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    Method of fabricating patterned-mirror VCSELs using selective growth
    2.
    发明授权
    Method of fabricating patterned-mirror VCSELs using selective growth 失效
    使用选择性生长制造图案镜VCSEL的方法

    公开(公告)号：US5478774A

    公开(公告)日：1995-12-26

    申请号：US261276

    申请日：1994-06-15

    申请人： Donald E. Ackley ,  Piotr Grodzinski ,  Michael S. Lebby ,  Hsing-Chung Lee ,  Chan-Long Shieh

    发明人： Donald E. Ackley ,  Piotr Grodzinski ,  Michael S. Lebby ,  Hsing-Chung Lee ,  Chan-Long Shieh

    IPC分类号： H01S5/00 ,  H01S5/042 ,  H01S5/183 ,  H01S5/22 ,  H01L21/20

    CPC分类号： H01S5/18308 ,  H01S5/18305 ,  H01S5/18327 ,  H01S5/2214 ,  Y10S438/969

    摘要： A method of fabricating VCSELs including the steps of epitaxially growing a first mirror stack of a first conductivity type, an active region on the first mirror stack, and a first portion of a second mirror stack of a second conductivity type on the active region. A dielectric layer is then formed on the first portion of the second mirror stack, patterned to define an operating region and a remaining portion of the second mirror stack is epitaxially grown on the first portion to form a complete second mirror stack. Portions of the second mirror stack overlying the dielectric layer are polycrystalline in formation and substantially limit the remaining portion of the second mirror stack to the operating region. The polycrystalline layers can then be removed and electrical contacts formed.

    摘要翻译： 一种制造VCSEL的方法，包括以下步骤：在有源区上外延生长第一导电类型的第一反射镜叠层，第一反射镜叠层上的有源区和第二导电类型的第二反射镜叠层的第一部分。 然后在第二反射镜叠层的第一部分上形成电介质层，其被图案化以限定操作区域，并且在第一部分上外延生长第二反射镜叠层的剩余部分以形成完整的第二反射镜叠层。 覆盖在介电层上的第二反射镜叠层的部分在形成时是多晶的，并且基本上将第二反射镜叠层的剩余部分限制到操作区域。 然后可以去除多晶层并形成电接触。

    LASER ANNEALING OF METAL OXIDE SEMICONDUCTOR ON TEMPERATURE SENSITIVE SUBSTRATE FORMATIONS
    4.
    发明申请
    LASER ANNEALING OF METAL OXIDE SEMICONDUCTOR ON TEMPERATURE SENSITIVE SUBSTRATE FORMATIONS 有权
    金属氧化物半导体在温度敏感基板上的激光退火

    公开(公告)号：US20110062431A1

    公开(公告)日：2011-03-17

    申请号：US12874145

    申请日：2010-09-01

    申请人： Chan-Long Shieh ,  Hsing-Chung Lee

    发明人： Chan-Long Shieh ,  Hsing-Chung Lee

    IPC分类号： H01L29/786 ,  H01L21/34

    CPC分类号： H01L21/268 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/78693

    摘要： A method of annealing a metal oxide on a temperature sensitive substrate formation includes the steps of providing a temperature sensitive substrate formation and forming a spacer layer on a surface of the substrate formation. A metal oxide semiconductor device is formed on the spacer layer, the device includes at least a layer of amorphous metal oxide semiconductor material, an interface of the amorphous metal oxide layer with a dielectric layer, and a gate metal layer adjacent the layer of amorphous metal oxide semiconductor material and the interface. The method then includes the step of at least partially annealing the layer of metal oxide semiconductor material by heating the adjacent gate metal layer with pulses of infra red radiation to improve the mobility and operating stability of the amorphous metal oxide semiconductor material while retaining at least the amorphous metal oxide semiconductor material adjacent the gate metal layer amorphous.

    摘要翻译： 在温度敏感的基板形成上退火金属氧化物的方法包括以下步骤：在基板结构的表面上形成温度敏感的基板并形成间隔层。 金属氧化物半导体器件形成在间隔层上，该器件至少包括一层非晶金属氧化物半导体材料，非晶金属氧化物层与电介质层的界面，以及与非晶金属层相邻的栅极金属层 氧化物半导体材料和界面。 该方法然后包括通过用红外辐射脉冲加热相邻栅极金属层来至少部分地退火金属氧化物半导体材料层的步骤，以提高非晶金属氧化物半导体材料的迁移率和操作稳定性，同时至少保留 非晶态金属氧化物半导体材料与栅极金属层相邻无定形。

    LED display packaging with substrate removal and method of fabrication
    6.
    发明授权
    LED display packaging with substrate removal and method of fabrication 失效
    LED显示包装与基板去除及其制造方法

    公开(公告)号：US5780321A

    公开(公告)日：1998-07-14

    申请号：US699263

    申请日：1996-08-19

    申请人： Chan-Long Shieh ,  Hsing-Chung Lee ,  Paige M. Holm

    发明人： Chan-Long Shieh ,  Hsing-Chung Lee ,  Paige M. Holm

    IPC分类号： H01L21/60 ,  G09F9/33 ,  H01L25/16 ,  H01L27/15 ,  H01L33/00 ,  H01L21/00

    CPC分类号： H01L27/156 ,  H01L25/162 ,  H01L25/167 ,  H01L2924/0002

    摘要： A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.

    摘要翻译： 一种发光二极管显示器封装以及制造在衬底上包括发光二极管阵列的发光二极管（LED）显示器封装的方法，所述发光二极管阵列具有布置成显示位于所述LED阵列器件的最上表面上的连接焊盘的行和列连接焊盘 ，具有连接到最上表面的连接焊盘的单独的硅驱动器装置，其被定位成在正确地注册时协同地与LED器件的那些耦合，使用标准C5 DCA将LED装置倒装芯片凸块结合到驱动器装置，底部填充层位于 LED设备和驱动器设备定义的空间。 LED显示器和驱动器件封装件随后选择性地去除了最初形成LED阵列的衬底。 从LED显示装置发射的光通过LED装置的剩余的铟 - 镓 - 铝 - 磷化物（InGaAlP）外延层发射。

    Method of fabricating organic LED matrices
    7.
    发明授权
    Method of fabricating organic LED matrices 失效
    制造有机LED矩阵的方法

    公开(公告)号：US5641611A

    公开(公告)日：1997-06-24

    申请号：US517223

    申请日：1995-08-21

    申请人： Chan-Long Shieh ,  Hsing-Chung Lee

    发明人： Chan-Long Shieh ,  Hsing-Chung Lee

    IPC分类号： G09F9/33 ,  H01L51/40 ,  H01L51/50 ,  B05D1/32 ,  G03C5/56

    CPC分类号： H01L51/0008 ,  H01L51/0011 ,  H01L51/5012

    摘要： Items of material are patterned on a substrate by forming a layer of photoresist on the substrate and a layer of metal on the photoresist. The photoresist is patterned to define an opening exposing a portion of the substrate and the metal is patterned to define an aperture smaller than the opening so as to divide the exposed surface of the substrate into shadow areas and a non-shadow area. A first material system is evaporated generally perpendicular to the aperture to form a first organic light emitting diode on the surface of the substrate in the non-shadow area and second and third material systems are evaporated at angles to the aperture to form second and third organic light emitting diodes in the shadow areas. Passivation material is evaporated perpendicularly onto the first diode and at the angle onto the second diode.

    摘要翻译： 通过在衬底上形成光致抗蚀剂层和光致抗蚀剂上的金属层，在衬底上图案化材料。 光致抗蚀剂被图案化以限定露出衬底的一部分的开口，并且图案化金属以限定小于开口的孔，以将衬底的暴露表面划分为阴影区域和非阴影区域。 第一材料系统通常垂直于孔径蒸发以在非阴影区域中在衬底的表面上形成第一有机发光二极管，并且第二和第三材料系统与孔成角度地蒸发以形成第二和第三有机 阴影区域的发光二极管。 钝化材料垂直地蒸发到第一二极管上并以一定角度蒸发到第二二极管上。

    Light emitting diode display package
    8.
    发明授权
    Light emitting diode display package 失效
    发光二极管显示封装

    公开(公告)号：US5621225A

    公开(公告)日：1997-04-15

    申请号：US599434

    申请日：1996-01-18

    申请人： Chan-Long Shieh ,  Hsing-Chung Lee ,  Paige M. Holm

    发明人： Chan-Long Shieh ,  Hsing-Chung Lee ,  Paige M. Holm

    IPC分类号： H01L21/60 ,  G09F9/33 ,  H01L25/16 ,  H01L27/15 ,  H01L33/00 ,  H01L23/48

    CPC分类号： H01L27/156 ,  H01L25/162 ,  H01L25/167 ,  H01L2924/0002

    摘要： A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.

    摘要翻译： 一种发光二极管显示器封装以及制造在衬底上包括发光二极管阵列的发光二极管（LED）显示器封装的方法，所述发光二极管阵列具有布置成显示位于所述LED阵列器件的最上表面上的连接焊盘的行和列连接焊盘 ，具有连接到最上表面的连接焊盘的单独的硅驱动器器件，其被定位成在正确地注册时协同地与LED器件的LED器件匹配，使用标准C5 DCA将LED器件倒装芯片凸块结合到驱动器器件，底部填充层位于 LED设备和驱动器设备定义的空间。 LED显示器和驱动器件封装件随后选择性地去除了最初形成LED阵列的衬底。 从LED显示装置发射的光通过LED装置的剩余的铟 - 镓 - 铝 - 磷化物（InGaAlP）外延层发射。

    RECONFIGURABLE COLOR SIGNAGE USING BISTABLE LIGHT VALVE
    9.
    发明申请
    RECONFIGURABLE COLOR SIGNAGE USING BISTABLE LIGHT VALVE 审中-公开
    可重复使用双色阀的颜色信号

    公开(公告)号：US20080174519A1

    公开(公告)日：2008-07-24

    申请号：US11625904

    申请日：2007-01-23

    申请人： Chan-Long Shieh ,  Hsing-Chung Lee

    发明人： Chan-Long Shieh ,  Hsing-Chung Lee

    IPC分类号： G09G3/20

    CPC分类号： G09G3/344 ,  G02F1/157 ,  G02F1/167 ,  G09G2300/0426 ,  G09G2300/08

    摘要： Reconfigurable color signage includes an array of light valves each having memory. An active matrix including a plurality of conductive select and data lines is positioned on one side of the array. Each light valve is electrically coupled to be separately addressable by a unique combination of select and data line. The active matrix has a write mode in which signals are supplied to each light valve to provide a selected light transmittance and a display mode in which the memory of each light valve retains the selected transmittance after the signals of the write mode have been removed. A backlight is positioned to direct light in a light path through the array and a color filter is positioned in the light path to define a plurality of pixels, including one red, green, and blue filter for each pixel, and each positioned to be associated with a separate light valve.

    摘要翻译： 可重构颜色标志包括各自具有记忆的光阀阵列。 包括多个导电选择和数据线的有源矩阵位于阵列的一侧。 每个光阀电耦合以通过选择和数据线的独特组合单独寻址。 有源矩阵具有写入模式，其中向每个光阀提供信号以提供所选择的透光率和显示模式，其中每个光阀的存储器在写入模式的信号已被去除之后保持所选择的透射率。 背光被定位成将光引导到穿过阵列的光路中，并且滤光器被定位在光路中以限定多个像素，每个像素包括用于每个像素的一个红色，绿色和蓝色滤光器，并且每个像素定位成相关联 配有独立的光阀。