部件焊接到电路板的焊料和焊膏。 该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。 或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。

    Solder, solder paste and soldering method
    9.
    发明授权
    Solder, solder paste and soldering method 失效
    焊锡，焊膏和焊接方法

    公开(公告)号：US06267823B1

    公开(公告)日：2001-07-31

    申请号：US09125013

    申请日：1998-11-12

    申请人： Atsushi Yamaguchi ,  Tetsuo Fukushima ,  Kenichiro Suetsugu ,  Akio Furusawa

    发明人： Atsushi Yamaguchi ,  Tetsuo Fukushima ,  Kenichiro Suetsugu ,  Akio Furusawa

    IPC分类号： B23K3526

    CPC分类号： B23K35/262 ,  B23K35/025

    摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

    摘要翻译： 公开了用于将电子部件焊接到电路板的焊料和焊膏。 该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。 或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。

    Process and apparatus for flow soldering
    10.
    发明授权
    Process and apparatus for flow soldering 失效
    流动焊接的工艺和设备

    公开(公告)号：US06648216B2

    公开(公告)日：2003-11-18

    申请号：US09924555

    申请日：2001-08-09

    申请人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    发明人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    IPC分类号： B23K3102

    CPC分类号： B23K1/08 ,  B23K1/0016 ,  B23K2101/36 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/1121

    摘要： A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board is thereafter cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.

    摘要翻译： 一种用于通过无铅焊料将电子元件安装到电路板上的流焊工艺。 将熔融焊料材料供给并附着到焊料供给区域中的板的预定部分，然后通过冷却单元在冷却区中冷却板，使得粘附到板上的焊料材料被快速冷却固化。