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公开(公告)号：US20070178726A1
公开(公告)日：2007-08-02
申请号：US11347740
申请日：2006-02-02
申请人： David Fork , Thomas Hantschel
发明人： David Fork , Thomas Hantschel
IPC分类号： H01R12/00
CPC分类号： H01R13/03 , H01R13/2407 , Y10T29/49204
摘要： A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a thickness that is three-eighths or less of a tensile upper layer of spring material. A low modulus of elasticity cladding material may also be applied to the outer surface of the spring contact with a lower surface of the cladding material being formed with a compressive stress.
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公开(公告)号：US20070023909A1
公开(公告)日：2007-02-01
申请号：US11191566
申请日：2005-07-27
申请人： David Fork , Thomas Hantschel , Michael Chabinyc
发明人： David Fork , Thomas Hantschel , Michael Chabinyc
IPC分类号： H01L23/48
CPC分类号： H05K3/32 , B82Y30/00 , H01L2924/0002 , H05K3/102 , H05K3/321 , H05K3/325 , H05K2201/0209 , H05K2201/0239 , H05K2201/0266 , H05K2201/0347 , H05K2201/0367 , H05K2201/083 , H01L2924/00
摘要： A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.
摘要翻译： 描述形成自组装互连结构的方法。 在该方法中，接触垫表面和溶液中的颗粒被聚集在一起。 颗粒被选择成使得颗粒粘附到接触垫表面。 接触的形成通过将相对的接触压入颗粒中而完成，使得经由相对的接触垫和基板表面接触垫之间的颗粒形成电连接。 所描述的自组装互连结构在显示器件制造中特别有用。
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公开(公告)号：US20070023907A1
公开(公告)日：2007-02-01
申请号：US11191435
申请日：2005-07-27
申请人： David Fork , Thomas Hantschel , Michael Chabinyc
发明人： David Fork , Thomas Hantschel , Michael Chabinyc
IPC分类号： H01L23/48
CPC分类号： H05K3/321 , B82Y30/00 , H01L21/4853 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/29 , H01L24/83 , H01L24/90 , H01L2224/03912 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/11332 , H01L2224/11334 , H01L2224/11442 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/11901 , H01L2224/13022 , H01L2224/13078 , H01L2224/13144 , H01L2224/1357 , H01L2224/136 , H01L2224/29101 , H01L2224/29399 , H01L2224/81801 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H05K3/102 , H05K2203/122 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.
摘要翻译： 描述形成自组装互连结构的方法。 在该方法中，接触垫表面和溶液中的颗粒被聚集在一起。 颗粒被选择成使得颗粒粘附到接触垫表面。 接触的形成通过将相对的接触压入颗粒中而完成，使得经由相对的接触垫和基板表面接触垫之间的颗粒形成电连接。 所描述的自组装互连结构在显示器件制造中特别有用。
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公开(公告)号：US20070202310A1
公开(公告)日：2007-08-30
申请号：US11364111
申请日：2006-02-27
IPC分类号： B32B7/02
CPC分类号： C23C30/00 , B81B2203/0118 , B81B2203/019 , B81C1/00007 , B81C1/0019 , C23C28/00 , C23C28/021 , C23C28/023 , C25D1/003 , C25D1/20 , C25D5/022 , C25D5/10 , C25D5/50 , H01F17/0006 , H01L27/08 , Y10T428/24942
摘要： A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.
摘要翻译： 结构具有由驻留在基板上的第一材料形成的至少一个结构部件，使得该结构在基板的平面之外。 然后第二材料的第一涂层然后涂覆该结构。 非氧化材料的第二涂层以小于第二材料厚度的厚度涂覆结构。
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5.发明申请Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal 有权用于采用压力金属的液体拾取，运输和分配的毛细管通道探头公开(公告)号：US20060057031A1
公开(公告)日：2006-03-16
申请号：US11267762
申请日：2005-11-03
申请人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
发明人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译： 公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。 由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。 由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。 由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。
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公开(公告)号：US20070110836A1
公开(公告)日：2007-05-17
申请号：US11282882
申请日：2005-11-17
申请人： David Fork , Thomas Hantschel
发明人： David Fork , Thomas Hantschel
IPC分类号： B29C47/06
CPC分类号： B29C47/026 , B29C47/0021 , B29C47/065 , B29C47/145 , B29C47/705 , B29C47/707 , B81C1/00634 , B81C2900/02 , H01L31/022425 , H01L31/18 , Y02E10/50 , Y10T428/24802
摘要： A device for extruding/dispensing materials on a substrate includes a housing with at least two channels formed to facilitate flow. The housing includes entrance ports for each of the channels for receiving different materials. The housing further includes an exit port for co-extruding the materials on the substrate to generate a relatively fine feature with a relatively high aspect ratio.
摘要翻译： 用于在衬底上挤出/分配材料的装置包括壳体，其具有形成为促进流动的至少两个通道。 外壳包括用于接收不同材料的每个通道的入口。 壳体还包括用于共同挤出衬底上的材料以产生具有相对高的纵横比的较细的特征的出口。
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公开(公告)号：US20070023908A1
公开(公告)日：2007-02-01
申请号：US11191436
申请日：2005-07-27
申请人： David Fork , Thomas Hantschel , Michael Chabinyc
发明人： David Fork , Thomas Hantschel , Michael Chabinyc
IPC分类号： H01L23/48
CPC分类号： H05K3/32 , B82Y30/00 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/05556 , H01L2224/11015 , H01L2224/11332 , H01L2224/11334 , H01L2224/1147 , H01L2224/13005 , H01L2224/13019 , H01L2224/13078 , H01L2224/13082 , H01L2224/131 , H01L2224/1319 , H01L2224/13561 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2924/14 , H05K3/102 , H05K3/321 , H05K3/325 , H05K2201/0209 , H05K2201/0239 , H05K2201/0266 , H05K2201/0347 , H05K2201/0367 , H05K2201/083 , H01L2924/00014 , H01L2924/00012 , H01L2924/207 , H01L2924/00
摘要： A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.
摘要翻译： 描述形成自组装互连结构的方法。 在该方法中，接触垫表面和溶液中的颗粒被聚集在一起。 颗粒被选择成使得颗粒粘附到接触垫表面。 接触的形成通过将相对的接触压入颗粒中而完成，使得经由相对的接触垫和基板表面接触垫之间的颗粒形成电连接。 所描述的自组装互连结构在显示器件制造中特别有用。
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公开(公告)号：US20070139899A1
公开(公告)日：2007-06-21
申请号：US11314827
申请日：2005-12-21
IPC分类号： H05K7/00
CPC分类号： H01L23/36 , H01L23/22 , H01L23/295 , H01L23/315 , H01L23/3185 , H01L23/32 , H01L23/3675 , H01L23/4006 , H01L23/42 , H01L23/49833 , H01L23/552 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/72 , H01L24/81 , H01L2023/4043 , H01L2224/10135 , H01L2224/13109 , H01L2224/16 , H01L2224/17517 , H01L2224/29109 , H01L2224/2919 , H01L2224/73203 , H01L2224/73251 , H01L2224/73253 , H01L2224/81136 , H01L2224/81139 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81901 , H01L2224/83951 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/16152 , H01L2924/16195 , H01L2924/19043 , H01L2924/3025 , Y10T29/49147 , H01L2924/0132 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/72
摘要： An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.
摘要翻译： 集成电路（IC）管芯/衬底组件包括通过形成在IC管芯上的互连电耦合的IC管芯和衬底。 IC芯片/基板组件还包括至少一个耦合，其有助于保持IC管芯和衬底之间的IC管芯/衬底间隙限定。
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公开(公告)号：US20070126536A1
公开(公告)日：2007-06-07
申请号：US11292421
申请日：2005-12-02
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , H01H2059/0081
摘要： In one aspect, an electromechanical switching device is illustrated. The electromechanical switching device includes a relay with at least one first conductive portion, at least one second conductive portion, and at least one actuation component that moves the at least one first conductive portion and the at least one second conductive portion into and out of conductive contact. The at least one first conductive portion includes a conductive stationary end coupled to a substrate and a conductive free-floating end. The at least one actuation component includes an actuation stationary end coupled to the substrate and an actuation free-floating end. The actuation free floating end, when the at least one actuation component is not energized, curls, which curls the conductive free floating end into or out of conductive contact with the at least one second conductive portion.
摘要翻译： 在一个方面，示出了机电开关装置。 机电开关装置包括具有至少一个第一导电部分，至少一个第二导电部分和至少一个致动部件的继电器，所述至少一个致动部件将至少一个第一导电部分和至少一个第二导电部分移入和移出导电部分 联系。 所述至少一个第一导电部分包括耦合到衬底的导电固定端和导电自由浮动端。 所述至少一个致动部件包括联接到所述基板的致动固定端和致动自由浮动端。 当所述至少一个致动部件未通电时，所述致动自由浮动端部卷曲，所述自由浮动端部将所述导电自由浮动端部与所述至少一个第二导电部分导电接触或者脱离所述至少一个第二导电部分的导电接触。
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公开(公告)号：US20070296129A1
公开(公告)日：2007-12-27
申请号：US11851479
申请日：2007-09-07
申请人： David Fork , Thomas Hantschel
发明人： David Fork , Thomas Hantschel
IPC分类号： F16F1/00
CPC分类号： H01R13/03 , H01R13/2407 , Y10T29/49204
摘要： A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a thickness that is three-eighths or less of a tensile upper layer of spring material. A low modulus of elasticity cladding material may also be applied to the outer surface of the spring contact with a lower surface of the cladding material being formed with a compressive stress.
摘要翻译： 弹簧接触件具有压缩后释放外侧上表面和压缩后释放外侧下表面。 弹性材料的压缩下层可以形成为弹性材料的拉伸上层的三分之八或更小的厚度。 低弹性包层材料也可以施加到弹簧接触件的外表面，而包层材料的下表面形成有压缩应力。
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