公开(公告)号：US20060197219A1

公开(公告)日：2006-09-07

申请号：US11306629

申请日：2006-01-04

申请人： Chang-Chi Lee ,  Tong-Hong Wang

发明人： Chang-Chi Lee ,  Tong-Hong Wang

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L23/473 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat sink for conducting a coolant is provided. The heat sink includes a casing and a porous material layer. The porous material layer is disposed inside the casing, and the coolant is conducted into the porous material layer. Moreover, a package structure that dissipates heat by use of a coolant is provided. The package structure includes a carrier, a chip, and the aforementioned heat sink. The chip is disposed on the carrier, and the heat sink is disposed on the carrier or above the chip. The heat dissipation efficiency of the package structure can be improved by the heat sink.

摘要翻译： 提供了用于传导冷却剂的散热器。 散热器包括壳体和多孔材料层。 多孔材料层设置在壳体内部，并且冷却剂被导入多孔材料层。 此外，提供了通过使用冷却剂散热的封装结构。 封装结构包括载体，芯片和上述散热器。 芯片设置在载体上，并且散热器设置在载体上或芯片上方。 通过散热片可以提高封装结构的散热效率。

公开(公告)号：US06969805B2

公开(公告)日：2005-11-29

申请号：US10619441

申请日：2003-07-16

申请人： Chang-Chi Lee ,  Jay Victor

发明人： Chang-Chi Lee ,  Jay Victor

IPC分类号： H01B7/30 ,  H01B11/12 ,  H01B7/00

CPC分类号： H01B11/12 ,  H01B7/30

摘要： An audio signal cable, the features of which are that the audio signal cable has arrayed solid and tinsel wire conductors. After each of the conductors are insulated and bundled, they are placed into a surrounding insulation. The solid conductors are of a circular and a flat, thin shape. The solid conductors are of differing larger and smaller diameters and, furthermore, disposed in unequal quantities.

摘要翻译： 一种音频信号电缆，其特征是音频信号电缆已经排列了固体和金属丝导线。 在每个导体绝缘和捆扎之后，将它们放置在周围的绝缘体中。 固体导体是圆形和扁平的，薄的形状。 固体导体具有不同的较大和较小的直径，此外，不平等地设置。

公开(公告)号：US20060076156A1

公开(公告)日：2006-04-13

申请号：US11287813

申请日：2005-11-28

申请人： Chang-Chi Lee ,  Jay Victor

发明人： Chang-Chi Lee ,  Jay Victor

IPC分类号： H01B3/44

CPC分类号： H01B11/12 ,  H01B7/30

摘要： An audio signal cable, the features of which are that the audio signal cable has arrayed solid and tinsel wire conductors. After each of the conductors are insulated and bundled, they are placed into a surrounding insulation. The solid conductors are of a circular and a flat, thin shape. The solid conductors are of differing larger and smaller diameters and, furthermore, disposed in unequal quantities.

公开(公告)号：US20060050508A1

公开(公告)日：2006-03-09

申请号：US10936474

申请日：2004-09-09

申请人： Chang-Chi Lee ,  Jay Victor

发明人： Chang-Chi Lee ,  Jay Victor

IPC分类号： B60Q1/26

CPC分类号： F21V33/0056 ,  F21S4/20 ,  F21W2131/406

摘要： The present invention relates to a luminous A/V cable assembly. The luminous A/V cable assembly comprises an A/V transmission line and a power line, wherein a plurality of light bulbs is connected to the power line; the plurality of light bulbs is connected in series to define a light bulb group, or using in series and(or) in parallel or any combination of in series and in parallel connecting method; the A/V transmission cable and the power cable being connected to the plurality of light bulb groups are clad with a plastic material to constitute an A/V cable having an overall different colored luminous effect.

摘要翻译： 本发明涉及一种发光A / V电缆组件。 发光A / V电缆组件包括A / V传输线和电力线，其中多个灯泡连接到电力线; 多个灯泡串联连接以限定灯泡组，或并联或（或）并联或并联或并联连接方式的任何组合使用; 连接到多个灯泡组的A / V传输电缆和电力电缆用塑料材料包覆以构成具有总体不同的着色发光效果的A / V电缆。

公开(公告)号：US20050006115A1

公开(公告)日：2005-01-13

申请号：US10740496

申请日：2003-12-22

申请人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

发明人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

IPC分类号： B81B1/00 ,  F25D17/02 ,  F28D15/02 ,  H01L23/473 ,  H05K1/02 ,  H05K7/20 ,  H01B7/42

CPC分类号： H01L23/473 ,  F28D15/0266 ,  F28D2015/0225 ,  F28F2210/02 ,  H01L2924/0002 ,  H05K1/0272 ,  H01L2924/00

摘要： A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid microsystem is formed in the insulator layer of the board, and includes first and second micro-channel structures, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures. The coolant is contained in the fluid microsystem, and flows from the second micro-channel structure to the first micro-channel structure through the first micro-conduit structure, and from the first micro-channel structure back to the second micro-channel structure through the second micro-conduit structure.

摘要翻译： 散热微型装置包括板，流体微系统和冷却剂。 板包括具有第一表面和第二表面的绝缘体层，形成在第一表面上的导体层和设置在第二表面上的盖构件。 流体微系统形成在板的绝缘体层中，并且包括第一和第二微通道结构以及允许第一和第二微通道结构之间的流体连通的第一和第二微管结构。 冷却剂被包含在流体微系统中，并且通过第一微通道结构从第二微通道结构流动到第一微通道结构，并且从第一微通道结构返回到第二微通道结构 第二个微管道结构。

公开(公告)号：US08035213B2

公开(公告)日：2011-10-11

申请号：US12285268

申请日：2008-10-01

申请人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

发明人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

IPC分类号： H01L23/12 ,  H01L21/48

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors.

摘要翻译： 提供了芯片封装结构及其制造方法。 芯片封装结构包括封装部分和多个外部导体。 封装部分包括分布层，芯片，多个内部导体和密封剂。 分布层具有第一表面和第二表面，并且芯片设置在第一表面上。 每个内部导体具有第一端子和第二端子。 第一端子设置在第一表面上。 密封剂设置在第一表面上用于覆盖芯片并部分地封装内部导体，使得每个内部导体的第一端子和第二端子从密封剂露出。 设置在封装部分的分布层的第二表面上的外部导体电连接到内部导体。

公开(公告)号：US20090102066A1

公开(公告)日：2009-04-23

申请号：US12285268

申请日：2008-10-01

申请人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

发明人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors.

摘要翻译： 提供了一种芯片封装结构及其制造方法。 芯片封装结构包括封装部分和多个外部导体。 封装部分包括分布层，芯片，多个内部导体和密封剂。 分布层具有第一表面和第二表面，并且芯片设置在第一表面上。 每个内部导体具有第一端子和第二端子。 第一端子设置在第一表面上。 密封剂设置在第一表面上用于覆盖芯片并部分地封装内部导体，使得每个内部导体的第一端子和第二端子从密封剂露出。 设置在封装部分的分布层的第二表面上的外部导体电连接到内部导体。

公开(公告)号：US07091420B2

公开(公告)日：2006-08-15

申请号：US11287813

申请日：2005-11-28

申请人： Chang-Chi Lee ,  Jay Victor

发明人： Chang-Chi Lee ,  Jay Victor

IPC分类号： H01B7/00

CPC分类号： H01B11/12 ,  H01B7/30

摘要： An audio signal cable, the features of which are that the audio signal cable has arrayed solid and tinsel wire conductors. After each of the conductors are insulated and bundled, they are placed into a surrounding insulation. The solid conductors are of a circular and a flat, thin shape. The solid conductors are of differing larger and smaller diameters and, furthermore, disposed in unequal quantities.

公开(公告)号：US06528882B2

公开(公告)日：2003-03-04

申请号：US09849137

申请日：2001-05-04

申请人： Yi-Chuan Ding ,  Chang-Chi Lee ,  Kun-Ching Chen ,  Yung-I Yeh

发明人： Yi-Chuan Ding ,  Chang-Chi Lee ,  Kun-Ching Chen ,  Yung-I Yeh

IPC分类号： H01L2334

CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A thermal enhanced ball grid array package is provided. The substrate for the package includes a metal core layer and at least a first patterned wiring layer provided thereon. A first insulating layer is provided between the first patterned wiring layer and the metal core layer. At least a second patterned wiring layer is provided on the substrate, opposite to the surface having the first patterned wiring layer. A second insulating layer having solder balls between the second patterned wiring layer and the metal core layer. The second patterned wiring layer is electrically connected to the first patterned wiring layer. Blind vias are provided in the second patterned wiring layer and the second insulating layer. A heat conductive material or solder material is filled into the blind vias to form thermal balls. The heat from the chip to the metal core layer is transferred directly through the thermal balls.

公开(公告)号：US5989050A

公开(公告)日：1999-11-23

申请号：US18792

申请日：1998-02-04

申请人： Chang-Chi Lee

发明人： Chang-Chi Lee

IPC分类号： H01R13/627

CPC分类号： H01R13/6272

摘要： A connector for a microphone includes a connecting member provided with a hook having a slot, a tubular member having an end formed with a plurality of hooks and fitted on the connecting member, an adjusting ring having a flange engaged with the hooks of the tubular member and an inner side formed with internal threads, and a fixing collar having an end formed with external threads engageable with the internal threads of the adjusting ring and a longitudinal notch engageable with the slot of the connecting member, whereby the microphone can be firmly and easily engaged with the connector.

摘要翻译： 用于麦克风的连接器包括连接构件，该连接构件设置有具有槽的钩，管状构件，其端部形成有多个钩并且装配在连接构件上;调节环，其具有与管状构件的钩接合的凸缘 内侧形成有内螺纹，以及固定套环，其端部形成有可与调节环的内螺纹接合的外螺纹，以及可与连接构件的槽接合的纵向凹口，由此麦克风可以牢固且容易地 与连接器接合。