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公开(公告)号：US11156783B2
公开(公告)日：2021-10-26
申请号：US16690574
申请日：2019-11-21
Applicant: Cisco Technology, Inc.
Inventor： Mark Webster , Ravi Sekhar Tummidi
Abstract: A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.
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公开(公告)号：US09343450B2
公开(公告)日：2016-05-17
申请号：US14276566
申请日：2014-05-13
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Vipulkumar Patel , Mark Webster , Prakash Gothoskar , Ravinder Kachru , Soham Pathak , Rao V. Yelamarty , Thomas Daugherty , Bipin Dama , Kaushik Patel , Kishor Desai
CPC classification number: H01L25/50 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/426 , H01L25/167 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
Abstract: A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.
Abstract translation: 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。
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公开(公告)号：US10608410B2
公开(公告)日：2020-03-31
申请号：US16436573
申请日：2019-06-10
Applicant: Cisco Technology, Inc.
Inventor： Matthew J. Traverso , Dominic F. Siriani , Mark Webster
IPC: H01S5/12 , H01S5/10 , G02B6/12 , H01S5/125 , H01S5/028 , H01S5/022 , H01S5/30 , H01S5/22 , H01S5/026
Abstract: The embodiments herein describe a single-frequency laser source (e.g., a distributed feedback (DFB) laser or distributed Bragg reflector (DBR) laser) that includes a feedback grating or mirror that extends along a waveguide. The grating may be disposed over a portion of the waveguide in an optical gain region in the laser source. Instead of the waveguide or cavity being linear, the laser includes a U-turn region so that two ends of the waveguide terminate at the same facet. That facet is coated with an anti-reflective (AR) coating.
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公开(公告)号：US10330960B2
公开(公告)日：2019-06-25
申请号：US15663333
申请日：2017-07-28
Applicant: Cisco Technology, Inc.
Inventor： Sean Anderson , Mark Webster , Kalpendu Shastri
Abstract: An optical demultiplexer that includes at least one a hybrid phase shifter configured to receive a light signal over a fiber element, the light signal including polarized optical signals. Each phase shifter includes a thermo-optic phase shifter configured to phase shift the light signal, an electro-optic phase shifter configured to phase shift the light signal, and a coupler configured to maintain polarization of the polarized signal components. The optical demultiplexer also includes control circuitry configured to regulate the thermo-optic and electro-optic phase shifters.
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公开(公告)号：US20170336656A1
公开(公告)日：2017-11-23
申请号：US15663333
申请日：2017-07-28
Applicant: Cisco Technology, Inc.
Inventor： Sean Anderson , Mark Webster , Kalpendu Shastri
CPC classification number: G02F1/015 , G02F1/0123 , G02F1/0147 , G02F1/025 , G02F1/225 , G02F2203/50
Abstract: An optical demultiplexer that includes at least one a hybrid phase shifter configured to receive a light signal over a fiber element, the light signal including polarized optical signals. Each phase shifter includes a thermo-optic phase shifter configured to phase shift the light signal, an electro-optic phase shifter configured to phase shift the light signal, and a coupler configured to maintain polarization of the polarized signal components. The optical demultiplexer also includes control circuitry configured to regulate the thermo-optic and electro-optic phase shifters.
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Patent Agency Ranking
公开(公告)号：US20150104130A1
公开(公告)日：2015-04-16
申请号：US14053135
申请日：2013-10-14
Applicant: Cisco Technology, Inc.
Inventor： Sean Anderson , Ravi Sekhar Tummidi , Mark Webster
IPC: G02B6/26
CPC classification number: G02B6/125 , G02B6/1228 , G02B2006/1215
Abstract: Embodiments of the present disclosure include devices that split a light beam into two separate paths, with reduced sensitivity to fabrication variation. The devices can operate as 3-dB splitters that divide the input optical energy equally between two output waveguides. Similarly, the devices can also function to combine two light beams into a single path (coupler). The designs make use of adiabatic modal evolution and do not require physical symmetry along the entire device length.
Abstract translation: 本公开的实施例包括将光束分成两个单独的路径，对制造变化的灵敏度降低的装置。 器件可以作为3-dB分离器工作，将输入光能平均分配在两个输出波导之间。 类似地，这些装置也可以用于将两个光束组合成单个路径（耦合器）。 设计使用绝热模态演化，并且不需要沿整个设备长度进行物理对称。
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公开(公告)号：US10481326B2
公开(公告)日：2019-11-19
申请号：US15899255
申请日：2018-02-19
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar Patel , Mark Webster , Ravi Tummidi , Mary Nadeau
Abstract: Embodiments herein describe a photonic chip which includes a coupling interface for evanescently coupling the chip to a waveguide on an external substrate. In one embodiment, the photonic chip includes a tapered waveguide that aligns with a tapered waveguide on the external substrate. The respective tapers of the two waveguides are inverted such that as the width of the waveguide in the photonic chip decreases, the width of the waveguide on the external substrate increases. In one embodiment, these two waveguides form an adiabatic structure where the optical signal transfers between the waveguides with minimal or no coupling of the optical signal to other non-intended modes. Using the two waveguides, optical signals can be transmitted between the photonic chip and the external substrate.
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公开(公告)号：US10320151B1
公开(公告)日：2019-06-11
申请号：US15953250
申请日：2018-04-13
Applicant: Cisco Technology, Inc.
Inventor： Matthew J. Traverso , Dominic F. Siriani , Mark Webster
Abstract: The embodiments herein describe a single-frequency laser source (e.g., a distributed feedback (DFB) laser or distributed Bragg reflector (DBR) laser) that includes a feedback grating or mirror that extends along a waveguide. The grating may be disposed over a portion of the waveguide in an optical gain region in the laser source. Instead of the waveguide or cavity being linear, the laser includes a U-turn region so that two ends of the waveguide terminate at the same facet. That facet is coated with an anti-reflective (AR) coating.
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公开(公告)号：US09933566B2
公开(公告)日：2018-04-03
申请号：US15143944
申请日：2016-05-02
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar Patel , Mark Webster , Ravi Tummidi , Mary Nadeau
CPC classification number: G02B6/12004 , G02B6/12002 , G02B6/1228 , G02B6/124 , G02B6/125 , G02B6/305 , G02B6/34 , G02B6/4206 , G02B6/4274 , G02B6/4291
Abstract: Embodiments herein describe a photonic chip which includes a coupling interface for evanescently coupling the chip to a waveguide on an external substrate. In one embodiment, the photonic chip includes a tapered waveguide that aligns with a tapered waveguide on the external substrate. The respective tapers of the two waveguides are inverted such that as the width of the waveguide in the photonic chip decreases, the width of the waveguide on the external substrate increases. In one embodiment, these two waveguides form an adiabatic structure where the optical signal transfers between the waveguides with minimal or no coupling of the optical signal to other non-intended modes. Using the two waveguides, optical signals can be transmitted between the photonic chip and the external substrate.
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公开(公告)号：US09618699B2
公开(公告)日：2017-04-11
申请号：US14658220
申请日：2015-03-15
Applicant: Cisco Technology, Inc.
Inventor： Ravi Sekhar Tummidi , Mark Webster , Vipulkumar Patel
CPC classification number: G02B6/30 , G02B6/107 , G02B6/12004 , G02B6/122 , G02B6/1228 , G02B6/136 , G02B2006/12061 , G02B2006/121 , G02B2006/12142
Abstract: Embodiments herein describe disposing a waveguide adapter onto an SOI device after the components on a silicon surface layer have been formed. That is, the waveguide adapter is disposed above optical components (e.g., optical modulators, detectors, waveguides, etc) formed in a surface layer. In one embodiment, a waveguide in a bottom layer of the waveguide adapter overlaps a silicon waveguide in the surface layer such that the silicon waveguide and the waveguide in the bottom layer are optically coupled. The waveguide adapter also includes other layers above the bottom layer (e.g., middle and top layers) that also contain waveguides which form an adiabatic optical system for transmitting an optical signal. At least one of the waveguides in the multi-layer adapter is exposed at an optical interface of the SOI device, thereby permitting the SOI device to transmit optical signals to, or receive optical signals from, an external optical component.
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