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    Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same
    2.
    发明授权
    Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same 有权
    含有富氮表面的半导体装置用铝基材及其制造方法

    公开(公告)号：US6123895A

    公开(公告)日：2000-09-26

    申请号：US256783

    申请日：1999-02-24

    申请人： Shin-ichi Yamagata ,  Osamu Suwata ,  Chihiro Kawai ,  Akira Fukui ,  Yoshinobu Takeda

    发明人： Shin-ichi Yamagata ,  Osamu Suwata ,  Chihiro Kawai ,  Akira Fukui ,  Yoshinobu Takeda

    IPC分类号： H05K1/05 ,  B22F1/00 ,  B22F3/10 ,  C22C29/06 ,  C22C32/00 ,  H01L23/14 ,  H01L23/15 ,  H01L23/373 ,  B22F3/24 ,  B22F3/12

    CPC分类号： H01L23/142 ,  C22C29/065 ,  C22C32/0063 ,  H01L23/15 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/05

    摘要： A member for semiconductor devices comprising a composite alloy of aluminum or an aluminum alloy and silicon carbide, wherein silicon carbide grains are dispersed in aluminum or the aluminum alloy in an amount of from 10 to 70% by weight, the amount of nitrogen in the surface of the member is larger than that in the inside thereof, and the ratio of aluminum or the aluminum alloy to silicon carbide is the same in the surface and the inside. The member is produced by mixing powdery materials of aluminum or an aluminum alloy and silicon carbide, compacting the mixed powder, and sintering the compact in a non-oxidizing atmosphere containing nitrogen gas, at a temperature between 600.degree. C. and the melting point of aluminum. The member is lightweight and has high thermal conductivity as well as thermal expansion coefficient which is well matches with that of ceramics and others. Therefore, the member is especially favorable to high-power devices.

    摘要翻译： 包括铝或铝合金的复合合金和碳化硅的半导体器件的构件，其中碳化硅颗粒以10至70重量％的量分散在铝或铝合金中，表面中的氮的量 的构件比其内部大，铝或铝合金与碳化硅的比例在表面和内部相同。 该构件通过混合铝或铝合金的粉末材料和碳化硅，压制混合粉末，并在含有氮气的非氧化性气氛中在600℃的温度和 铝。 该部件重量轻，导热系数高，热膨胀系数高，与陶瓷等相匹配。 因此，该会员特别有利于大功率设备。

    Member for semiconductor device and method for producing the same
    3.
    发明授权
    Member for semiconductor device and method for producing the same 有权
    半导体装置用部件及其制造方法

    公开(公告)号：US06507105B1

    公开(公告)日：2003-01-14

    申请号：US09498338

    申请日：2000-02-04

    申请人： Shin-ichi Yamagata ,  Osamu Suwata ,  Chihiro Kawai ,  Akira Fukui ,  Yoshinobu Takeda

    发明人： Shin-ichi Yamagata ,  Osamu Suwata ,  Chihiro Kawai ,  Akira Fukui ,  Yoshinobu Takeda

    IPC分类号： H01L2912

    CPC分类号： H01L23/142 ,  C22C29/065 ,  C22C32/0063 ,  H01L23/15 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/05 ,  H01L2924/00

    摘要： A member for semiconductor devices comprising a composite alloy of aluminum or an aluminum alloy and silicon carbide, wherein silicon carbide grains are dispersed in aluminum or the aluminum alloy in an amount of from 10 to 70% by weight, the amount of nitrogen in the surface of the member is larger than that in the inside thereof, and the ratio of aluminum or the aluminum alloy to silicon carbide is the same in the surface and the inside. The member is produced by mixing powdery materials of aluminum or an aluminum alloy and silicon carbide, compacting the mixed powder, and sintering the compact in a non-oxidizing atmosphere containing nitrogen gas, at a temperature between 600° C. and the melting point of aluminum. The member is lightweight and has high thermal conductivity as well as thermal expansion coefficient which is well matches with that of ceramics and others. Therefore, the member is especially favorable to high-power devices.

    摘要翻译： 包括铝或铝合金的复合合金和碳化硅的半导体器件的构件，其中碳化硅颗粒以10至70重量％的量分散在铝或铝合金中，表面中的氮的量 的构件比其内部大，铝或铝合金与碳化硅的比例在表面和内部相同。 该构件通过混合铝或铝合金的粉末材料和碳化硅，压制混合粉末，并在含有氮气的非氧化性气氛中，在600℃的温度和 铝。 该部件重量轻，导热系数高，热膨胀系数高，与陶瓷等相匹配。 因此，该会员特别有利于大功率设备。

    Photoreceptor for electrophotography and method of manufacturing the same
    4.
    发明授权
    Photoreceptor for electrophotography and method of manufacturing the same 失效
    电子照相用光感受器及其制造方法

    公开(公告)号：US6093513A

    公开(公告)日：2000-07-25

    申请号：US295407

    申请日：1999-04-21

    申请人： Yoshinobu Takeda ,  Hiroyuki Endoh ,  Tsutomu Uezono

    发明人： Yoshinobu Takeda ,  Hiroyuki Endoh ,  Tsutomu Uezono

    IPC分类号： G03G5/05 ,  G03G5/147 ,  G03G5/047

    CPC分类号： G03G5/0592 ,  G03G5/14791

    摘要： Disclosed herein is a photoreceptor for electrophotography having an over coating layer formed on a substrate and prepared by applying a composition containing silica particles, an organic compound chemically bonded thereto and a photo polymerization initiator and by curing said composition; said organic compound having an polymerizable unsaturated group, a group designated by Formula (1) or a group designated by Formula (2), and said silica particles and said organic compound being bonded with each other through a silyloxy group. The photoreceptor for electrophotography has not only excellent durabilities and an excellent resistance to printing but also excellent electrophoto characteristics such as sensitivity and a residual potential. ##STR1## (wherein --X-- is selected from --NH--, --O-- and --S--, --Y-- is an oxygen atom or a sulfur atom, and when --X-- is --O--, Y is said sulfur atom).

    摘要翻译： 本文公开了一种用于电子照相的感光体，其具有在基底上形成的涂层，并通过涂布含有二氧化硅颗粒，化学键合的有机化合物和光聚合引发剂并通过固化所述组合物的组合物制备; 所述有机化合物具有可聚合不饱和基团，由式（1）表示的基团或由式（2）表示的基团，所述二氧化硅颗粒和所述有机化合物通过甲硅烷氧基彼此键合。 用于电子照相的感光体不仅具有优异的耐久性和优异的耐印刷性，而且还具有优异的电子照相特性，如灵敏度和残留电位。 （其中-X-选自-NH-，-O-和-S-，-Y-是氧原子或硫原子，当-X-是-O-，Y是所说的硫原子时）。

    Powder forging process
    5.
    发明授权
    Powder forging process 失效
    粉末锻造工艺

    公开(公告)号：US5547632A

    公开(公告)日：1996-08-20

    申请号：US359674

    申请日：1994-12-20

    申请人： Hiroyuki Horimura ,  Kenji Okamoto ,  Masahiko Minemi ,  Toshihiko Kaji ,  Yoshinobu Takeda ,  Yoshishige Takano

    发明人： Hiroyuki Horimura ,  Kenji Okamoto ,  Masahiko Minemi ,  Toshihiko Kaji ,  Yoshinobu Takeda ,  Yoshishige Takano

    IPC分类号： B22F3/02 ,  B22F3/17 ,  B22F3/16

    CPC分类号： B22F3/17

    摘要： In a powder forging process, a heated green compact is placed in a stationary die and subjected to a press-forging carried out mainly to reduce the thickness thereof by cooperation of the stationary die with a movable die. The press-forging is performed at two pressing steps. After placement of the green compact into the concave molding portion of the stationary die, the pressing step were carried out. Thus, it is possible to produce a forged product having a high strength and a high toughness. A heated heat insulator also may be placed in the stationary die to provide a temperature-retaining effect to the green compact before and during pressing.

    摘要翻译： 在粉末锻造方法中，将加热的生坯压实成型体放置在固定模具中，并进行压制加工，主要通过固定模具与活动模具的配合来减小其厚度。 压锻在两个压制步骤进行。 在将压坯放入固定模的凹形成型部之后，进行加压工序。 因此，可以生产具有高强度和高韧性的锻造产品。 加热的绝热体也可以放置在固定模具中，以在压制之前和期间向生坯提供温度保持效果。

    Valve gate device for use in an injection mold
    9.
    发明授权
    Valve gate device for use in an injection mold 失效
    用于注射模具的阀门装置

    公开(公告)号：US06179604B2

    公开(公告)日：2001-01-30

    申请号：US09041306

    申请日：1998-03-12

    申请人： Yoshinobu Takeda

    发明人： Yoshinobu Takeda

    IPC分类号： B29C4523

    CPC分类号： B29C45/2806 ,  B29C2045/2862 ,  B29C2045/2893 ,  B29L2015/003

    摘要： An injection molding method, an injection mold and a valve gate device, in which a movable pin moves easily, without excess force being exerted thereto, to properly open and close a gate. Closing a gate 10B by a cylindrical movable pin 27 allows excess resin to easily return back to a resin conveying path side through an outer edge portion at the end of the movable pin 27, so that even a large-diameter gate 10B can be reliably closed by the movable pin 27 which can be easily moved due to reduced resin resistance on the movable pin 27.

    摘要翻译： 注射成型方法，注射模具和阀门装置，其中可移动销容易地移动，而不会施加过大的力来适当地打开和关闭闸门。 通过圆柱形可动销27封闭栅极10B允许多余的树脂容易地通过可动销27的端部处的外缘部分返回到树脂输送路径侧，使得即使大直径的门10B也可以可靠地闭合 通过可动销27由于可动销27上的树脂阻力降低而容易移动。