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    Method of fabricating light emitting diode using laser lift-off technique and laser lift-off apparatus having heater
    3.
    发明授权
    Method of fabricating light emitting diode using laser lift-off technique and laser lift-off apparatus having heater 有权
    使用激光剥离技术制造发光二极管的方法和具有加热器的激光剥离装置

    公开(公告)号：US08624159B2

    公开(公告)日：2014-01-07

    申请号：US13410884

    申请日：2012-03-02

    申请人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hwa Mok Kim

    发明人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hwa Mok Kim

    IPC分类号： B23K26/02

    CPC分类号： H01L33/0079

    摘要： An approach is provided for fabricating a light emitting diode using a laser lift-off apparatus. The approach includes growing an epitaxial layer including a first conductive-type compound semiconductor layer, an active layer and a second conductive-type compound semiconductor layer on a first substrate, bonding a second substrate, having a different thermal expansion coefficient from that of the first substrate, to the epitaxial layers at a first temperature of the first substrate higher than a room temperature, and separating the first substrate from the epitaxial layer by irradiating a laser beam through the first substrate at a second temperature of the first substrate higher than the room temperature but not more than the first temperature.

    摘要翻译： 提供了一种使用激光剥离装置制造发光二极管的方法。 该方法包括在第一衬底上生长包括第一导电型化合物半导体层，有源层和第二导电型化合物半导体层的外延层，将具有不同于第一衬底的热膨胀系数不同的第二衬底 衬底，在第一衬底的高于室温的第一温度下到外延层，并且通过在第一衬底的高于室的第二温度下照射穿过第一衬底的激光束将第一衬底与外延层分离 温度不高于第一温度。

    Light emitting diode
    6.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号：US09142715B2

    公开(公告)日：2015-09-22

    申请号：US13099127

    申请日：2011-05-02

    申请人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hong Chol Lim ,  Hwa Mok Kim

    发明人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hong Chol Lim ,  Hwa Mok Kim

    IPC分类号： H01L33/00 ,  H01L33/10 ,  H01L33/02

    CPC分类号： H01L33/10 ,  H01L33/025 ,  H01L2933/0091

    摘要： An exemplary embodiment of the present invention relates to a light emitting diode (LED) including a substrate, a first nitride semiconductor layer arranged on the substrate, an active layer arranged on the first nitride semiconductor layer, a second nitride semiconductor layer arranged on the active layer, a third nitride semiconductor layer disposed between the first nitride semiconductor layer or between the second nitride semiconductor layer and the active layer, the third nitride semiconductor layer comprising a plurality of scatter elements within the third nitride semiconductor layer, and a distributed Bragg reflector (DBR) comprising a multi-layered structure, the substrate being arranged between the DBR and the third nitride semiconductor layer.

    摘要翻译： 本发明的示例性实施例涉及一种发光二极管（LED），其包括衬底，布置在衬底上的第一氮化物半导体层，布置在第一氮化物半导体层上的有源层，布置在有源层上的第二氮化物半导体层 层，设置在第一氮化物半导体层之间或第二氮化物半导体层和有源层之间的第三氮化物半导体层，在第三氮化物半导体层内包括多个散射元件的第三氮化物半导体层和分布式布拉格反射器 DBR），所述基板布置在所述DBR和所述第三氮化物半导体层之间。

    Method of fabricating light emitting diode using laser lift-off technique and laser lift-off apparatus having heater
    7.
    发明授权
    Method of fabricating light emitting diode using laser lift-off technique and laser lift-off apparatus having heater 有权
    使用激光剥离技术制造发光二极管的方法和具有加热器的激光剥离装置

    公开(公告)号：US08153509B2

    公开(公告)日：2012-04-10

    申请号：US12693907

    申请日：2010-01-26

    申请人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hwa Mok Kim

    发明人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hwa Mok Kim

    IPC分类号： H01L21/329 ,  H01L33/02 ,  H01L21/428

    CPC分类号： H01L33/0079

    摘要： Disclosed is a method of fabricating a light emitting diode using a laser lift-off apparatus. The method includes growing an epitaxial layer including a first conductive-type compound semiconductor layer, an active layer and a second conductive-type compound semiconductor layer on a first substrate, bonding a second substrate, having a different thermal expansion coefficient from that of the first substrate, to the epitaxial layers at a first temperature of the first substrate higher than a room temperature, and separating the first substrate from the epitaxial layer by irradiating a laser beam through the first substrate at a second temperature of the first substrate higher than the room temperature but not more than the first temperature. Thus, during a laser lift-off process, focusing of the laser beam can be easily achieved and the epitaxial layers are prevented from cracking or fracture. The laser lift-off process is performed by a laser lift-off apparatus including a heater.

    摘要翻译： 公开了使用激光剥离装置制造发光二极管的方法。 该方法包括在第一衬底上生长包括第一导电类型化合物半导体层，有源层和第二导电型化合物半导体层的外延层，将具有不同于第一衬底的热膨胀系数不同的第二衬底 衬底，在第一衬底的高于室温的第一温度下到外延层，并且通过在第一衬底的高于室的第二温度下照射穿过第一衬底的激光束将第一衬底与外延层分离 温度不高于第一温度。 因此，在激光剥离过程中，可以容易地实现激光束的聚焦，并且防止外延层破裂或断裂。 激光剥离处理由包括加热器的激光剥离装置进行。

    METHOD OF FABRICATING LIGHT EMITTING DIODE USING LASER LIFT-OFF TECHNIQUE AND LASER LIFT-OFF APPARATUS HAVING HEATER
    8.
    发明申请
    METHOD OF FABRICATING LIGHT EMITTING DIODE USING LASER LIFT-OFF TECHNIQUE AND LASER LIFT-OFF APPARATUS HAVING HEATER 有权
    使用激光提升技术制造发光二极管的方法和具有加热器的激光提升装置

    公开(公告)号：US20110053302A1

    公开(公告)日：2011-03-03

    申请号：US12693907

    申请日：2010-01-26

    申请人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hwa Mok Kim

    发明人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hwa Mok Kim

    IPC分类号： H01L33/00 ,  B23K26/00

    CPC分类号： H01L33/0079

    摘要： Disclosed is a method of fabricating a light emitting diode using a laser lift-off apparatus. The method includes growing an epitaxial layer including a first conductive-type compound semiconductor layer, an active layer and a second conductive-type compound semiconductor layer on a first substrate, bonding a second substrate, having a different thermal expansion coefficient from that of the first substrate, to the epitaxial layers at a first temperature of the first substrate higher than a room temperature, and separating the first substrate from the epitaxial layer by irradiating a laser beam through the first substrate at a second temperature of the first substrate higher than the room temperature but not more than the first temperature. Thus, during a laser lift-off process, focusing of the laser beam can be easily achieved and the epitaxial layers are prevented from cracking or fracture. The laser lift-off process is performed by a laser lift-off apparatus including a heater.

    摘要翻译： 公开了使用激光剥离装置制造发光二极管的方法。 该方法包括在第一衬底上生长包括第一导电类型化合物半导体层，有源层和第二导电型化合物半导体层的外延层，将具有不同于第一衬底的热膨胀系数不同的第二衬底 衬底，在第一衬底的高于室温的第一温度下到外延层，并且通过在第一衬底的高于室的第二温度下照射穿过第一衬底的激光束将第一衬底与外延层分离 温度不高于第一温度。 因此，在激光剥离过程中，可以容易地实现激光束的聚焦，并且防止外延层破裂或断裂。 激光剥离处理由包括加热器的激光剥离装置进行。

    High efficiency light emitting diode
    10.
    发明授权
    High efficiency light emitting diode 有权

    公开(公告)号：US08410506B2

    公开(公告)日：2013-04-02

    申请号：US13077371

    申请日：2011-03-31

    申请人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hong Chol Lim

    发明人： Chang Youn Kim ,  Joon Hee Lee ,  Jong Kyun You ,  Hong Chol Lim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/22 ,  H01L33/20 ,  H01L33/382

    摘要： Provided is a high-efficiency light emitting diode (LED) that includes: a support substrate; a semiconductor stack positioned on the support substrate, the semiconductor stack including a p-type compound semiconductor layer, an active layer, and an n-type compound semiconductor layer; a first electrode positioned between the support substrate and the semiconductor stack and in ohmic contact with the semiconductor stack; a first bonding pad positioned on a portion of the first electrode that is exposed outside of the semiconductor stack; and a second electrode positioned on the semiconductor stack. Protrusions are formed on exposed surfaces of the semiconductor stack. In addition, the second electrode may be positioned between the first electrode and the support substrate and contacted with the n-type compound semiconductor layer through openings of the semiconductor stack.