Scanning interferometry technique for through-thickness evaluation in multi-layered transparent structures
    1.
    发明申请
    Scanning interferometry technique for through-thickness evaluation in multi-layered transparent structures 有权
    扫描干涉测量技术在多层透明结构中的厚度评估

    公开(公告)号:US20160054116A1

    公开(公告)日:2016-02-25

    申请号:US14833843

    申请日:2015-08-24

    IPC分类号: G01B11/16 G01B9/02 G01B11/06

    摘要: A multi-layer transparent composite detection technique includes producing two beams from a single, low-coherence source, a test beam and a reference beam, and scanning the reference beam to determine, with high precision, the depths of flaws (e.g., delaminations, bubbles, inclusions or other reflective or scattering objects) within a specimen or test object. The techniques combine light back-reflected or back-scattered from an internal flaw or interface with light in a reference path to identify such features and locations.

    摘要翻译: 多层透明复合检测技术包括从单个低相干源,测试光束和参考光束产生两个光束,并扫描参考光束以高精度确定缺陷的深度(例如,分层, 气泡,夹杂物或其他反射或散射物体)。 这些技术将来自内部缺陷或接口的光反射或反向散射到参考路径中的光以识别这些特征和位置。