公开(公告)号：US20120227886A1

公开(公告)日：2012-09-13

申请号：US13045365

申请日：2011-03-10

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang ,  Ying-Jui Huang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang ,  Ying-Jui Huang

IPC分类号： B32B37/00 ,  B23B31/28 ,  H01L21/673 ,  B23K31/02

CPC分类号： H01L21/6833 ,  H01L21/67346 ,  Y10T29/49998 ,  Y10T156/10 ,  Y10T279/23

摘要： A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive electrodes and negative electrodes electrically insulated from the positive electrodes. The positive electrodes and the negative electrodes are allocated in an alternating pattern in a plane substantially parallel to the dielectric top surface.

摘要翻译： 便携式静电卡盘托架包括具有电介质顶表面的保持器和在电介质顶表面下方的双极电极。 双极电极包括与正极电绝缘的正极和负极。 正电极和负电极在基本上平行于电介质顶表面的平面中以交替图案分配。

公开(公告)号：US20130167373A1

公开(公告)日：2013-07-04

申请号：US13527459

申请日：2012-06-19

申请人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： B26D7/27 ,  H01R43/00

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/78 ,  H01L2224/056 ,  H01L2224/1111 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/206 ,  Y10T29/49192 ,  Y10T29/49213 ,  Y10T29/514 ,  Y10T29/5177 ,  Y10T29/53217 ,  Y10T29/53235 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049 ,  H01L2224/4554

摘要： An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

公开(公告)号：US20120211547A1

公开(公告)日：2012-08-23

申请号：US13031040

申请日：2011-02-18

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

IPC分类号： B23K1/20 ,  B23K3/08

CPC分类号： B23K1/203 ,  B23K3/082

摘要： A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

摘要翻译： 焊剂浸渍装置包括具有顶表面的焊剂板; 以及在焊剂板中的浸入腔并且从顶表面凹陷。 助熔剂矫正器设置在焊剂板上方并且被配置成平行于顶表面移动。 压电致动器被配置为响应于施加到第一压电致动器的电极的控制电压来调节通量调节器和顶表面之间的距离。

公开(公告)号：US08668131B2

公开(公告)日：2014-03-11

申请号：US13031040

申请日：2011-02-18

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

IPC分类号： B23K3/08 ,  B23K1/20

CPC分类号： B23K1/203 ,  B23K3/082

摘要： A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

摘要翻译： 焊剂浸渍装置包括具有顶表面的焊剂板; 以及在焊剂板中的浸入腔并且从顶表面凹陷。 助熔剂矫正器设置在焊剂板上方并且被配置成平行于顶表面移动。 压电致动器被配置为响应于施加到第一压电致动器的电极的控制电压来调节通量调节器和顶表面之间的距离。

公开(公告)号：US08373269B1

公开(公告)日：2013-02-12

申请号：US13227969

申请日：2011-09-08

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chien Ling Hwang

IPC分类号： H01L23/34 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L24/95 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75272 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A device includes a lower jig and an upper jig, wherein the lower jig and the upper jig are configured to secure a package substrate. The lower jig includes a first base material and a first plurality of features attached to the first base material. The first plurality of features is disposed adjacent to a peripheral of the lower jig. The upper jig includes a second base material and a second plurality of features attached to the second base material. The second plurality of features is disposed adjacent to a peripheral of the upper jig. The first plurality of features is configured to be attracted to the second plurality of features by a magnetic force.

摘要翻译： 一种装置包括下夹具和上夹具，其中下夹具和上夹具构造成固定封装衬底。 下夹具包括第一基材和附接到第一基材的第一多个特征。 第一多个特征被布置成与下夹具的周边相邻。 上夹具包括第二基材和附接到第二基材的第二多个特征。 第二多个特征被布置成与上夹具的周边相邻。 第一多个特征被配置为通过磁力被吸引到第二多个特征。

公开(公告)号：US09021682B2

公开(公告)日：2015-05-05

申请号：US13527459

申请日：2012-06-19

申请人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： H01R43/052 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/78 ,  H01L2224/056 ,  H01L2224/1111 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/206 ,  Y10T29/49192 ,  Y10T29/49213 ,  Y10T29/514 ,  Y10T29/5177 ,  Y10T29/53217 ,  Y10T29/53235 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049 ,  H01L2224/4554

摘要： An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

摘要翻译： 一种装置包括：线圈，其被配置为供应线，被配置为在所述线中形成切口的切割装置，以及被配置为结合所述线并形成柱形凸块的毛细管。 该设备还被配置为拉动线在凹口处断裂，尾部区域附接到柱形凸块。

公开(公告)号：US08540136B1

公开(公告)日：2013-09-24

申请号：US13605403

申请日：2012-09-06

申请人： Yeong-Jyh Lin ,  Hsin-Hung Liao ,  Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Yeong-Jyh Lin ,  Hsin-Hung Liao ,  Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： B23K31/02 ,  B21D53/36 ,  B23K20/007 ,  H01L2224/78301 ,  Y10T29/49

摘要： Methods for forming stud bumps and apparatuses for forming stud bumps are disclosed. According to an embodiment, a method includes clamping a wire with a clamp. The clamp includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method further includes bonding the wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface. The second notch is the notch pitch distance from the first notch along the wire.

摘要翻译： 公开了用于形成柱形凸块的方法和用于形成凸块凸块的装置。 根据实施例，一种方法包括用夹具夹紧线。 所述夹具包括至少两个相对的板，并且当所述线被夹紧形成所述线中的第一凹口时，所述相对板中的至少一个包括与所述线相交的突出特征。 该方法还包括将线接合到接合表面，将线从夹具中释放出来，使线穿过钳口的间距距离通过夹具夹紧线，夹具在线中形成第二凹口，并将线断开， 接合表面上的导线的接合部分。 第二个凹口是距离第一个凹口沿导线的切口间距距离。

公开(公告)号：US08679591B2

公开(公告)日：2014-03-25

申请号：US12891487

申请日：2010-09-27

申请人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu

IPC分类号： B05D1/18

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector.

摘要翻译： 一个实施例是一种用于形成半导体组件的方法，包括清洁在基板上形成的铜的连接器，向连接器施加冷锡，向连接器施加热锡，并旋转冲洗和干燥连接器。

公开(公告)号：US20130048027A1

公开(公告)日：2013-02-28

申请号：US13221673

申请日：2011-08-30

申请人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B08B3/12

CPC分类号： B08B3/12 ,  B08B3/08 ,  H01L21/67028 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/8191 ,  H01L2924/014

摘要： A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.

摘要翻译： 一种方法包括产生含有溶剂的含溶剂的蒸气。 将含溶剂的蒸气传导到包装组件以清洁包装组件。 含溶剂的蒸汽在包装组件的表面上冷凝形成液体，并从包装组件的表面流出。

公开(公告)号：US20130273717A1

公开(公告)日：2013-10-17

申请号：US13448648

申请日：2012-04-17

申请人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Bor-Ping Jang ,  Hsin-Hung Liao ,  Lin-Wei Wang ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Bor-Ping Jang ,  Hsin-Hung Liao ,  Lin-Wei Wang ,  Chung-Shi Liu

IPC分类号： H01L21/78 ,  B24B7/10 ,  B23K26/38 ,  B26D7/01

CPC分类号： B28D5/00 ,  B23K26/02 ,  B23K26/083 ,  B28D5/029 ,  H01L21/67092 ,  Y10T83/748

摘要： The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.

摘要翻译： 本公开涉及一种用于单个半导体衬底或晶片的装置。 在一些实施例中，分割装置包括多个切割装置。 切割装置被配置为在半导体晶片的表面上并行地形成多个并行切割线。 在一些实施例中，分割装置包括至少两个切割锯或激光模块。 所公开的分割装置可以通过在晶片的整个圆周边缘上的切割方式将半导体晶片切割成单独的芯片，从而减少处理时间并增加产量。