公开(公告)号：US08610138B2

公开(公告)日：2013-12-17

申请号：US13296735

申请日：2011-11-15

申请人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuok Jung Choi

发明人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuok Jung Choi

IPC分类号： H01L33/64

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

公开(公告)号：US08445933B2

公开(公告)日：2013-05-21

申请号：US12782287

申请日：2010-05-18

申请人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

发明人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC分类号： H01L33/62

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

公开(公告)号：US08076680B2

公开(公告)日：2011-12-13

申请号：US11908112

申请日：2005-10-26

申请人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

发明人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC分类号： H01L33/00

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

摘要翻译： 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US20090267085A1

公开(公告)日：2009-10-29

申请号：US11908112

申请日：2005-10-26

申请人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

发明人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC分类号： H01L33/00

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

摘要翻译： 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US08937326B2

公开(公告)日：2015-01-20

申请号：US13033702

申请日：2011-02-24

申请人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

发明人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC分类号： H01L33/62 ,  H01L27/15 ,  F21K99/00 ,  H01L33/48 ,  H01L33/64

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

摘要翻译： 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US08368190B2

公开(公告)日：2013-02-05

申请号：US13074740

申请日：2011-03-29

申请人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

发明人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC分类号： H01L23/495

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

公开(公告)号：US08159000B2

公开(公告)日：2012-04-17

申请号：US13159846

申请日：2011-06-14

申请人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

发明人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC分类号： H01L33/00 ,  H01L23/34

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

摘要翻译： 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US07361940B2

公开(公告)日：2008-04-22

申请号：US11178144

申请日：2005-07-08

申请人： Do Hyung Kim ,  Chung Hoon Lee ,  Keon Young Lee

发明人： Do Hyung Kim ,  Chung Hoon Lee ,  Keon Young Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L23/4334 ,  H01L24/48 ,  H01L25/0753 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.

摘要翻译： 被配置为与诸如发光二极管（LED）的电子设备一起使用的引线框架包括用于支撑散热器的散热器支撑环。 外框架与散热器支撑环间隔开，并且包围散热器支撑环。 至少一个支撑引线连接散热器支撑环和外框。 分离的引线从外框架朝向散热器支撑环延伸，并且与散热器支撑环间隔开。 可以在散热器之后通过注射成型形成的封装体插入引线框架中。

公开(公告)号：US07737463B2

公开(公告)日：2010-06-15

申请号：US12196028

申请日：2008-08-21

申请人： Chung Hoon Lee ,  Do Hyung Kim ,  Keon Young Lee

发明人： Chung Hoon Lee ,  Do Hyung Kim ,  Keon Young Lee

IPC分类号： H01L29/00 ,  H01L23/04 ,  H01L23/34

CPC分类号： H01L33/52 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals and a heat sink inserted into a heat sink support ring. At least portions of the pair of lead terminals and the heat sink are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.

摘要翻译： 公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子和插入散热器支撑环的散热器。 一对引线端子和散热片的至少一部分嵌入在封装主体中。 包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。 第一模塑树脂覆盖LED芯片。 具有比第一成型体硬度高的第二成型树脂覆盖第一成型树脂。 因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

公开(公告)号：US08188687B2

公开(公告)日：2012-05-29

申请号：US11994308

申请日：2006-05-09

申请人： Chung Hoon Lee ,  James S. Speck ,  Hong San Kim ,  Jae Jo Kim ,  Sung Han Kim ,  Jae Ho Lee

发明人： Chung Hoon Lee ,  James S. Speck ,  Hong San Kim ,  Jae Jo Kim ,  Sung Han Kim ,  Jae Ho Lee

IPC分类号： H05B37/00

CPC分类号： H05B33/0827 ,  H01L27/153 ,  H01L27/156 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05B33/02 ,  H05B33/08 ,  H05B33/0806 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0824 ,  H05B33/083 ,  H05B33/0848 ,  H05B37/029

摘要： Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor. Further, there is provided an AC light-emitting device, wherein a plurality of arrays having the different numbers of light emitting cells are employed to increase light emission time and to reduce a flicker effect.

摘要翻译： 公开了一种用于AC电力操作的改进的发光装置。 传统的发光器件采用具有反向并联连接的发光单元阵列的交流发光二极管。 现有技术中的阵列响应于AC电源的相变而交替重复开/关，导致在1/2周期期间的短发光时间和闪烁效应的发生。 根据本发明的交流发光装置采用各种手段，响应于​​交流电源的相变而在1/2周期期间发光时间延长，并且可以减少闪烁效应。 例如，装置可以是分别连接到发光单元，连接到多个阵列的切换块或延迟荧光体之间的节点的切换块。 此外，提供了一种交流发光装置，其中采用具有不同数量的发光单元的多个阵列来增加发光时间并减少闪烁效果。