摘要:
The present disclosure is directed to a process for the fabrication of a semiconductor device. In some embodiments the semiconductor device comprises a patterned surface. The pattern can be formed from a self-assembled monolayer. The disclosed process provides self-assembled monolayers which can be deposited quickly, thereby increasing production throughput and decreasing cost, as well as providing a pattern having substantially uniform shape.
摘要:
A semiconductor device and a fabricating process for the same are provided. The semiconductor device includes a base layer having a part of a reactive material; and a self-assembled protecting layer of a self-assembled molecule reacting with the reactive material formed over the part.
摘要:
The present disclosure is directed to a process for the fabrication of a semiconductor device. In some embodiments the semiconductor device comprises a patterned surface. The pattern can be formed from a self-assembled monolayer. The disclosed process provides self-assembled monolayers which can be deposited quickly, thereby increasing production throughput and decreasing cost, as well as providing a pattern having substantially uniform shape.
摘要:
Among other things, one or more techniques for forming a low k dielectric around a metal line during an integrated circuit (IC) fabrication process are provided. In an embodiment, a metal line is formed prior to forming a surrounding low k dielectric layer around the metal line. In an embodiment, the metal line is formed by filling a trench space in a skeleton layer with metal. In this embodiment, the skeleton layer is removed to form a dielectric space in a different location than the trench space. The dielectric space is then filled with a low k dielectric material to form a surrounding low k dielectric layer around the metal line. In this manner, damage to the surrounding low k dielectric layer, that would otherwise occur if the surrounding low k dielectric layer was etched, for example, is mitigated.
摘要:
A semiconductor device comprises a substrate with a first side and a second side, wherein a plurality of active circuits are formed adjacent to the first side of the substrate and a plurality of through silicon vias arranged in a polygon shape and extending from the first side of to the second side, wherein the polygon shape has more than six sides, and wherein each through silicon via is placed at a corresponding apex of the polygon shape.
摘要:
A voltage transfer circuit outputs an equivalent to an input voltage when enabled. Otherwise, the transfer circuit is in standby and outputs an equivalent to a standby voltage (e.g., signal ground). The voltage transfer circuit includes a switching circuit, a standby circuit, and an input-transfer circuit. The output of the transfer circuit is fed back to both the switching circuit and the input-transfer circuit. When the transfer circuit is in standby, the feedback of the output voltage provides for voltage-balancing in the input-transfer circuit, thereby reducing or eliminating leakage current in the input-transfer circuit. Similarly, when the transfer circuit is in active mode, the feedback of the output voltage provides for voltage-balancing in the standby circuit, thereby reducing or eliminating leakage current in the standby circuit.
摘要:
A multiple-time electrical fuse programming circuit is described. The circuit includes a programming counter to record the number of programmings, a blowing reference voltage generator to generate a blowing voltage reference wherein the fuse resistance after programming is determined by the blowing voltage reference, at least one self-controlled programmable fuses which includes a programmable fuse and a control circuit. The multiple-time electrical fuse programming circuit also has a fuse detection reference generator and a high voltage power source.
摘要:
A method and a system for correcting a soft error in a memory circuit during a stand-by mode are disclosed. According to the disclosure, after reading data from at least one memory cell without outputting the read data through an input/output module of the memory circuit in the stand-by mode, it is determined whether the read data is a soft error. If so, a correct value is written to the memory cell if the read data is the soft error.
摘要:
Disclosed herein is a voltage regulator, and related method, for regulating a boost voltage generated by a boost circuit. In one embodiment, the voltage regulator includes a regulated voltage input operable to receive a regulated voltage derived from the boost voltage, a reference voltage input operable to receive a constant reference voltage, and an output node operable to provide a feedback signal to the boost circuit for controlling the generated boost voltage. In addition, the voltage regulator includes at least one transistor coupled to the regulated voltage input, the reference voltage input, and the output node, and operable to produce the feedback signal based on a comparison of the regulated voltage to the reference voltage. The voltage regulator still further includes a variable current source coupled to the output node and having one or more performance characteristics, where the variable current source is operable to generate a variable current at the output node to mitigate the affect of one or more performance characteristics of the at least one transistor based on the comparison and the feedback signal such that the boost circuit generates the boost voltage to be substantially constant.
摘要:
A circuit operable to measure leakage current in a Dynamic Random Access Memory (DRAM) is provided comprising a plurality of DRAM bit cell access transistors coupled to a common bit line, a common word line, and a common storage node, wherein said access transistors may be biased to simulate a corresponding plurality of inactive bit cells of a DRAM; and a current mirror in communication with the common storage node operable to mirror a total leakage current from said plurality of bit cell access transistors when the access transistors are biased to simulate the inactive bit cells.