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31 条记录 (耗时 0.027 秒)

    ANISOTROPICALLY CONDUCTIVE BACKSIDE ADDRESSABLE IMAGING BELT FOR USE WITH CONTACT ELECTROGRAPHY
    5.
    发明申请
    ANISOTROPICALLY CONDUCTIVE BACKSIDE ADDRESSABLE IMAGING BELT FOR USE WITH CONTACT ELECTROGRAPHY 有权
    使用联系电子技术的非均匀导电背面可寻址成像带

    公开(公告)号：US20090322845A1

    公开(公告)日：2009-12-31

    申请号：US12145677

    申请日：2008-06-25

    申请人： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Volkel ,  Eric Peeters

    发明人： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Volkel ,  Eric Peeters

    IPC分类号： B41J2/41

    CPC分类号： B41J2/41 ,  G03G15/32

    摘要： An addressable imaging belt for use in printing applications having embedded anisotropically conductive addressable islands configured for electric contact on a first side of the belt by a write head consisting of an array of compliant cantilevered fingers with contact pads/points to which a voltage can be applied. The conductive addressable islands electrically isolated from one another and extending substantially through the thickness of the belt in order to allow charge to flow through the belt towards a second side of the belt, in order to form a latent electrostatic image on the second side and develop this latent image by attracting colorized toner or other electrically charged particles to the second side.

    摘要翻译： 一种用于印刷应用的可寻址成像带，其具有嵌入的各向异性导电可寻址岛，其配置用于通过由柔性悬臂指状物阵列组成的写头组成，用于在带的第一侧上进行电接触，所述写头具有可被施加电压的接触焊盘/点 。 导电寻址岛彼此电隔离并且基本上延伸穿过带的厚度，以便允许电荷通过带流向带的第二侧，以在第二面上形成静电潜像并显影 该潜像通过将着色调色剂或其它带电粒子吸引到第二侧。

    Stressed material and shape memory material MEMS devices and methods for manufacturing
    6.
    发明申请
    Stressed material and shape memory material MEMS devices and methods for manufacturing 有权
    强调材料和形状记忆材料MEMS器件和制造方法

    公开(公告)号：US20060038643A1

    公开(公告)日：2006-02-23

    申请号：US10923277

    申请日：2004-08-20

    申请人： Baomin Xu ,  David Fork ,  Michael Young ,  Eugene Chow

    发明人： Baomin Xu ,  David Fork ,  Michael Young ,  Eugene Chow

    IPC分类号： H01H51/22

    CPC分类号： G11C23/00 ,  F03G7/065 ,  F04B17/003 ,  F05C2201/0412 ,  F05C2203/0813 ,  F05C2251/00 ,  F05C2251/08 ,  H01L41/094

    摘要： Disclosed is a MEMS device which comprises at least one shape memory material such as a shape memory alloy (SMA) layer and at least one stressed material layer. Examples of such MEMS devices include an actuator, a micropump, a microvalve, or a non-destructive fuse-type connection probe. The device exhibits a variety of improved properties, for example, large deformation ability and high energy density. Also provided is a method of easily fabricating the MEMS device in the form of a cantilever-type or diaphragm-type structure.

    摘要翻译： 公开了一种MEMS器件，其包括至少一种形状记忆材料，例如形状记忆合金（SMA）层和至少一个应力材料层。 这种MEMS器件的实例包括致动器，微型泵，微型阀或非破坏性熔丝式连接探针。 该装置具有各种改进的性能，例如，大的变形能力和高的能量密度。 还提供了以悬臂式或隔膜式结构的形式容易地制造MEMS器件的方法。

    Self-releasing spring structures and methods
    7.
    发明申请
    Self-releasing spring structures and methods 有权
    自释弹簧结构及方法

    公开(公告)号：US20060076693A1

    公开(公告)日：2006-04-13

    申请号：US10959180

    申请日：2004-10-07

    申请人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

    发明人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

    IPC分类号： H01L23/52

    CPC分类号： G01R1/06716 ,  G01R3/00 ,  Y10T29/49609

    摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

    摘要翻译： 根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中， 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

    High force metal plated spring structure
    8.
    发明申请
    High force metal plated spring structure 有权
    高强度金属电镀弹簧结构

    公开(公告)号：US20050006829A1

    公开(公告)日：2005-01-13

    申请号：US10615653

    申请日：2003-07-08

    申请人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

    发明人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

    IPC分类号： F16F1/02 ,  H01L27/148 ,  F16F1/00 ,  F16F9/00 ,  H01L29/768

    CPC分类号： F16F1/027

    摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure

    摘要翻译： 通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。 使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。 在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。 另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。 电镀工艺限于另一弹簧的上侧。 释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。 公开了可以与每个弹簧结构一起使用的各种尖端装置

    Microsprings Having Nanowire Tip Structures
    9.
    发明申请
    Microsprings Having Nanowire Tip Structures 审中-公开
    具有纳米线尖端结构的微管

    公开(公告)号：US20110167526A1

    公开(公告)日：2011-07-07

    申请号：US13045042

    申请日：2011-03-10

    申请人： Eugene Chow ,  Pengfei Qi

    发明人： Eugene Chow ,  Pengfei Qi

    IPC分类号： G01Q70/08 ,  B82Y30/00

    CPC分类号： B81C1/0015 ,  B81B2203/019 ,  B81B2207/07 ,  B82Y10/00

    摘要： A stress-engineered microspring is formed generally in the plane of a substrate. A nanowire (or equivalently, a nanotube) is formed at the tip thereof, also in the plane of the substrate. Once formed, the length of the nanowire may be defined, for example photolithographically. A sacrificial layer underlying the microspring may then be removed, allowing the engineered stresses in the microspring to cause the structure to bend out of plane, elevating the nanowire off the substrate and out of plane. Use of the nanowire as a contact is thereby provided. The nanowire may be clamped at the tip of the microspring for added robustness. The nanowire may be coated during the formation process to provide additional functionality of the final device.

    摘要翻译： 应力工程微球通常在基底的平面上形成。 纳米线（或等效地，纳米管）也在其顶端形成在基板的平面中。 一旦形成，可以例如光刻地限定纳米线的长度。 然后可以去除位于微弹簧下面的牺牲层，允许微弹簧中的工程应力使结构弯曲出平面，从而使纳米线离开基底并离开平面。 由此提供了使用纳米线作为接触。 可以将纳米线夹在微弹簧的末端以增加坚固性。 在形成过程中可以涂覆纳米线以提供最终装置的附加功能。

    Vertically spaced plural microsprings
    10.
    发明申请
    Vertically spaced plural microsprings 有权
    垂直间隔的多个微弹簧

    公开(公告)号：US20070125486A1

    公开(公告)日：2007-06-07

    申请号：US11292474

    申请日：2005-12-02

    申请人： Thomas Hantschel ,  Eugene Chow

    发明人： Thomas Hantschel ,  Eugene Chow

    IPC分类号： B32B37/00

    CPC分类号： B81B3/001 ,  B81B2207/07 ,  B81C1/00666 ,  B81C1/00952 ,  G01R1/06722 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H05K3/4092

    摘要： A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.

    摘要翻译： 提供多个垂直间隔开的微弹簧以增加微弹簧接触力，接触面积，接触可靠性和接触屈服。 微珠材料作为单层或作为多个子层的复合材料沉积，沿其横截面具有定制的应力差。 可以制备较低的微弹簧以向上推动上部微型弹性体以提供增加的接触力，或者向下推动抵靠基底以确保制造过程中的释放。 可以提供类似的应力差异或相反的应力差异以获得所需的微弹体轮廓和功能性。 微弹簧也可以在其远端物理连接以增加接触力。 微弹簧可以由导电材料形成或涂覆有用于探针卡和类似应用的导电材料。