公开(公告)号：US20050261564A1

公开(公告)日：2005-11-24

申请号：US11085526

申请日：2005-03-22

申请人： Chang Ryu ,  Seung Shin ,  Seung Nam ,  Jae Kang ,  Yoon Song ,  Tae Yim ,  Seunghwan Kim ,  Yun Kim

发明人： Chang Ryu ,  Seung Shin ,  Seung Nam ,  Jae Kang ,  Yoon Song ,  Tae Yim ,  Seunghwan Kim ,  Yun Kim

IPC分类号： A61B5/04 ,  A61B5/00 ,  A61B5/0408 ,  A61B5/05

CPC分类号： A61B5/6804 ,  A61B5/0006 ,  A61B5/04085

摘要： Provided are a wearable physiological signal detection module and a measurement apparatus having the same. A physiological signal detection module including a measuring electrode implemented by a dry electrode having good conductivity to detect various physiological signals is detachably disposed inside the clothing closely adhered to user's skin. The measuring electrode can be in stable contact with the user's skin as well as the detection module can be conveniently worn for a long time. The various physiological signals detected by the measuring electrodes are wirelessly transmitted to an external device, thereby conveniently monitoring the physiological signal of the user in real time.

摘要翻译： 提供了一种穿戴式生理信号检测模块和具有该生理信号检测模块的测量装置。 包括由具有良好导电性的干电极实现的用于检测各种生理信号的测量电极的生理信号检测模块可拆卸地设置在紧贴于使用者皮肤的衣物内。 测量电极可以与使用者的皮肤保持稳定的接触，并且检测模块可以方便地长时间佩戴。 由测量电极检测的各种生理信号被无线地传输到外部设备，从而实时地方便地监视用户的生理信号。

公开(公告)号：US20050137493A1

公开(公告)日：2005-06-23

申请号：US10800763

申请日：2004-03-16

申请人： Chang Ryu ,  Yoon Song ,  Seung Nam ,  Tae Yim ,  Chang Ryu

发明人： Chang Ryu ,  Yoon Song ,  Seung Nam ,  Tae Yim ,  Chang Ryu

IPC分类号： A61B5/0476 ,  A61B5/04 ,  G06F3/01

CPC分类号： G06F3/015

摘要： Provided are an apparatus and a method for recognizing positive/negative intention using a fine change of gamma wave of a brainwave comprising the steps of detecting the brainwave from a head of a user, receiving and amplifying the brainwave detected from the step of detecting the brainwave, converting the amplified analog brainwave to one of a digital type, and recognizing the positive/negative intention of the user by detecting the fine change of the gamma wave of the brainwave in the digital type, which is transmitted from the A/D converting portion, whereby it is possible to implement an application of a real time interface and minimizes inconvenience for the user, and it requires no separate user practice.

摘要翻译： 提供了使用脑波伽马波的精细变化来识别正/负意图的装置和方法，包括以下步骤：从用户的头部检测脑波，接收和放大从检测脑波的步骤检测到的脑波 将放大的模拟脑波转换为数字类型之一，并且通过检测从A / D转换部分发送的数字类型的脑波的伽马波的微小变化来识别用户的正/负意图 ，由此可以实现实时接口的应用并且最小化用户的不便，并且不需要单独的用户练习。

公开(公告)号：US20070073131A1

公开(公告)日：2007-03-29

申请号：US11523989

申请日：2006-09-20

申请人： Chang Ryu ,  Seung Kim ,  Seung Nam ,  Seung Shin ,  Hyun Lee ,  Kyung Hong

发明人： Chang Ryu ,  Seung Kim ,  Seung Nam ,  Seung Shin ,  Hyun Lee ,  Kyung Hong

IPC分类号： A61B5/04

CPC分类号： A61B5/0408 ,  A41D13/1281 ,  A61B5/6805

摘要： Provided is a garment for measuring a physiological signal. The garment includes: an inner layer made of an elastic mesh fabric; a physiological signal measuring electrode including a connector connected to an external line and an electrode having a protrusion and measuring a physiological signal, the protrusion of the electrode passing through a mesh of the inner layer and engaging with the connector to be attached to the inner layer; and a compressing cushion interposed between an outer layer and the inner layer and compressing the physiological signal measuring electrode to a human body. Accordingly, poor contact between the physiological signal measuring electrode and the human body can be prevented and noise generated when measuring the physiological signal can be reduced.

摘要翻译： 提供了用于测量生理信号的服装。 该服装包括：由弹性网状织物制成的内层; 生理信号测量电极，其包括连接到外线的连接器和具有突起并测量生理信号的电极，所述电极的突出部穿过内层的网状物并与要连接到内层的连接器接合 ; 以及插入在外层和内层之间并且将生理信号测量电极压缩到人体的压缩垫。 因此，可以防止生理信号测量电极和人体之间的接触不良，并且可以减少测量生理信号时产生的噪音。

公开(公告)号：US20050137472A1

公开(公告)日：2005-06-23

申请号：US10784978

申请日：2004-02-25

申请人： Chang Ryu ,  Seung Kim ,  Yun Kim

发明人： Chang Ryu ,  Seung Kim ,  Yun Kim

IPC分类号： A61B5/0408 ,  A61B5/0432 ,  A61B5/04

CPC分类号： A61B5/6805 ,  A61B5/0408 ,  A61B5/04085 ,  A61B5/0432

摘要： Provided is an electrode-connector protecting cap for ambulatory physiological signal measurement comprising a hemisphere cap, a wing positioned at a periphery of the hemisphere cap and having a contact surface connected to the electrode-connector; and an opening for a wire to be passed through and formed in the hemisphere cap, and an electrode-connector including the same, whereby a connection between the electrode and the connector can be protected and the noise occurrence can be prevented.

摘要翻译： 提供一种用于动态生理信号测量的电极连接器保护帽，包括半球形帽，位于半球形帽的周边的翼，并具有连接到电极连接器的接触表面; 以及用于使导线穿过并形成在半球形盖中的开口，以及包括该开口的电极连接器，由此能够保护电极和连接器之间的连接并且可以防止噪音的产生。

公开(公告)号：US20070126126A1

公开(公告)日：2007-06-07

申请号：US11634221

申请日：2006-12-06

申请人： Seung Kim ,  Je Yoo ,  Yong Lee ,  Yoo Wee ,  Seok Huh ,  Chang Ryu

发明人： Seung Kim ,  Je Yoo ,  Yong Lee ,  Yoo Wee ,  Seok Huh ,  Chang Ryu

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L2224/13028 ,  H01L2924/0002 ,  H05K1/111 ,  H05K2201/09663 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

摘要： Disclosed is a solder bonding structure for flip chip connection. Particularly, this invention relates to a solder bonding structure, in which the shape of a connection pad on which solder is applied is changed to thus increase the size of the solder bond that is formed using a reflow process, resulting in highly reliable solder bonding. To this end, the solder bonding structure is composed of a connection pad (a bridge type pattern) composed of at least two pattern regions spaced apart from each other by a predetermined interval, a solder bond formed on the connection pad having such a shape, and a metal bump in contact with the solder bond. In such a solder bonding structure, the solder bond is formed to a sufficient size on a fine pattern having a smaller width, thus achieving reliable solder bonding between the semiconductor chip having the metal bump and the printed circuit board having the connection pad. Further, since the connection pad may be realized through a typical formation process thereof without the need for an additional process, the reliability of the solder bonding may be sufficiently assured without an increase in the working man-hours or in the number of processes.

摘要翻译： 公开了一种用于倒装芯片连接的焊接结合结构。 特别地，本发明涉及焊接接合结构，其中施加焊料的连接焊盘的形状改变，从而增加使用回流工艺形成的焊料接合的尺寸，导致高度可靠的焊接。 为此，焊接接合结构由由至少两个彼此间隔开的图案区域构成的连接焊盘（桥式图案）构成，形成在具有这种形状的连接焊盘上的焊料接合， 以及与焊料接合的金属凸块。 在这种焊接结构中，焊接接合形成为具有较小宽度的精细图案的足够的尺寸，从而在具有金属凸块的半导体芯片和具有连接焊盘的印刷电路板之间实现可靠的焊接。 此外，由于可以通过其典型的形成工艺实现连接焊盘，而不需要额外的工艺，可以充分确保焊接接合的可靠性，而不增加工作工时或工艺数量。

公开(公告)号：US20060146484A1

公开(公告)日：2006-07-06

申请号：US11222398

申请日：2005-09-07

申请人： Young Kim ,  Chang Ryu ,  Han Kim ,  Woo Chae

发明人： Young Kim ,  Chang Ryu ,  Han Kim ,  Woo Chae

IPC分类号： H02B1/00

CPC分类号： H05K1/0219 ,  H05K2201/09618

摘要： A high frequency signal transmission line having reduced noise. Particularly, a signal transmission line of the current invention has reduced radiation noise and reflection noise, because a conventional ground guard fence line disposed between signal lines is separated into a plurality of ground line blocks that are spaced apart from each other to shield against noise.

摘要翻译： 具有降低噪声的高频信号传输线。 特别地，本发明的信号传输线由于将设置在信号线之间的传统的接地保护栅栏线分离成彼此间隔开的多个接地线块以防止噪声，所以本发明的信号传输线具有降低的辐射噪声和反射噪声。

公开(公告)号：US20060049913A1

公开(公告)日：2006-03-09

申请号：US11022074

申请日：2004-12-22

申请人： Myung Kang ,  Chang Ryu ,  Jong Hong

发明人： Myung Kang ,  Chang Ryu ,  Jong Hong

IPC分类号： H01C1/012

CPC分类号： H01C7/003 ,  H01C17/065 ,  H01C17/0652 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/167 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/42 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09645 ,  H05K2203/1476

摘要： Disclosed is a PCB including an embedded resistor and a method of fabricating the same. The PCB includes a plurality of circuit layers in which circuit patterns are formed. A plurality of insulating layers is each interposed between the circuit layers. The embedded resistor is made of a resistive material and received in a receiving hole formed in the plurality of circuit layers and the plurality of insulating layers such that walls defining the receiving hole extends from one of the circuit layers to another circuit layer. The receiving hole has a closed section, and a conductive material is plated on the opposite walls of the walls defining the receiving hole.

摘要翻译： 公开了一种包括嵌入式电阻器的PCB及其制造方法。 PCB包括形成电路图案的多个电路层。 在电路层之间分别插入多个绝缘层。 嵌入式电阻器由电阻材料制成并且被容纳在形成在多个电路层和多个绝缘层中的接收孔中，使得限定接收孔的壁从电路层之一延伸到另一个电路层。 接收孔具有闭合部分，并且导电材料被电镀在限定接收孔的壁的相对壁上。

公开(公告)号：US20060272701A1

公开(公告)日：2006-12-07

申请号：US10537943

申请日：2003-12-09

申请人： Pulickel Ajayan ,  Amanda Ellis ,  Chang Ryu ,  Seamus Curran

发明人： Pulickel Ajayan ,  Amanda Ellis ,  Chang Ryu ,  Seamus Curran

IPC分类号： H01L31/00

CPC分类号： H01L51/0049 ,  B82Y10/00 ,  H01L51/0012 ,  H01L51/0071 ,  H01L51/0072 ,  H01L51/4206 ,  H01L51/424 ,  H01L51/4253 ,  H01L51/4266 ,  Y02E10/549

摘要： An organic photovoltaic conversion device, such as a solar cell includes a matrix material, such as a polymer matrix material, carbon nanotubes dispersed in the matrix material, and photovoltaic organic molecules, such as organic dye molecules, attached to defect sites on the carbon nanotubes.

摘要翻译： 诸如太阳能电池的有机光电转换装置包括基质材料，例如聚合物基体材料，分散在基体材料中的碳纳米管，以及附着到碳纳米管上的缺陷部位的光电有机分子，例如有机染料分子 。

公开(公告)号：US20060207791A1

公开(公告)日：2006-09-21

申请号：US11356524

申请日：2006-02-16

申请人： Han Kim ,  Chang Ryu ,  Young Lee

发明人： Han Kim ,  Chang Ryu ,  Young Lee

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H05K1/162 ,  H05K2201/091 ,  H05K2201/09309 ,  H05K2201/09509 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the dielectric layer, and an upper electrode layer formed on the dielectric layer and configured to have at least one first blind via hole that is inwardly formed.

摘要翻译： 本发明涉及电容器嵌入式PCB及其制造方法。 电容器嵌入式PCB包括电介质层，在电介质层下形成的下电极层和形成在电介质层上的上电极层，并且被配置为具有至少一个向内形成的第一盲通孔。

公开(公告)号：US20060196691A1

公开(公告)日：2006-09-07

申请号：US11365219

申请日：2006-02-28

申请人： Jin Ahn ,  Cheol Hwang ,  Sung Kim ,  Chang Ryu ,  Suk Cho ,  Ho Jeon

发明人： Jin Ahn ,  Cheol Hwang ,  Sung Kim ,  Chang Ryu ,  Suk Cho ,  Ho Jeon

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/06

CPC分类号： H05K1/162 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09881 ,  Y10S438/957 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.