公开(公告)号：US08129726B2

公开(公告)日：2012-03-06

申请号：US12181332

申请日：2008-07-29

申请人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Kuan-Chieh Tu ,  Hung-Lieh Hu ,  Bing-Ru Chen ,  Shih-Tsai Huang ,  Hsin-Yun Tsai

发明人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Kuan-Chieh Tu ,  Hung-Lieh Hu ,  Bing-Ru Chen ,  Shih-Tsai Huang ,  Hsin-Yun Tsai

IPC分类号： H01L27/15

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.

摘要翻译： 具有静电放电（ESD）保护功能的发光二极管（LED）封装及其制造方法采用复合衬底来制备嵌入式二极管和LED，并且在复合衬底中使用绝缘层来隔离一些个体 嵌入式二极管，使得LED器件具有ESD保护。

公开(公告)号：US20090290273A1

公开(公告)日：2009-11-26

申请号：US12181332

申请日：2008-07-29

申请人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Shih-Tsai Huang ,  Hsin-Yun Tsai ,  Hung-Lieh Hu

发明人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Shih-Tsai Huang ,  Hsin-Yun Tsai ,  Hung-Lieh Hu

IPC分类号： H02H9/00 ,  H01L33/00 ,  H01L21/00

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.

摘要翻译： 具有静电放电（ESD）保护功能的发光二极管（LED）封装及其制造方法采用复合衬底来制备嵌入式二极管和LED，并且在复合衬底中使用绝缘层来隔离一些个体 嵌入式二极管，使得LED器件具有ESD保护。

公开(公告)号：US08304785B2

公开(公告)日：2012-11-06

申请号：US12566943

申请日：2009-09-25

申请人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Hung-Lieh Hu

发明人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Hung-Lieh Hu

IPC分类号： H01L27/15

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED.

摘要翻译： 提供了一种发光二极管（LED）结构，其制造方法和LED模块。 LED结构具有温度检测功能。 LED结构包括复合衬底和LED。 复合衬底包括其P型半导体区域或N型半导体区域具有预定掺杂浓度的二极管结构。 二极管结构是温度传感器，温度传感器的灵敏度基于预定的掺杂浓度。 LED设置在复合基板上。 二极管结构用于感测从LED发出的热量。

公开(公告)号：US20130169167A1

公开(公告)日：2013-07-04

申请号：US13411242

申请日：2012-03-02

申请人： Hung-Lieh HU ,  Chen-Peng Hsu ,  Hsin-Yun Tsai ,  Shih-Yi Wen

发明人： Hung-Lieh HU ,  Chen-Peng Hsu ,  Hsin-Yun Tsai ,  Shih-Yi Wen

IPC分类号： H05B37/02

CPC分类号： H05B33/0827 ,  H05B33/0803

摘要： An light device, includes a plurality of first light cells arranged axisymmetrically about an axis; a plurality of second light cells arranged axisymmetrically around the axis; and a controller coupled to a brightness adjust unit, and determines whether to activate the first light cells and second light cells according to a brightness adjust value of the brightness adjust unit, wherein the average distance between the first light cells and the axis is shorter than the average distance between the second light cells and the axis.

摘要翻译： 一种光装置，包括围绕轴线对称布置的多个第一光单元; 围绕所述轴线对称地布置的多个第二光单元; 以及耦合到亮度调节单元的控制器，并且根据亮度调节单元的亮度调整值来确定是否激活第一光单元和第二光单元，其中第一光单元和轴之间的平均距离短于 第二光单元和轴之间的平均距离。

公开(公告)号：US20100084958A1

公开(公告)日：2010-04-08

申请号：US12566943

申请日：2009-09-25

申请人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Hung-Lieh Hu

发明人： Chih-Tsung Shih ,  Chen-Peng Hsu ,  Hung-Lieh Hu

IPC分类号： H01J7/24 ,  H01L33/00

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED.

摘要翻译： 提供了一种发光二极管（LED）结构，其制造方法和LED模块。 LED结构具有温度检测功能。 LED结构包括复合衬底和LED。 复合衬底包括其P型半导体区域或N型半导体区域具有预定掺杂浓度的二极管结构。 二极管结构是温度传感器，温度传感器的灵敏度基于预定的掺杂浓度。 LED设置在复合基板上。 二极管结构用于感测从LED发出的热量。

公开(公告)号：US09210754B2

公开(公告)日：2015-12-08

申请号：US13411242

申请日：2012-03-02

申请人： Hung-Lieh Hu ,  Chen-Peng Hsu ,  Hsin-Yun Tsai ,  Shih-Yi Wen

发明人： Hung-Lieh Hu ,  Chen-Peng Hsu ,  Hsin-Yun Tsai ,  Shih-Yi Wen

IPC分类号： H05B37/02 ,  H05B33/08

CPC分类号： H05B33/0827 ,  H05B33/0803

摘要： An light device, includes a plurality of first light cells arranged axisymmetrically about an axis; a plurality of second light cells arranged axisymmetrically around the axis; and a controller coupled to a brightness adjust unit, and determines whether to activate the first light cells and second light cells according to a brightness adjust value of the brightness adjust unit, wherein the average distance between the first light cells and the axis is shorter than the average distance between the second light cells and the axis.

摘要翻译： 一种光装置，包括围绕轴线对称布置的多个第一光单元; 围绕所述轴线对称地布置的多个第二光单元; 以及耦合到亮度调节单元的控制器，并且根据亮度调节单元的亮度调整值来确定是否激活第一光单元和第二光单元，其中第一光单元和轴之间的平均距离短于 第二光单元和轴之间的平均距离。

公开(公告)号：US08349627B2

公开(公告)日：2013-01-08

申请号：US12976977

申请日：2010-12-22

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/48

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.

摘要翻译： 本发明公开了一种制造发光二极管（LED）封装结构的方法。 该方法包括以下步骤：提供具有基板和第一突起的载体，其中第一突起设置在基板上并具有凹部。 粘合层和LED芯片设置在凹部的底部，其中粘合层结合在载体和LED芯片之间，并且凹部的宽度与LED芯片的宽度之间的比率大于1 并且小于或等于1.5，使得在LED芯片的侧壁和凹部的内侧壁之间存在间隙。

公开(公告)号：US20120199862A1

公开(公告)日：2012-08-09

申请号：US13448413

申请日：2012-04-17

申请人： Chao-Wei Li ,  Chen-Peng Hsu ,  Yao-Jun Tsai ,  Hung-Lieh Hu

发明人： Chao-Wei Li ,  Chen-Peng Hsu ,  Yao-Jun Tsai ,  Hung-Lieh Hu

IPC分类号： H01L33/50

CPC分类号： H01L33/648 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.

摘要翻译： 提供了包括载体基板，至少一个LED芯片，光学元件和导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。 光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。 导热透明液体填充密封空间。

公开(公告)号：US08115218B2

公开(公告)日：2012-02-14

申请号：US12501496

申请日：2009-07-13

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/508 ,  H01L33/54 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.

摘要翻译： 发光二极管（LED）封装结构包括载体，第一突起，LED芯片和粘合层。 第一突起设置在载体上并且具有第一开口以使载体露出。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。

公开(公告)号：US09178107B2

公开(公告)日：2015-11-03

申请号：US13197677

申请日：2011-08-03

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Kuo-Feng Lin ,  Hsun-Chih Liu ,  Hung-Lieh Hu ,  Chien-Jen Sun

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Kuo-Feng Lin ,  Hsun-Chih Liu ,  Hung-Lieh Hu ,  Chien-Jen Sun

IPC分类号： H01L33/00 ,  H01L33/20 ,  H01L33/44

CPC分类号： H01L33/0095 ,  H01L33/20 ,  H01L33/44 ,  H01L2933/0016

摘要： A method for fabricating a wafer-level light emitting diode structure is provided. The method includes: providing a substrate, wherein a first semiconductor layer, a light emitting layer, and a second semiconductor layer are sequentially disposed on the substrate; subjecting the first semiconductor layer, the light emitting layer, and the second semiconductor layer with a patterning process to form a first depressed portion, a second depressed portion, a stacked structure disposed on the second depressed portion and a remained first semiconductor layer disposed on the depressed portion, wherein the stacked structure comprises a patterned second semiconductor layer, a patterned emitting layer, and a patterned first semiconductor layer; forming a first electrode on the remained first semiconductor layer of the first depressed portion; and forming a second electrode correspondingly disposed on the patterned second semiconductor layer of the second depressed portion.

摘要翻译： 提供了一种制造晶片级发光二极管结构的方法。 该方法包括：提供衬底，其中第一半导体层，发光层和第二半导体层依次设置在衬底上; 通过图案化工艺对第一半导体层，发光层和第二半导体层进行处理，以形成设置在第二凹部上的第一凹部，第二凹部，层叠结构，以及设置在第二凹部 凹陷部分，其中所述堆叠结构包括图案化的第二半导体层，图案化发光层和图案化的第一半导体层; 在第一凹部的残留的第一半导体层上形成第一电极; 以及形成相应地设置在所述第二凹陷部分的图案化的第二半导体层上的第二电极。