摘要:
Provided are a polyamide combination that includes: a first polyamide including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second polyamide including a repeating unit represented by Chemical Formula 3, and a film prepared using the polyamide combination.
摘要:
A poly(amide-imide) block copolymer that includes: a first segment including a repeating unit represented by Chemical Formula 1A, a repeating unit represented by Chemical Formula 1B, a repeating unit represented by Chemical Formula 1C, or a combination thereof; and a second segment including a repeating unit represented by Chemical Formula 2:
摘要:
A polyamide block copolymer that includes a first segment including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second segment including a repeating unit represented by Chemical Formula 3. The variables R1 to R15, and n1 to n8 are defined herein.
摘要:
An article including a polymer element including a polymer, and inorganic particles having a concentration gradient which decreases in concentration from at least one surface of the polymer element to the inside thereof, wherein the inorganic particles have a refractive index that is greater than or equal to the refractive index of air and less than the refractive index of the polymer.
摘要:
A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.
摘要:
A composition, including a liquid crystal polymer or oligomer having a terminal hydroxyl group, and a cross-linking agent including a bismaleimide compound, an epoxy resin or a combination thereof, wherein the liquid crystal polymer or oligomer is represented by Formula 1: Z1-(R1)m—(R2)n-Z2 (1), wherein R1 is represented by Formula 2: —X1—Ar1—Y1— (2), wherein X1 and Y1 are each independently selected from the group consisting of O, CO and NR″, in which R″ is independently selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C20 alkyl group, and a substituted or unsubstituted C6-C30 aryl group, and Ar1 includes at least one divalent aromatic or alicyclic organic group selected from the group consisting of Formula 3:
摘要:
A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.
摘要:
Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.
摘要:
Example embodiments provide a composition for preparing modified polyimide/clay nanocomposites. The composition comprises a modified polyamic acid terminated with groups at both ends of the backbone and a layered clay compound. Example embodiments provide a method for preparing modified polyimide/clay nanocomposites using the composition. Polyimide/clay nanocomposites prepared by the method exhibit excellent thermal properties. Therefore, the polyimide/clay nanocomposites can find many useful applications as materials for next-generation substrates that are small in size and thickness and light in weight.
摘要:
Disclosed herein is a liquid crystal polyester resin composition and a printed circuit board using the composition. The composition comprises a liquid crystal polyester, a polybenzimidazole and an aprotic solvent. The composition exhibits good thermal stability and has a low dielectric constant. The composition can be advantageously used as a material for printed circuit boards (PCBS) used in semiconductor packages, mobile devices and LCD devices.