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公开(公告)号：US20200075437A1
公开(公告)日：2020-03-05
申请号：US16540735
申请日：2019-08-14
Applicant: CANON KABUSHIKI KAISHA
Inventor： Satoshi Nozu , Yu Aoki , Hirotaka Sekiguchi , Koji Sato , Koji Tsuduki
IPC: H01L23/053 , H01L25/065 , H01L23/538 , H01L23/15 , H01L23/00 , H01L31/0203 , H01L33/48
Abstract: A unit includes a wiring board having a first face having a mounting portion on which an electronic device is mounted, a second face opposite to the first face, and end faces continuous with the first face and the second face, a resin member provided to cover the end faces and to have protrusions protruding upward from the end faces to face each other across a space above the mounting portion, and an insulating film covering the second face, wherein at least a part of an edge of the insulating film is provided away from an end of the second face on the end face side.
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公开(公告)号：US09978675B2
公开(公告)日：2018-05-22
申请号：US15350664
申请日：2016-11-14
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takanori Suzuki , Fujio Ito , Tadashi Kosaka , Takao Toyooka , Koji Tsuduki , Yasushi Kurihara , Ikuto Kimura
IPC: H01L23/498 , H01L23/495 , H01L23/055 , H01L23/057 , H01L23/50 , H01L21/48
CPC classification number: H01L23/49861 , H01L21/4842 , H01L23/055 , H01L23/057 , H01L23/49503 , H01L23/49541 , H01L23/49551 , H01L23/49555 , H01L23/49805 , H01L23/50 , H01L2224/48247 , H01L2224/78301 , H01L2224/85181
Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.
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3.发明授权公开(公告)号：US09585287B2
公开(公告)日：2017-02-28
申请号：US14520284
申请日：2014-10-21
Applicant: CANON KABUSHIKI KAISHA
Inventor： Yu Katase , Fujio Ito , Tadashi Kosaka , Koji Tsuduki , Ichiro Kataoka
IPC: H05K7/20 , H01L23/36 , H01L23/055 , H01L23/498
CPC classification number: H05K7/2039 , H01L23/055 , H01L23/36 , H01L23/49822 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
Abstract translation: 电子部件包括电子设备和容纳电子设备的容器。 容器包括具有第一区域的基座，电子设备被固定到第一区域，围绕第一区域的第二区域，跨越空间的面向电子设备的盖子以及固定到第二区域以围绕空间的框架。 框架包括第一构件和具有比第一构件和基座的热导率低的导热率的第二构件。 第一构件在基座的外边缘的两侧上分别在框架的内边缘和外边缘侧上具有第一和第二部分。 第二构件位于盖和第一构件之间。 第一构件和基座之间的最短距离小于第一构件和盖之间的距离。
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公开(公告)号：US20160044796A1
公开(公告)日：2016-02-11
申请号：US14817013
申请日：2015-08-03
Applicant: CANON KABUSHIKI KAISHA
Inventor： Ichiro Kataoka , Hiroshi Kondo , Tadashi Kosaka , Koji Tsuduki , Hisatane Komori , Shin Hasegawa
CPC classification number: B23K1/0016 , H01L2224/48091 , H01L2924/16195 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K2201/09663 , H05K2201/099 , Y02P70/613 , H01L2924/00014
Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
Abstract translation: 一种方法包括将焊膏分别施加到第一部件的第一和第二部分; 将焊膏施加到第一部件的第一部分和第二部件的第一部分彼此接触，并将焊膏施加到第一部件的第二部分和第二部件的第二部分上， 与其他人接触 并使焊膏与第二部件的第一部分接触，并且与第二部件的第二部分接触的焊膏熔化。 在熔化时，通过熔化与第二部件的第一部分接触的焊膏形成的熔融焊料和熔化与第二部件的第二部分接触的焊膏形成的熔融焊料彼此接合。
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5.发明授权Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus 有权电子部件，电子模块，其制造方法，安装部件和电子设备公开(公告)号：US09220172B2
公开(公告)日：2015-12-22
申请号：US13869829
申请日：2013-04-24
Applicant: CANON KABUSHIKI KAISHA
Inventor： Koji Tsuduki , Takanori Suzuki , Tadashi Kosaka , Yasuhiro Matsuki , Shin Hasegawa , Fujio Ito , Hisatane Komori , Yasushi Kurihara
IPC: H05K5/00 , H05K7/02 , H05K13/04 , H01L23/057 , H01L23/10
CPC classification number: H05K5/0091 , H01L23/057 , H01L23/10 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H05K13/04 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition αL, αF, αB
Abstract translation: 一种电子部件的制造方法，其特征在于，包括：准备安装部件的第一工序，该安装部件通过将具有与配线部件连接的外部端子的基体的周边区域与框体接合而形成，同时对基体和框体进行加热 ; 将电子设备固定到基体的第二步骤; 以及接合盖体和框体的第三步骤。 满足条件αL，αF，αB<αC，其中αL是盖体的热膨胀系数，αF是框体的热膨胀系数，αB是基体的热膨胀系数，αC是 布线部件的热膨胀系数。
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Patent Agency Ranking
公开(公告)号：US09815133B2
公开(公告)日：2017-11-14
申请号：US14817013
申请日：2015-08-03
Applicant: CANON KABUSHIKI KAISHA
Inventor： Ichiro Kataoka , Hiroshi Kondo , Tadashi Kosaka , Koji Tsuduki , Hisatane Komori , Shin Hasegawa
CPC classification number: B23K1/0016 , H01L2224/48091 , H01L2924/16195 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K2201/09663 , H05K2201/099 , Y02P70/613 , H01L2924/00014
Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
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公开(公告)号：US09774769B2
公开(公告)日：2017-09-26
申请号：US14869768
申请日：2015-09-29
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takanori Suzuki , Koji Tsuduki , Hisatane Komori , Yasushi Kurihara
CPC classification number: H04N5/2253 , H05K1/111 , H05K1/117 , H05K3/3442 , H05K3/4697 , H05K2201/068 , H05K2201/09181 , H05K2201/094 , H05K2201/09409 , H05K2201/10151 , Y02P70/611
Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.
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公开(公告)号：US09197795B2
公开(公告)日：2015-11-24
申请号：US14189854
申请日：2014-02-25
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takamasa Sakuragi , Takanori Suzuki , Koji Tsuduki
IPC: H04N5/225 , H01L27/146 , H01L21/02
Abstract: A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane.
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9.发明授权Electronic component, mounting member, electronic apparatus, and their manufacturing methods 有权电子部件，安装部件，电子设备及其制造方法公开(公告)号：US09155212B2
公开(公告)日：2015-10-06
申请号：US13869852
申请日：2013-04-24
Applicant: CANON KABUSHIKI KAISHA
Inventor： Koji Tsuduki , Takanori Suzuki , Tadashi Kosaka , Yasuhiro Matsuki , Shin Hasegawa , Fujio Ito , Hisatane Komori , Yasushi Kurihara
CPC classification number: H05K5/0091 , H01L23/10 , H01L23/13 , H01L27/14618 , H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2924/16195 , Y10T156/10 , H01L2924/00014
Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.
Abstract translation: 基体包括设置有内端子组的基准台部和相对于基准台部位于封装的外缘的一侧的上台部，并且相对于基准台部通过台阶突出 部分。 框架主体结合到上部部分，并且框体的内边缘相对于台阶部位于包装的外边缘的一侧。
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10.发明申请ELECTRONIC COMPONENT, ELECTRONIC MODULE, THEIR MANUFACTURING METHODS, MOUNTING MEMBER, AND ELECTRONIC APPARATUS 有权电子元件，电子模块，其制造方法，安装构件和电子设备公开(公告)号：US20130286565A1
公开(公告)日：2013-10-31
申请号：US13869829
申请日：2013-04-24
Applicant: CANON KABUSHIKI KAISHA
Inventor： Koji Tsuduki , Takanori Suzuki , Tadashi Kosaka , Yasuhiro Matsuki , Shin Hasegawa , Fujio Ito , Hisatane Komori , Yasushi Kurihara
CPC classification number: H05K5/0091 , H01L23/057 , H01L23/10 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H05K13/04 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition αL, αF, αB
Abstract translation: 一种电子部件的制造方法，其特征在于，包括：准备安装部件的第一工序，该安装部件通过将具有与配线部件连接的外部端子的基体的周边区域与框体接合而形成，同时对基体和框体进行加热 ; 将电子设备固定到基体的第二步骤; 以及接合盖体和框体的第三步骤。 满足条件αL，αF，αB<αC，其中αL是盖体的热膨胀系数，αF是框体的热膨胀系数，αB是基体的热膨胀系数，αC是 布线部件的热膨胀系数。
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