公开(公告)号：US20060038643A1

公开(公告)日：2006-02-23

申请号：US10923277

申请日：2004-08-20

申请人： Baomin Xu ,  David Fork ,  Michael Young ,  Eugene Chow

发明人： Baomin Xu ,  David Fork ,  Michael Young ,  Eugene Chow

IPC分类号： H01H51/22

CPC分类号： G11C23/00 ,  F03G7/065 ,  F04B17/003 ,  F05C2201/0412 ,  F05C2203/0813 ,  F05C2251/00 ,  F05C2251/08 ,  H01L41/094

摘要： Disclosed is a MEMS device which comprises at least one shape memory material such as a shape memory alloy (SMA) layer and at least one stressed material layer. Examples of such MEMS devices include an actuator, a micropump, a microvalve, or a non-destructive fuse-type connection probe. The device exhibits a variety of improved properties, for example, large deformation ability and high energy density. Also provided is a method of easily fabricating the MEMS device in the form of a cantilever-type or diaphragm-type structure.

摘要翻译： 公开了一种MEMS器件，其包括至少一种形状记忆材料，例如形状记忆合金（SMA）层和至少一个应力材料层。 这种MEMS器件的实例包括致动器，微型泵，微型阀或非破坏性熔丝式连接探针。 该装置具有各种改进的性能，例如，大的变形能力和高的能量密度。 还提供了以悬臂式或隔膜式结构的形式容易地制造MEMS器件的方法。

公开(公告)号：US20060009051A1

公开(公告)日：2006-01-12

申请号：US11226186

申请日：2005-09-13

申请人： Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

发明人： Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

IPC分类号： H01R12/00

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

公开(公告)号：US20070145523A1

公开(公告)日：2007-06-28

申请号：US11319056

申请日：2005-12-28

申请人： Eugene Chow ,  Koenraad Schuylenbergh ,  David Fork ,  JengPing Lu

发明人： Eugene Chow ,  Koenraad Schuylenbergh ,  David Fork ,  JengPing Lu

IPC分类号： H01L29/00

CPC分类号： H01G5/18 ,  B81B3/0051 ,  H01F17/0006 ,  H01F17/02 ,  H01F21/04 ,  H01F27/40 ,  H01L28/10 ,  H01L28/60

摘要： Method for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A variable capacitors may employ stops between a moveable electrode and a fixed electrode to reduce and/or prevent electrical shorting between the moveable and fixed electrode. A capacitor may employ a split bottom electrode structure to removing a suspension portion of a moveable top electrode from an RF part of a circuit.

摘要翻译： 描述了在衬底上整体形成高Q可调电容器和高Q电感器的方法。 可变电容器可以在可移动电极和固定电极之间使用停止以减少和/或防止可移动和固定电极之间的电短路。 电容器可以采用分离的底部电极结构来从电路的RF部分去除可移动顶部电极的悬挂部分。

公开(公告)号：US20060057031A1

公开(公告)日：2006-03-16

申请号：US11267762

申请日：2005-11-03

申请人： Thomas Hantschel ,  David Fork ,  Eugene Chow ,  Dirk De Bruyker ,  Michel Rosa

发明人： Thomas Hantschel ,  David Fork ,  Eugene Chow ,  Dirk De Bruyker ,  Michel Rosa

IPC分类号： B01L3/00 ,  G01N33/00

CPC分类号： G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

摘要翻译： 公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。 由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。 由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。 由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

公开(公告)号：US20060076693A1

公开(公告)日：2006-04-13

申请号：US10959180

申请日：2004-10-07

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

IPC分类号： H01L23/52

CPC分类号： G01R1/06716 ,  G01R3/00 ,  Y10T29/49609

摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

摘要翻译： 根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中， 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

公开(公告)号：US20050136703A1

公开(公告)日：2005-06-23

申请号：US10742501

申请日：2003-12-19

申请人： Koenraad Van Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

发明人： Koenraad Van Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

IPC分类号： H05K1/14 ,  H01B11/00 ,  H01R12/00 ,  H01R12/04 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

公开(公告)号：US20050006829A1

公开(公告)日：2005-01-13

申请号：US10615653

申请日：2003-07-08

申请人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

发明人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

IPC分类号： F16F1/02 ,  H01L27/148 ,  F16F1/00 ,  F16F9/00 ,  H01L29/768

CPC分类号： F16F1/027

摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure

摘要翻译： 通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。 使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。 在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。 另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。 电镀工艺限于另一弹簧的上侧。 释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。 公开了可以与每个弹簧结构一起使用的各种尖端装置

公开(公告)号：US20070178726A1

公开(公告)日：2007-08-02

申请号：US11347740

申请日：2006-02-02

申请人： David Fork ,  Thomas Hantschel

发明人： David Fork ,  Thomas Hantschel

IPC分类号： H01R12/00

CPC分类号： H01R13/03 ,  H01R13/2407 ,  Y10T29/49204

摘要： A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a thickness that is three-eighths or less of a tensile upper layer of spring material. A low modulus of elasticity cladding material may also be applied to the outer surface of the spring contact with a lower surface of the cladding material being formed with a compressive stress.

公开(公告)号：US20070169806A1

公开(公告)日：2007-07-26

申请号：US11336714

申请日：2006-01-20

申请人： David Fork ,  Patrick Maeda ,  Ana Arias ,  Douglas Curry

发明人： David Fork ,  Patrick Maeda ,  Ana Arias ,  Douglas Curry

IPC分类号： H01L31/00

CPC分类号： H01L31/1876 ,  H01L31/022425 ,  Y02E10/50 ,  Y02P70/521

摘要： Photovoltaic devices (i.e., solar cells) are formed using non-contact patterning apparatus (e.g., a laser-based patterning systems) to define contact openings through a passivation layer, and direct-write metallization apparatus (e.g., an inkjet-type printing or extrusion-type deposition apparatus) to deposit metallization into the contact openings and over the passivation surface. The metallization includes two portions: a contact (e.g., silicide-producing) material is deposited into the contact openings, then a highly conductive metal is deposited on the contact material and between the contact holes. The device wafers are transported between the patterning and metallization apparatus in hard tooled registration using a conveyor mechanism. Optional sensors are utilized to align the patterning and metallization apparatus to the contact openings. An extrusion-type apparatus is used to form grid lines having a high aspect central metal line that is supported on each side by a transparent material.

摘要翻译： 使用非接触式图案形成装置（例如，基于激光的图案形成系统）来形成光电装置（即，太阳能电池），以限定通过钝化层的接触开口，以及直接写入金属化装置（例如喷墨型印刷或 挤出型沉积设备）以将金属化沉积到接触开口中并在钝化表面上。 金属化包括两部分：将接触（例如，产生硅化物）的材料沉积到接触开口中，然后在接触材料上和接触孔之间沉积高导电性金属。 使用传送机构在硬模具配准中，在图案化和金属化装置之间输送装置晶片。 使用可选的传感器来将图案化和金属化装置对准接触开口。 使用挤出型装置形成具有高方位中心金属线的网格线，每条边由透明材料支撑。

公开(公告)号：US20070023909A1

公开(公告)日：2007-02-01

申请号：US11191566

申请日：2005-07-27

申请人： David Fork ,  Thomas Hantschel ,  Michael Chabinyc

发明人： David Fork ,  Thomas Hantschel ,  Michael Chabinyc

IPC分类号： H01L23/48

CPC分类号： H05K3/32 ,  B82Y30/00 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/083 ,  H01L2924/00

摘要： A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

摘要翻译： 描述形成自组装互连结构的方法。 在该方法中，接触垫表面和溶液中的颗粒被聚集在一起。 颗粒被选择成使得颗粒粘附到接触垫表面。 接触的形成通过将相对的接触压入颗粒中而完成，使得经由相对的接触垫和基板表面接触垫之间的颗粒形成电连接。 所描述的自组装互连结构在显示器件制造中特别有用。