Identifying phantom images generated by side-lobes
    1.
    发明授权
    Identifying phantom images generated by side-lobes 有权
    识别由旁瓣产生的幻影图像

    公开(公告)号:US07131100B2

    公开(公告)日:2006-10-31

    申请号:US10316275

    申请日:2002-12-10

    IPC分类号: G06F17/50 G06F9/00

    摘要: Features of a mask, when close enough to one another, can cause unwanted phantom images to print on an integrated circuit. Advantageously, potential locations of phantom images can be automatically identified from a mask layout. This technique can include creating perimeters or rings around features in the mask layout (in one case, after proximity correction). An overlap of perimeters/rings can be assigned a particular weight such that areas of greater overlap have a higher weight and areas of less overlap have a lower weight. If the weight of an overlap area exceeds a trigger weight, then an evaluation point can be added to the mask layout, thereby identifying that layout location as a potential location of a phantom image. After simulation of the mask layout, that layout location can be analyzed to determine if a phantom image would print.

    摘要翻译: 掩模的特征,当彼此足够接近时,可能会导致不想要的幻像图像在集成电路上打印。 有利地,可以从掩模布局自动识别幻影图像的潜在位置。 这种技术可以包括围绕掩模布局中的特征创建周长或环(在一种情况下,在邻近校正之后)。 周长/环的重叠可以被赋予特定的重量,使得更大重叠的区域具有较高的重量并且具有较小重叠的区域具有较低的重量。 如果重叠区域的重量超过触发权重,则可以将评估点添加到掩模布局,从而将该布局位置识别为幻影图像的潜在位置。 在模拟面具布局之后,可以分析该布局位置以确定幻影图像是否打印。

    Incremental lithography mask layout design and verification
    2.
    发明授权
    Incremental lithography mask layout design and verification 有权
    增量光刻掩模布局设计和验证

    公开(公告)号:US06904587B2

    公开(公告)日:2005-06-07

    申请号:US10327446

    申请日:2002-12-20

    IPC分类号: G03F1/36 G06F9/45 G06F17/50

    CPC分类号: G06F17/5081 G03F1/36 G03F1/68

    摘要: A lithography mask layout is designed and verified incrementally to help reduce the amount of time to produce the mask layout. For one embodiment, a layout defining a target pattern may be processed to produce a mask layout, and the mask layout may be verified to identify errors. Rather than processing and verifying the entire mask layout for error correction over one or more subsequent iterations, sub-layouts having errors may be removed or copied from the mask layout for separate processing and verification. Because the amount of data defining a sub-layout is relatively small, the time to design and verify the mask layout is reduced. The resulting mask layout having one or more processed and verified sub-layout(s) may then be used to manufacture a mask set to help print the target pattern in manufacturing integrated circuits (ICs), for example.

    摘要翻译: 光刻掩模布局被设计和逐步验证,以帮助减少产生掩模布局的时间量。 对于一个实施例,可以处理定义目标图案的布局以产生掩模布局,并且可以验证掩模布局以识别错误。 不是通过在一个或多个后续迭代处理和验证整个掩模布局进行纠错,而是可以从掩模布局去除或复制具有错误的子布局以进行单独的处理和验证。 由于定义子布局的数据量相对较小,所以减少了设计和验证掩码布局的时间。 然后,可以使用具有一个或多个经处理和验证的子布局的所得到的掩模布局来制造掩模组,以帮助例如在制造集成电路(IC)中打印目标图案。

    Dispensing device for vending machine
    3.
    发明授权
    Dispensing device for vending machine 有权
    自动售货机点胶装置

    公开(公告)号:US08960411B2

    公开(公告)日:2015-02-24

    申请号:US13786244

    申请日:2013-03-05

    IPC分类号: B65G47/36 A63F9/30

    CPC分类号: B65G47/36 A63F9/30 G07F11/42

    摘要: A vending machine is equipped with a dispensing device that includes a plate, a track, carriers, a work station, a driving unit and a sensor. The plate is horizontally placed in a vending machine. The track is connected to the plate. The carriers are movably connected to the track for carrying products. The work station causes a selected one of the carriers to release the corresponding one of the products. The driving unit drives the carriers along the track. The sensor senses the selected one of the carriers and accordingly stops the driving unit so that the selected one of the carriers is placed at the work station.

    摘要翻译: 自动售货机配备有分配装置,其包括板,轨道,载体,工作站,驱动单元和传感器。 该板水平放置在自动售货机中。 轨道连接到板。 载体可移动地连接到用于承载产品的轨道。 工作站使选定的一个载体释放对应的一个产品。 驱动单元沿轨道驱动载体。 感测器感测所选择的一个载体,因此停止驱动单元,使得所选择的一个载体被放置在工作站。

    Lifting device for hammer game machine
    4.
    发明授权
    Lifting device for hammer game machine 有权
    锤式游戏机起重装置

    公开(公告)号:US08657294B2

    公开(公告)日:2014-02-25

    申请号:US13449260

    申请日:2012-04-17

    IPC分类号: A63F7/22

    摘要: A lifting device for hammer game machine includes frame, a motor laterally mounted to a lower portion of the frame, a seat longitudinally mounted to an upper portion of the frame, a lifting unit partially received in and extending through the seat, a first bracket is secured on a lower end of the lifting device, a linkage assembly connected to the motor and a second bracket laterally mounted onto the linkage assembly through the frame. The first bracket and the second bracket are slidably relative to the frame and selectively connected to each other before being operated.

    摘要翻译: 用于锤击游戏机的提升装置包括框架,横向安装到框架的下部的马达,纵向安装在框架上部的座椅,部分地容纳在座椅中并贯穿座椅的提升单元,第一托架 固定在提升装置的下端,连接到电动机的连杆组件和通过框架横向安装到连杆组件上的第二支架。 第一支架和第二支架相对于框架可滑动并且在操作之前彼此选择性地连接。

    REDUCTION OF OCD MEASUREMENT NOISE BY WAY OF METAL VIA SLOTS
    6.
    发明申请
    REDUCTION OF OCD MEASUREMENT NOISE BY WAY OF METAL VIA SLOTS 有权
    通过金属通过滑块减少OCD测量噪声

    公开(公告)号:US20130256659A1

    公开(公告)日:2013-10-03

    申请号:US13436952

    申请日:2012-04-01

    IPC分类号: H01L23/58 H01L21/66

    摘要: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate and an interconnect structure disposed over the substrate. The interconnect structure includes a plurality of interconnect layers. One of the interconnect layers contains: a plurality of metal via slots and a bulk metal component disposed over the plurality of metal via slots. The present disclosure also provides a method. The method includes providing a wafer, and forming a first layer over the wafer. The method includes forming an interconnect structure over the first layer. The forming the interconnect structure includes forming a second interconnect layer over the first layer, and forming a third interconnect layer over the second interconnect layer. The second interconnect layer is formed to contain a plurality of metal via slots and a bulk metal component formed over the plurality of metal via slots. The third interconnect layer contains one or more metal trenches.

    摘要翻译: 本发明提供一种半导体器件。 半导体器件包括衬底和布置在衬底上的互连结构。 互连结构包括多个互连层。 互连层中的一个包含:多个金属通孔插槽和设置在多个金属通孔上的体金属部件。 本公开还提供了一种方法。 该方法包括提供晶片,并在晶片上形成第一层。 该方法包括在第一层上形成互连结构。 形成互连结构包括在第一层上形成第二互连层,以及在第二互连层上形成第三互连层。 第二互连层形成为包含多个金属通孔槽和形成在多个金属通孔上的体金属部件。 第三互连层包含一个或多个金属沟槽。

    Modeling resolution enhancement processes in integrated circuit fabrication
    7.
    发明授权
    Modeling resolution enhancement processes in integrated circuit fabrication 有权
    集成电路制造中的建模分辨率增强过程

    公开(公告)号:US07653890B2

    公开(公告)日:2010-01-26

    申请号:US11096469

    申请日:2005-04-01

    IPC分类号: G06F17/50 G06F9/455

    CPC分类号: G03F1/36

    摘要: A Wafer Image Modeling and Prediction System (“WIMAPS”) is described that includes systems and methods that generate and/or apply models of resolution enhancement techniques (“RET”) and printing processes in integrated circuit (“IC”) fabrication. The WIMAPS provides efficient processes for use by designers in predicting the RET and wafer printing process so as to allow designers to filter predict printed silicon contours prior to application of RET and printing processes to the circuit design.

    摘要翻译: 描述了一种晶片图像建模和预测系统(“WIMAPS”),其包括在集成电路(“IC”)制造中生成和/或应用分辨率增强技术(“RET”)和印刷过程的模型的系统和方法。 WIMAPS提供了设计人员在预测RET和晶片印刷过程中使用的有效过程,以便设计人员可以在将RET和印刷工艺应用于电路设计之前过滤预测印刷硅轮廓。

    Modeling resolution enhancement processes in integrated circuit fabrication
    8.
    发明申请
    Modeling resolution enhancement processes in integrated circuit fabrication 有权
    集成电路制造中的建模分辨率增强过程

    公开(公告)号:US20050268256A1

    公开(公告)日:2005-12-01

    申请号:US11096469

    申请日:2005-04-01

    CPC分类号: G03F1/36

    摘要: A Wafer Image Modeling and Prediction System (“WIMAPS”) is described that includes systems and methods that generate and/or apply models of resolution enhancement techniques (“RET”) and printing processes in integrated circuit (“IC”) fabrication. The WIMAPS provides efficient processes for use by designers in predicting the RET and wafer printing process so as to allow designers to filter predict printed silicon contours prior to application of RET and printing processes to the circuit design

    摘要翻译: 描述了一种晶片图像建模和预测系统(“WIMAPS”),其包括在集成电路(“IC”)制造中生成和/或应用分辨率增强技术(“RET”)和印刷过程的模型的系统和方法。 WIMAPS提供了设计人员在预测RET和晶片印刷过程中使用的有效过程,以便设计人员可以在将RET和印刷工艺应用于电路设计之前过滤预测印刷硅轮廓

    DISPENSING DEVICE FOR VENDING MACHINE
    9.
    发明申请
    DISPENSING DEVICE FOR VENDING MACHINE 有权
    用于自动售货机的分配装置

    公开(公告)号:US20140251756A1

    公开(公告)日:2014-09-11

    申请号:US13786244

    申请日:2013-03-05

    IPC分类号: B65G47/36

    CPC分类号: B65G47/36 A63F9/30 G07F11/42

    摘要: A vending machine is equipped with a dispensing device that includes a plate, a track, carriers, a work station, a driving unit and a sensor. The plate is horizontally placed in a vending machine. The track is connected to the plate. The carriers are movably connected to the track for carrying products. The work station causes a selected one of the carriers to release the corresponding one of the products. The driving unit drives the carriers along the track. The sensor senses the selected one of the carriers and accordingly stops the driving unit so that the selected one of the carriers is placed at the work station.

    摘要翻译: 自动售货机配备有分配装置,其包括板,轨道,载体,工作站,驱动单元和传感器。 水平放置在自动售货机中。 轨道连接到板。 载体可移动地连接到用于承载产品的轨道。 工作站使选定的一个载体释放对应的一个产品。 驱动单元沿轨道驱动载体。 感测器感测所选择的一个载体,因此停止驱动单元,使得所选择的一个载体被放置在工作站。

    GaN semiconductor device
    10.
    发明申请
    GaN semiconductor device 有权
    GaN半导体器件

    公开(公告)号:US20090256159A1

    公开(公告)日:2009-10-15

    申请号:US12382955

    申请日:2009-03-27

    IPC分类号: H01L33/00 H01L29/20

    摘要: This invention discloses a GaN semiconductor device comprising a substrate; a metal-rich nitride compound thin film on the substrate; a buffer layer formed on the metal-rich nitride compound thin film, and a semiconductor stack layer on the buffer layer wherein the metal-dominated nitride compound thin film covers a partial upper surface of the substrate. Because metal-rich nitride compound is amorphous, the epitaxial growth direction of the buffer layer grows upwards in the beginning and then turns laterally, and the epitaxy defects of the buffer layer also bend with the epitaxial growth direction of the buffer layer. Therefore, the probability of the epitaxial defects extending to the semiconductor stack layer is reduced and the reliability of the GaN semiconductor device is improved.

    摘要翻译: 本发明公开了一种包括基板的GaN半导体器件; 在基板上形成富金属的氮化物化合物薄膜; 形成在富金属氮化物化合物薄膜上的缓冲层,以及缓冲层上的半导体堆叠层,其中金属主导的氮化物化合物薄膜覆盖基板的部分上表面。 因为富金属的氮化物是非晶体,所以缓冲层的外延生长方向在开始时向上生长然后横向变化,并且缓冲层的外延缺陷也随着缓冲层的外延生长方向而弯曲。 因此,延伸到半导体堆叠层的外延缺陷的概率降低,并且提高了GaN半导体器件的可靠性。