公开(公告)号：US06854900B2

公开(公告)日：2005-02-15

申请号：US10195497

申请日：2002-07-16

申请人： I-Jen Lai ,  Pie-Yau Chien ,  Chin-Hsiang Wang ,  Yu-Ting Lee ,  Tsung-Yueh Tsai ,  Chih-Hsien Lin

发明人： I-Jen Lai ,  Pie-Yau Chien ,  Chin-Hsiang Wang ,  Yu-Ting Lee ,  Tsung-Yueh Tsai ,  Chih-Hsien Lin

IPC分类号： G02B6/293 ,  G02B6/32 ,  G02B6/34 ,  G02B6/42 ,  G02B6/36 ,  H04J14/02

CPC分类号： G02B6/2938 ,  G02B6/2937 ,  G02B6/327 ,  G02B6/4233 ,  G02B6/4239

摘要： A method of fabricating a WDM unit consists of attaching a first and a second GRIN lenses to opposite faces of a WDM filter. A dual fiber pigtail and a single fiber pigtail are mounted in corresponding glass tubes. The glass tube with the dual fiber pigtail and the glass tube with the single fiber pigtail are mounted on the second GRIN lens and the first GRIN lens respectively. The position of the dual fiber pigtail and the single fiber pigtail are adjusted with respect to the second GRIN lens and the first GRIN lens respectively to obtain the best optical property. The invention prevents the WDM filter from tilting during temperature variation by sandwiching the WDM filter in between the two GRIN lenses, and further prevents the WDM unit from increasing the reflection loss and insertion loss.

摘要翻译： 制造WDM单元的方法包括将第一和第二GRIN透镜附接到WDM滤光器的相对面。 双纤尾纤和单纤尾纤安装在相应的玻璃管中。 具有双纤维尾纤的玻璃管和带有单纤维尾纤的玻璃管分别安装在第二GRIN透镜和第一GRIN透镜上。 相对于第二GRIN透镜和第一GRIN透镜分别调整双光纤尾纤和单纤尾纤的位置，以获得最佳的光学性能。 本发明通过将WDM滤光片夹在两个GRIN透镜之间来防止WDM滤光器在温度变化期间倾斜，并且进一步防止WDM单元增加反射损耗和插入损耗。

公开(公告)号：US06873778B2

公开(公告)日：2005-03-29

申请号：US10291836

申请日：2002-11-12

申请人： Tsung-Yueh Tsai ,  Chin-Hsiang Wang ,  Yu-Ting Lee ,  Chih-Hsien Lin

发明人： Tsung-Yueh Tsai ,  Chin-Hsiang Wang ,  Yu-Ting Lee ,  Chih-Hsien Lin

IPC分类号： B65H18/08 ,  G02B6/00 ,  H01S3/067

CPC分类号： H01S3/06704

摘要： A fiber container receiving optical fibers has a body, a space defined in the body, a reel disposed inside the body, wherein a groove is defined around the periphery of the reel. The optical fibers are twisted around the reel and received in the groove. Furthermore, the fiber container is able to apply to the active/passive optical communication device, such as an erbium doped fiber amplifier (EDFA) or a dense wavelength division multiplexer (DWDM).

摘要翻译： 容纳光纤的纤维容器具有主体，在主体中限定的空间，设置在主体内部的卷轴，其中围绕卷轴的周边限定有凹槽。 光纤绕卷轴扭转并被接收在槽中。 此外，光纤容器能够应用于有源/无源光通信设备，例如掺铒光纤放大器（EDFA）或密集波分复用器（DWDM）。

公开(公告)号：US06797941B2

公开(公告)日：2004-09-28

申请号：US10244510

申请日：2002-09-17

申请人： Chin-Hsiang Wang ,  Chih-Hsiang Lin ,  Tsung-Yueh Tsai

发明人： Chin-Hsiang Wang ,  Chih-Hsiang Lin ,  Tsung-Yueh Tsai

IPC分类号： H01J502

CPC分类号： G02B6/29383 ,  G02B6/2937 ,  G02B6/32

摘要： A highly reliable optical add/drop device is described. The optical add/drop device has an external tube and a ring, wherein the external tube and the ring are made of metallic material. A WDM filter is fixed in the ring. The ring is inserted in the external tube at the middle portion and fixed therein by soft solder technique. A single fiber collimator and a dual fiber collimator are respectively coupled with the opposite surfaces of the filter, and aligned in the external tube. Additionally, the single and dual fiber collimators are also fixed therein by soft solder technique, as two metal tubes respectively hold the single and dual fiber collimators. In the invention, the WDM filter is rigidly fixed to avoid tilting during temperature variation. Moreover, the invention provides an optical add/drop device with low insertion loss and reflection loss.

摘要翻译： 描述了一种高度可靠的光分插装置。 光学分插装置具有外管和环，其中外管和环由金属材料制成。 WDM滤波器固定在环中。 环在中间部分插入外管，并通过软焊技术固定在其中。 单纤维准直器和双光纤准直器分别与过滤器的相对表面耦合，并在外管中对准。 此外，单和双光纤准直器也通过软焊技术固定在其中，因为两个金属管分别保持单和双光纤准直器。 在本发明中，WDM过滤器是刚性固定的，以避免温度变化时的倾斜。 此外，本发明提供了具有低插入损耗和反射损耗的光学分插装置。

公开(公告)号：US08592982B2

公开(公告)日：2013-11-26

申请号：US13252850

申请日：2011-10-04

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  Tai-Ping Wang ,  Ming-Hsiang Cheng

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  Tai-Ping Wang ,  Ming-Hsiang Cheng

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/48 ,  H01L23/3114 ,  H01L23/522 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06565 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.

摘要翻译： 半导体封装包括半导体结构。 半导体结构包括多个介电层和嵌入在半导体结构中的多个导电互连。 半导体结构还包括多个邻近通信信号输入端。 多个邻近通信信号输入端中的至少一个包括第一电极和第二电极。 间隔开第一电极和第二电极，以便配置成通过电容耦合提供邻近通信。 第一电极在半导体结构的表面附近露出。

公开(公告)号：US08253431B2

公开(公告)日：2012-08-28

申请号：US12784121

申请日：2010-05-20

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  I. L. Lin ,  Ken Juang ,  Ming-Hsiang Cheng

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  I. L. Lin ,  Ken Juang ,  Ming-Hsiang Cheng

IPC分类号： G01R31/20 ,  G01R31/00

CPC分类号： G01R1/0483 ,  G01R1/0466 ,  G01R31/2886

摘要： The present invention relates to an apparatus and a method for testing non-contact pads of a semiconductor device to be tested. The apparatus includes an insulating body, at least one testing module and a plurality of probes. The insulating body includes an accommodating cavity, a lower opening and at least one side opening. The side opening communicates with the accommodating cavity and the lower opening. The testing module is disposed in the side opening, and each testing module includes a circuit board and an active chip. The active chip is disposed on and electrically connected to the circuit board. The active chip has a plurality of testing pads exposed to the accommodating cavity. The probes are disposed in the lower opening. Whereby, the non-contact pads of the semiconductor device to be tested face but not in physically contact with the testing pads of the active chip, so as to test the proximity communication between the non-contact pads of the semiconductor device and the testing pads of the active chip.

摘要翻译： 本发明涉及一种用于测试待测半导体器件的非接触焊盘的装置和方法。 该装置包括绝缘体，至少一个测试模块和多个探针。 绝缘体包括容纳腔，下开口和至少一个侧开口。 侧开口与容纳腔和下开口连通。 测试模块设置在侧开口中，每个测试模块包括电路板和有源芯片。 有源芯片设置在电路板上并与之电连接。 有源芯片具有暴露于容纳腔的多个测试焊盘。 探针设置在下开口中。 因此，要测试的半导体器件的非接触焊盘面对但不与有源芯片的测试焊盘物理接触，以便测试半导体器件的非接触焊盘与测试焊盘之间的接近连接 的有源芯片。

公开(公告)号：US08222726B2

公开(公告)日：2012-07-17

申请号：US12748843

申请日：2010-03-29

申请人： Hsiao-Chuan Chang ,  Tsung-Yueh Tsai ,  Yi-Shao Lai ,  Jiunn Chen ,  Ming-Hsiang Cheng

发明人： Hsiao-Chuan Chang ,  Tsung-Yueh Tsai ,  Yi-Shao Lai ,  Jiunn Chen ,  Ming-Hsiang Cheng

IPC分类号： H01L21/50 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L25/0657 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/48 ,  H01L24/05 ,  H01L24/17 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4899 ,  H01L2224/49175 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/15157 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device package and a method of fabricating the same are provided. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively.

摘要翻译： 提供半导体器件封装及其制造方法。 半导体器件封装包括衬底，第一芯片，跳线芯片，多个第一接合线和多个第二接合线。 衬底具有多个接触焊盘。 第一芯片通过第一接合线布置并电连接到基板。 跳线芯片设置在第一芯片上并且具有多个金属焊盘。 每个金属焊盘分别经由两个第二接合线电连接到衬底的两个接触焊盘。

公开(公告)号：US20100123894A1

公开(公告)日：2010-05-20

申请号：US12367629

申请日：2009-02-09

申请人： Tsung-Yueh Tsai

发明人： Tsung-Yueh Tsai

IPC分类号： G01C3/08

CPC分类号： G01C15/002 ,  G01S7/4811 ,  G01S7/4972

摘要： A distance-measuring apparatus is disclosed. The distance-measuring apparatus includes: an emitter, emitting a light to be measured toward a target, a receiver, receiving a reflected emitted light; a reflector, reflecting the emitted light to the receiver; a condensing lens, condensing the reflected emitted light, reflected by the target to the reflector; a driving module, adjusting the inclination angle of the reflector; and a control unit, controlling the driving module to rotate according to a result of comparing the intensity of the emitted light received by the receiver and a predetermined value.

摘要翻译： 公开了一种测距装置。 测距装置包括：发射器，朝向目标发射待测光，接收器，接收反射的发射光; 将发射的光反射到接收器的反射器; 聚光透镜，将反射的发射光聚焦，由目标反射到反射器; 驱动模块，调整反射器的倾斜角度; 以及控制单元，根据将接收机接收到的发射光的强度与预定值进行比较的结果来控制驱动模块的旋转。

公开(公告)号：US20090051048A1

公开(公告)日：2009-02-26

申请号：US12222610

申请日：2008-08-13

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/32 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A package structure and a manufacturing method thereof are provided. The package structure includes a carrier, a chip-bonding structure and a chip. The chip-bonding structure is formed on a first surface of the carrier. The chip-bonding structure includes a cavity, a dam, several via holes and several solder bumps. The solder bumps are received in the via holes and are correspond to the first connecting pads located on the carrier. The chip is embedded in the cavity of the chip-bonding structure. An active surface of the chip is tightly pasted on the first surface of the chip-bonding structure, and the first solder pads form electrical contact with the corresponding solder bumps. The chip of the package structure is precisely disposed on the carrier, not only simplifying the manufacturing process but also forming stable electrical connection between the chip and the carrier of the package structure.

摘要翻译： 提供一种封装结构及其制造方法。 封装结构包括载体，芯片结合结构和芯片。 芯片接合结构形成在载体的第一表面上。 芯片结合结构包括空腔，坝，几个通孔和几个焊料凸块。 焊料凸块被容纳在通孔中并且对应于位于载体上的第一连接焊盘。 芯片嵌入在芯片结合结构的空腔中。 芯片的有源表面被牢固地粘贴在芯片接合结构的第一表面上，并且第一焊盘与相应的焊料凸块形成电接触。 封装结构的芯片精确地布置在载体上，不仅简化了制造工艺，而且还在封装结构的芯片和载体之间形成稳定的电连接。

公开(公告)号：US20050006756A1

公开(公告)日：2005-01-13

申请号：US10711237

申请日：2004-09-03

申请人： Tsung-Yueh Tsai ,  Sheng-Yang Peng

发明人： Tsung-Yueh Tsai ,  Sheng-Yang Peng

IPC分类号： H01L23/473 ,  H01L23/495

CPC分类号： H01L23/473 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electrically connected to the carrier, while the mold compound covers the chip and one surface of the carrier. The cooling tubule is disposed either within the mold compound or on an outer surface of the mold compound. The cooling tubule is connected to a cooling tubing of the cooling system and a fluid driven by a pump circulates in the cooling tubing and the cooling tubule for heat dissipation.

摘要翻译： 本发明涉及一种与冷却系统兼容的封装结构，该封装结构包括可连接到冷却系统的载体，芯片，模具化合物和冷却小管。 芯片布置在载体上并电连接到载体上，而模具化合物覆盖芯片和载体的一个表面。 冷却管被设置在模具化合物内或模具化合物的外表面上。 冷却管与冷却系统的冷却管连接，由泵驱动的流体在冷却管和冷却管中循环，用于散热。

公开(公告)号：US08368216B2

公开(公告)日：2013-02-05

申请号：US12872644

申请日：2010-08-31

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  Hsiao-Chuan Chang ,  Ming-Hsiang Cheng

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  Hsiao-Chuan Chang ,  Ming-Hsiang Cheng

IPC分类号： H01L23/538 ,  H01L21/60 ,  H01L23/488

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/27 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/16145 ,  H01L2224/2784 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/831 ,  H01L2225/06513 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/014

摘要： The present invention relates to a semiconductor package having at least one first layer chip, a plurality of first metal bumps, at least one second layer chip and a package body. The first layer chip includes a first active surface upon which the first metal bumps are disposed and a plurality of first signal coupling pads disposed adjacent to the first active surface. The second layer chip is electrically connected to the first layer chip, and includes a second active surface that faces the first active surface and a plurality of second signal coupling pads. The second signal coupling pads are capacitively coupled to the first signal coupling pads so as to provide proximity communication between the first layer chip and the second layer chip. The package body encapsulates the first layer chip, the first metal bumps, and the second layer chip, and the first metal bumps are partially exposed.

摘要翻译： 本发明涉及具有至少一个第一层芯片，多个第一金属凸块，至少一个第二层芯片和封装体的半导体封装。 第一层芯片包括设置有第一金属凸块的第一有源表面和与第一有源表面相邻设置的多个第一信号耦合焊盘。 第二层芯片电连接到第一层芯片，并且包括面向第一有源表面的第二有源表面和多个第二信号耦合焊盘。 第二信号耦合焊盘电容耦合到第一信号耦合焊盘，以便提供第一层芯片和第二层芯片之间的接近通信。 封装体封装第一层芯片，第一金属凸块和第二层芯片，并且第一金属凸块部分地露出。