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    COMPOSITION FOR PREPARING MODIFIED POLYIMIDE/CLAY NANOCOMPOSITES AND PREPARATION METHOD OF MODIFIED POLYMIDE/CLAY NANOCOMPOSITES USING THE SAME
    2.
    发明申请
    COMPOSITION FOR PREPARING MODIFIED POLYIMIDE/CLAY NANOCOMPOSITES AND PREPARATION METHOD OF MODIFIED POLYMIDE/CLAY NANOCOMPOSITES USING THE SAME 审中-公开
    用于制备改性聚酰亚胺/粘土纳米复合材料的组合物及其改性聚酰亚胺/粘土纳米复合材料的制备方法

    公开(公告)号：US20090092800A1

    公开(公告)日：2009-04-09

    申请号：US12098797

    申请日：2008-04-07

    申请人： Yoo Seung YANG ,  Myung Sup JUNG ,  Chung Kun CHO

    发明人： Yoo Seung YANG ,  Myung Sup JUNG ,  Chung Kun CHO

    IPC分类号： C08K3/34 ,  B32B3/10

    CPC分类号： C08K9/08 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/24802 ,  Y10T428/31681

    摘要： Example embodiments provide a composition for preparing modified polyimide/clay nanocomposites. The composition comprises a modified polyamic acid terminated with groups at both ends of the backbone and a layered clay compound. Example embodiments provide a method for preparing modified polyimide/clay nanocomposites using the composition. Polyimide/clay nanocomposites prepared by the method exhibit excellent thermal properties. Therefore, the polyimide/clay nanocomposites can find many useful applications as materials for next-generation substrates that are small in size and thickness and light in weight.

    摘要翻译： 示例性实施方案提供了用于制备改性聚酰亚胺/粘土纳米复合材料的组合物。 该组合物包含在主链两端用基团封端的改性聚酰胺酸和层状粘土化合物。 实施例提供了使用该组合物制备改性聚酰亚胺/粘土纳米复合材料的方法。 通过该方法制备的聚酰亚胺/粘土纳米复合材料表现出优异的热性能。 因此，聚酰亚胺/粘土纳米复合材料可以发现许多有用的应用，作为尺寸小，厚度小，重量轻的下一代基板的材料。

    PHOTOSENSITIVE POLYIMIDE COMPOSITION, POLYIMIDE FILM AND SEMICONDUCTOR DEVICE USING THE SAME
    6.
    发明申请
    PHOTOSENSITIVE POLYIMIDE COMPOSITION, POLYIMIDE FILM AND SEMICONDUCTOR DEVICE USING THE SAME 失效
    感光性聚酰亚胺组合物，聚酰亚胺膜和使用其的半导体器件

    公开(公告)号：US20080187867A1

    公开(公告)日：2008-08-07

    申请号：US11861948

    申请日：2007-09-26

    申请人： Myung Sup JUNG ,  Sang Mock LEE ,  Jingyu LEE

    发明人： Myung Sup JUNG ,  Sang Mock LEE ,  Jingyu LEE

    IPC分类号： G03C1/73 ,  C08G73/06 ,  G03C5/00

    CPC分类号： C08L79/08 ,  C08G73/101 ,  C08G73/1014 ,  C08G73/1039 ,  G03F7/0392 ,  Y10S430/107

    摘要： A photosensitive polyimide composition, a polyimide film, and a semiconductor device using the same are disclosed. The photosensitive polyimide composition can be cured by heating. A polyhydroxyimide is used as a base resin and can be mixed with a photoacid generator and a cross-linking agent having two or more vinylether groups. A film of the photosensitive polyimide composition can be developed by treatment with an alkaline aqueous solution. Embodiments of the invention enable improvement in production yield and reliability in a highly-integrated memory semiconductor packaging processes.

    摘要翻译： 公开了光敏聚酰亚胺组合物，聚酰亚胺膜和使用其的半导体器件。 感光性聚酰亚胺组合物可以通过加热固化。 使用聚羟基酰亚胺作为基础树脂，并且可以与光酸产生剂和具有两个或更多个乙烯基醚基团的交联剂混合。 感光性聚酰亚胺组合物的膜可以通过用碱性水溶液处理而显影。 本发明的实施例能够在高度集成的存储器半导体封装工艺中提高生产成品率和可靠性。

    NORBORNENE POLYMER FOR PHOTORESIST AND PHOTORESIST COMPOSITION COMPRISING THE SAME
    7.
    发明申请
    NORBORNENE POLYMER FOR PHOTORESIST AND PHOTORESIST COMPOSITION COMPRISING THE SAME 有权
    用于光刻胶的NORBENNENE聚合物和包含它们的光催化组合物

    公开(公告)号：US20090075207A1

    公开(公告)日：2009-03-19

    申请号：US12272168

    申请日：2008-11-17

    申请人： Jae Jun LEE ,  Do Yun KIM ,  Myung Sup JUNG

    发明人： Jae Jun LEE ,  Do Yun KIM ,  Myung Sup JUNG

    IPC分类号： G03F7/004 ,  G03F7/20

    CPC分类号： G03F7/0395 ,  C08F232/08 ,  G03F7/40 ,  Y10S430/106

    摘要： Disclosed herein is a photoresist composition which includes a norbornene copolymer having an epoxy group, an acid generator, and an organic solvent. The norbornene polymer shows superior mechanical and thermal properties, high transparency, excellent insulating properties, and particularly, improved mechanical properties due to the presence of an epoxy group. The photosensitive resin composition shows superior performance, e.g., transparence, developing properties, residual film characteristics, chemical resistance, heat resistance, and flatness. Particularly, since the photosensitive resin composition enables easy formation of a pattern as an interlayer insulating film and shows a high light transmittance even when being formed into a thin film with a relatively large thickness, it is suitable for the production of an interlayer insulating film used in the fabrication processes of LCDs.

    摘要翻译： 本文公开了包含具有环氧基的降冰片烯共聚物，酸产生剂和有机溶剂的光致抗蚀剂组合物。 降冰片烯聚合物显示出优异的机械和热性能，高透明度，优异的绝缘性能，特别是由于存在环氧基团而改善的机械性能。 感光性树脂组合物显示出优异的性能，例如透明性，显影性，残留膜特性，耐化学性，耐热性和平坦性。 特别是，由于感光性树脂组合物能够容易地形成作为层间绝缘膜的图案，并且即使形成厚度较薄的薄膜也显示高透光性，因此适用于制造使用的层间绝缘膜 在LCD的制造过程中。