摘要:
A raised floor includes a base plate, a raised plate, a support frame, and a transfer structure, in which the raised plate is parallelly disposed above the base plate; the support frame is disposed between the base plate and the raised plate; and the transfer structure that is configured with a first terminal and a second terminal is arranged by fixing the first terminal to the base plat and the second terminal to the raised plate.
摘要:
A delay-locked loop (DLL) which receives a reference clock signal and outputs an output clock signal is provided. The DLL includes a phase detector, a delay chain, an anti-false lock (AFL) circuit, and a loop filter. The phase detector outputs a first comparison signal according to a phase comparison between the reference clock signal and the output clock signal. The delay chain generates a plurality of strobe clock signals and the output clock signal by delaying the reference clock signal for different intervals. The AFL circuit outputs a second comparison signal according to a phase comparison between the reference clock signal and the strobe clock signals. The loop filter controls the delay time of the output clock signal according to the first and the second comparison signals in order to lock the delay time of the output clock signal at a preset value.
摘要:
Methods and apparatus to preventing mold feeder jams in a system to package integrated circuits. An example method includes detecting if a mold compound tablet has a first alignment on a path and removing the mold compound tablet from the path if the mold compound tablet has a second alignment different from the first alignment.
摘要:
A method for forming a multi-level semiconductor device to eliminate conductive interconnect protrusions following a WAT test, the method including forming a first metallization layer; carrying out a wafer acceptance testing (WAT) process; and, then carrying out a chemical mechanical polish (CMP) on the metallization layer.
摘要:
A fiber container receiving optical fibers has a body, a space defined in the body, a reel disposed inside the body, wherein a groove is defined around the periphery of the reel. The optical fibers are twisted around the reel and received in the groove. Furthermore, the fiber container is able to apply to the active/passive optical communication device, such as an erbium doped fiber amplifier (EDFA) or a dense wavelength division multiplexer (DWDM).
摘要:
A method of forming a resistor is described which achieves improved resistor stability and voltage coefficient of resistance. A resistor is formed from a conducting material such as doped silicon or polysilicon. The resistor has a rectangular first, second, third, fourth, and fifth resistor elements. A layer of protective dielectric is formed over the first, second, and third resistor elements leaving the fourth and fifth resistor elements exposed. The conducting material in the exposed fourth and fifth resistor elements is then changed to a silicide to form low resistance contacts between the second and fourth resistor elements and between the second and fourth resistor elements. The second and third resistor elements are wider than the first resistor element and provide a low resistance contacts to the first resistor element. This provides a low voltage coefficient of resistance and thermal process stability for the resistor.
摘要:
A first metal plug is formed in the first layer of dielectric. A freestanding second metal plug is created that aligns with and makes contact with the first metal plug, extending the first metal plug. The second metal plug is surrounded by an opening that has been created in layers of etch stop and dielectric. A layer of capacitor dielectric is deposited over the exposed surfaces of the first and second metal plugs and the inside surfaces of the opening that surrounds the second plug. A layer of metal is created over the capacitor dielectric inside the opening in the layers of etch stop and dielectric.
摘要:
A three-dimensional integrated circuit (3DIC) including a top chip having at least one active device and an interposer having conductive routing layers and vias. The 3DIC further includes a plurality of conductive connectors configured to electrically connect the top chip and the interposer. The 3DIC further includes a conductive line over at least one of the top chip or the interposer. The conductive line traces a perimeter of top chip or interposer parallel to an outer edge of the top chip or interposer. The conductive line is configured to electrically connect the conductive connectors. The 3DIC further includes at least one testing element over at least one of the top chip or the interposer. The testing element is configured to electrically connect to the plurality of conductive connectors.
摘要:
A delay-locked loop (DLL) which receives a reference clock signal and outputs an output clock signal is provided. The DLL includes a phase detector, a delay chain, an anti-false lock (AFL) circuit, and a loop filter. The phase detector outputs a first comparison signal according to a phase comparison between the reference clock signal and the output clock signal. The delay chain generates a plurality of strobe clock signals and the output clock signal by delaying the reference clock signal for different intervals. The AFL circuit outputs a second comparison signal according to a phase comparison between the reference clock signal and the strobe clock signals. The loop filter controls the delay time of the output clock signal according to the first and the second comparison signals in order to lock the delay time of the output clock signal at a preset value.
摘要:
An electronic device includes a case, a plate, and a detachable member. The case has a first receiving area, a second receiving area, and a movable latch. The first receiving area is adjacent to the second receiving area. The movable latch moves back and forth between the first receiving area and the second receiving area. The detachable member is assembled to the first receiving area. The plate is assembled to the second receiving area. When the movable latch is located in the first receiving area, the movable latch locks the detachable member to the case. When the movable latch moves to the second receiving area, the movable latch is locked to the plate.