摘要:
Features of a mask, when close enough to one another, can cause unwanted phantom images to print on an integrated circuit. Advantageously, potential locations of phantom images can be automatically identified from a mask layout. This technique can include creating perimeters or rings around features in the mask layout (in one case, after proximity correction). An overlap of perimeters/rings can be assigned a particular weight such that areas of greater overlap have a higher weight and areas of less overlap have a lower weight. If the weight of an overlap area exceeds a trigger weight, then an evaluation point can be added to the mask layout, thereby identifying that layout location as a potential location of a phantom image. After simulation of the mask layout, that layout location can be analyzed to determine if a phantom image would print.
摘要:
A lithography mask layout is designed and verified incrementally to help reduce the amount of time to produce the mask layout. For one embodiment, a layout defining a target pattern may be processed to produce a mask layout, and the mask layout may be verified to identify errors. Rather than processing and verifying the entire mask layout for error correction over one or more subsequent iterations, sub-layouts having errors may be removed or copied from the mask layout for separate processing and verification. Because the amount of data defining a sub-layout is relatively small, the time to design and verify the mask layout is reduced. The resulting mask layout having one or more processed and verified sub-layout(s) may then be used to manufacture a mask set to help print the target pattern in manufacturing integrated circuits (ICs), for example.
摘要:
A vending machine is equipped with a dispensing device that includes a plate, a track, carriers, a work station, a driving unit and a sensor. The plate is horizontally placed in a vending machine. The track is connected to the plate. The carriers are movably connected to the track for carrying products. The work station causes a selected one of the carriers to release the corresponding one of the products. The driving unit drives the carriers along the track. The sensor senses the selected one of the carriers and accordingly stops the driving unit so that the selected one of the carriers is placed at the work station.
摘要:
A lifting device for hammer game machine includes frame, a motor laterally mounted to a lower portion of the frame, a seat longitudinally mounted to an upper portion of the frame, a lifting unit partially received in and extending through the seat, a first bracket is secured on a lower end of the lifting device, a linkage assembly connected to the motor and a second bracket laterally mounted onto the linkage assembly through the frame. The first bracket and the second bracket are slidably relative to the frame and selectively connected to each other before being operated.
摘要:
A method of generating simulation reports regarding an integrated circuit layout is provided. The method can include providing a plurality of control points associated with the integrated circuit layout. A single simulation of the plurality of control points can be performed. Detailed information from the single simulation can be stored in a database. Desired information can then be extracted from the database to generate the simulation reports.
摘要:
The present disclosure provides a semiconductor device. The semiconductor device includes a substrate and an interconnect structure disposed over the substrate. The interconnect structure includes a plurality of interconnect layers. One of the interconnect layers contains: a plurality of metal via slots and a bulk metal component disposed over the plurality of metal via slots. The present disclosure also provides a method. The method includes providing a wafer, and forming a first layer over the wafer. The method includes forming an interconnect structure over the first layer. The forming the interconnect structure includes forming a second interconnect layer over the first layer, and forming a third interconnect layer over the second interconnect layer. The second interconnect layer is formed to contain a plurality of metal via slots and a bulk metal component formed over the plurality of metal via slots. The third interconnect layer contains one or more metal trenches.
摘要:
A Wafer Image Modeling and Prediction System (“WIMAPS”) is described that includes systems and methods that generate and/or apply models of resolution enhancement techniques (“RET”) and printing processes in integrated circuit (“IC”) fabrication. The WIMAPS provides efficient processes for use by designers in predicting the RET and wafer printing process so as to allow designers to filter predict printed silicon contours prior to application of RET and printing processes to the circuit design.
摘要:
A Wafer Image Modeling and Prediction System (“WIMAPS”) is described that includes systems and methods that generate and/or apply models of resolution enhancement techniques (“RET”) and printing processes in integrated circuit (“IC”) fabrication. The WIMAPS provides efficient processes for use by designers in predicting the RET and wafer printing process so as to allow designers to filter predict printed silicon contours prior to application of RET and printing processes to the circuit design
摘要:
A vending machine is equipped with a dispensing device that includes a plate, a track, carriers, a work station, a driving unit and a sensor. The plate is horizontally placed in a vending machine. The track is connected to the plate. The carriers are movably connected to the track for carrying products. The work station causes a selected one of the carriers to release the corresponding one of the products. The driving unit drives the carriers along the track. The sensor senses the selected one of the carriers and accordingly stops the driving unit so that the selected one of the carriers is placed at the work station.
摘要:
This invention discloses a GaN semiconductor device comprising a substrate; a metal-rich nitride compound thin film on the substrate; a buffer layer formed on the metal-rich nitride compound thin film, and a semiconductor stack layer on the buffer layer wherein the metal-dominated nitride compound thin film covers a partial upper surface of the substrate. Because metal-rich nitride compound is amorphous, the epitaxial growth direction of the buffer layer grows upwards in the beginning and then turns laterally, and the epitaxy defects of the buffer layer also bend with the epitaxial growth direction of the buffer layer. Therefore, the probability of the epitaxial defects extending to the semiconductor stack layer is reduced and the reliability of the GaN semiconductor device is improved.