Printed circuit board including embedded passive component and method of fabricating same
    4.
    发明申请
    Printed circuit board including embedded passive component and method of fabricating same 有权
    包括嵌入式无源元件的印刷电路板及其制造方法

    公开(公告)号:US20060054352A1

    公开(公告)日:2006-03-16

    申请号:US11020466

    申请日:2004-12-22

    申请人: Chang Ryu Myung Kang

    发明人: Chang Ryu Myung Kang

    IPC分类号: H05K7/06

    摘要: Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

    摘要翻译: 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成,镀有第一导电材料,并彼此隔开预定距离。 嵌入式无源部件插入在端子之间,并且具有形成在其两侧的电极。 电极与端子分开预定距离,并通过第二导电材料与端子电连接。

    Apparatus and method for recognizing positive/negative intention using fine change of gamma wave of brainwave
    5.
    发明申请
    Apparatus and method for recognizing positive/negative intention using fine change of gamma wave of brainwave 失效
    使用脑波伽马波精细变化识别正/负意图的装置和方法

    公开(公告)号:US20050137493A1

    公开(公告)日:2005-06-23

    申请号:US10800763

    申请日:2004-03-16

    IPC分类号: A61B5/0476 A61B5/04 G06F3/01

    CPC分类号: G06F3/015

    摘要: Provided are an apparatus and a method for recognizing positive/negative intention using a fine change of gamma wave of a brainwave comprising the steps of detecting the brainwave from a head of a user, receiving and amplifying the brainwave detected from the step of detecting the brainwave, converting the amplified analog brainwave to one of a digital type, and recognizing the positive/negative intention of the user by detecting the fine change of the gamma wave of the brainwave in the digital type, which is transmitted from the A/D converting portion, whereby it is possible to implement an application of a real time interface and minimizes inconvenience for the user, and it requires no separate user practice.

    摘要翻译: 提供了使用脑波伽马波的精细变化来识别正/负意图的装置和方法,包括以下步骤:从用户的头部检测脑波,接收和放大从检测脑波的步骤检测到的脑波 将放大的模拟脑波转换为数字类型之一,并且通过检测从A / D转换部分发送的数字类型的脑波的伽马波的微小变化来识别用户的正/负意图 ,由此可以实现实时接口的应用并且最小化用户的不便,并且不需要单独的用户练习。

    Solder bonding structure using bridge type pattern
    6.
    发明申请
    Solder bonding structure using bridge type pattern 审中-公开
    焊接结构采用桥式图案

    公开(公告)号:US20070126126A1

    公开(公告)日:2007-06-07

    申请号:US11634221

    申请日:2006-12-06

    IPC分类号: H01L23/48

    摘要: Disclosed is a solder bonding structure for flip chip connection. Particularly, this invention relates to a solder bonding structure, in which the shape of a connection pad on which solder is applied is changed to thus increase the size of the solder bond that is formed using a reflow process, resulting in highly reliable solder bonding. To this end, the solder bonding structure is composed of a connection pad (a bridge type pattern) composed of at least two pattern regions spaced apart from each other by a predetermined interval, a solder bond formed on the connection pad having such a shape, and a metal bump in contact with the solder bond. In such a solder bonding structure, the solder bond is formed to a sufficient size on a fine pattern having a smaller width, thus achieving reliable solder bonding between the semiconductor chip having the metal bump and the printed circuit board having the connection pad. Further, since the connection pad may be realized through a typical formation process thereof without the need for an additional process, the reliability of the solder bonding may be sufficiently assured without an increase in the working man-hours or in the number of processes.

    摘要翻译: 公开了一种用于倒装芯片连接的焊接结合结构。 特别地,本发明涉及焊接接合结构,其中施加焊料的连接焊盘的形状改变,从而增加使用回流工艺形成的焊料接合的尺寸,导致高度可靠的焊接。 为此,焊接接合结构由由至少两个彼此间隔开的图案区域构成的连接焊盘(桥式图案)构成,形成在具有这种形状的连接焊盘上的焊料接合, 以及与焊料接合的金属凸块。 在这种焊接结构中,焊接接合形成为具有较小宽度的精细图案的足够的尺寸,从而在具有金属凸块的半导体芯片和具有连接焊盘的印刷电路板之间实现可靠的焊接。 此外,由于可以通过其典型的形成工艺实现连接焊盘,而不需要额外的工艺,可以充分确保焊接接合的可靠性,而不增加工作工时或工艺数量。

    High frequency signal transmission line having reduced noise
    7.
    发明申请
    High frequency signal transmission line having reduced noise 失效
    高频信号传输线具有降低的噪声

    公开(公告)号:US20060146484A1

    公开(公告)日:2006-07-06

    申请号:US11222398

    申请日:2005-09-07

    IPC分类号: H02B1/00

    CPC分类号: H05K1/0219 H05K2201/09618

    摘要: A high frequency signal transmission line having reduced noise. Particularly, a signal transmission line of the current invention has reduced radiation noise and reflection noise, because a conventional ground guard fence line disposed between signal lines is separated into a plurality of ground line blocks that are spaced apart from each other to shield against noise.

    摘要翻译: 具有降低噪声的高频信号传输线。 特别地,本发明的信号传输线由于将设置在信号线之间的传统的接地保护栅栏线分离成彼此间隔开的多个接地线块以防止噪声,所以本发明的信号传输线具有降低的辐射噪声和反射噪声。

    Electrode-connector protecting cap and electrode-connector including the same
    8.
    发明申请
    Electrode-connector protecting cap and electrode-connector including the same 失效
    电极连接器保护盖和包括其的电极连接器

    公开(公告)号:US20050137472A1

    公开(公告)日:2005-06-23

    申请号:US10784978

    申请日:2004-02-25

    摘要: Provided is an electrode-connector protecting cap for ambulatory physiological signal measurement comprising a hemisphere cap, a wing positioned at a periphery of the hemisphere cap and having a contact surface connected to the electrode-connector; and an opening for a wire to be passed through and formed in the hemisphere cap, and an electrode-connector including the same, whereby a connection between the electrode and the connector can be protected and the noise occurrence can be prevented.

    摘要翻译: 提供一种用于动态生理信号测量的电极连接器保护帽,包括半球形帽,位于半球形帽的周边的翼,并具有连接到电极连接器的接触表面; 以及用于使导线穿过并形成在半球形盖中的开口,以及包括该开口的电极连接器,由此能够保护电极和连接器之间的连接并且可以防止噪音的产生。