摘要:
The present invention is directed to an integrated circuit device having a memory cell for storing a data and refresh circuitry for refreshing that data in the memory cell. In one illustrative embodiment, the device comprises a memory cell having a storage element, a read/write access device, and a refresh access device. A read/write digit line is coupled to the read/write access device, and a refresh digit line is coupled to the refresh access device. A sense amplifier is coupled to the read/write digit line, and input/output circuitry is coupled to the read/write digit line. A refresh sense amplifier is coupled to the refresh digit line. The memory cell is constructed in such a way as to provide a large charge storage capacity in a relatively small, compact area.
摘要:
Embodiments in accordance with the present invention provide methods of forming a dual gated semiconductor-on-insulator (SOI) device. Such methods encompass forming a first transistor structure operatively adjacent a first side of the semiconductor layer of an SOI substrate. Insulator layer material is removed from the second side of the semiconductor layer, between the source/drain contact structures of the first transistor structure and a second transistor structure there formed operatively adjacent the second side of the semiconductor layer and aligned to the first transistor structure.
摘要:
A cache memory system and method includes a DRAM having a plurality of banks, each of which may be refreshed under control of a refresh controller. In addition to the usual components of a DRAM, the cache memory system also includes 2 SRAMs each having a capacity that is equal to the capacity of each bank of the DRAM. In operation, data read from a bank of the DRAM are stored in one of the SRAMs so that repeated hits to that bank are cached by reading from the SRAM. In the event of a write to a bank that is being refreshed, the write data are stored in one of the SRAMs. After the refresh of the bank has been completed, the data stored in the SRAM are transferred to the DRAM bank. A subsequent read or write to a second DRAM bank undergoing refresh and occurring during the transfer of data from an SRAM to the DRAM is stored in the second bank. If, however, the second bank is being refreshed, the data are stored in the other SRAM. By the time data have been stored in the SRAM, the SRAM previously used to store write data has transferred the data to the first DRAM bank and in thus available to store a subsequent write. Therefore, an SRAM bank is always available to store write data in the event the DRAM bank to which the data are directed is being refreshed.
摘要:
A cache memory system and method includes a DRAM having a plurality of banks, and it also includes 2 SRAMs each having a capacity that is equal to the capacity of each bank of the DRAM. In operation, data read from a bank of the DRAM are stored in one of the SRAMs so that repeated hits to that bank are cached by reading from the SRAM. In the event of a write to a bank that is being refreshed, the write data are stored in one of the SRAMs. After the refresh of the bank has been completed, the data stored in the SRAM are transferred to the DRAM bank. A subsequent read or write to a second DRAM bank undergoing refresh and occurring during the transfer of data from an SRAM to the DRAM is stored in either the second bank or the other SRAM.
摘要:
The present invention is directed to an integrated circuit device having a memory cell for storing a data and refresh circuitry for refreshing that data in the memory cell. In one illustrative embodiment, the device comprises a memory cell having a storage element, a read/write access device, and a refresh access device. A read/write digit line is coupled to the read/write access device, and a refresh digit line is coupled to the refresh access device. A sense amplifier is coupled to the read/write digit line, and input/output circuitry is coupled to the read/write digit line. A refresh sense amplifier is coupled to the refresh digit line. The memory cell is constructed in such a way as to provide a large charge storage capacity in a relatively small, compact area.
摘要:
Techniques for wafer-scale memory device and systems are provided. In an example, a wafer-scale memory device can include a large single substrate, multiple memory circuit areas including dynamic random-access memory (DRAM), the multiple memory circuit areas integrated with the substrate and configured to form an array on the substrate, and multiple streets separating the memory circuit areas. The streets can accommodate attaching the substrate to a wafer-scale processor. In certain examples, the large, single substrate can have a major surface area of more than 20,000 square millimeters (mm2).
摘要:
Apparatus and methods are disclosed, including memory devices and systems. In an example, a memory module can include a first stack of at least eight memory die including four pairs of memory die, each pair of the four pairs of memory die associated with an individual memory rank of four memory ranks of the memory module, a memory controller configured to receive memory access commands and to access memory locations of the first stack, and a substrate configured to route connections between external terminations of the memory module and the memory controller.
摘要:
Some embodiments include apparatus, systems, and methods comprising semiconductor dice arranged in a stack, a number of connections configured to provide communication among the dice, at least a portion of the connections going through at least one of the dice, and a module configured to check for defects in the connections and to repair defects the connections.
摘要:
A optical link for achieving electrical isolation between a controller and a memory device is disclosed. The optical link increases the noise immunity of electrical interconnections, and allows the memory device to be placed a greater distance from the processor than is conventional without power-consuming I/O buffers.
摘要:
A system and method for decoding command signals that includes a command decoder configured to generate internal control signals to perform an operation based on the command signals and an operating state. The same combination of command signals can request different commands depending on the operating state. A command is selected from a first set of operations according to the command signals when the memory system is in a first operating state and a command is selected from a second set of operations according to the command signals when the memory system is in a second operating state.