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公开(公告)号：US07018678B2
公开(公告)日：2006-03-28
申请号：US10453337
申请日：2003-06-03
申请人： Dana A. Gronbeck , Michael K. Gallagher , Jeffrey M. Calvert , Gregory P. Prokopowicz , Timothy G. Adams
发明人： Dana A. Gronbeck , Michael K. Gallagher , Jeffrey M. Calvert , Gregory P. Prokopowicz , Timothy G. Adams
IPC分类号： B05D3/02
CPC分类号： H01L21/02126 , C09D183/04 , C09D183/14 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , Y10T428/249987
摘要： Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
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公开(公告)号：US07256127B2
公开(公告)日：2007-08-14
申请号：US10661051
申请日：2003-09-13
IPC分类号： H01L21/311
CPC分类号： B81B7/0006 , B81B2203/0315 , B81C2201/0108 , H01L21/764 , H01L21/7682 , H01L23/5222 , H01L2924/0002 , Y10T428/24628 , H01L2924/00
摘要： A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
摘要翻译： 提供了一种在固体结构内形成气隙的方法。 在该方法中，牺牲材料被覆盖层覆盖。 然后通过覆盖层去除牺牲材料以留下空隙。 这种气隙特别适用于诸如电互连结构的电子设备中的金属线之间的绝缘。 还提供了包含气隙的结构。
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公开(公告)号：US07723850B2
公开(公告)日：2010-05-25
申请号：US11891857
申请日：2007-08-13
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L27/10 , H01L29/73 , H01L29/74 , H01L29/80 , H01L31/112
CPC分类号： B81B7/0006 , B81B2203/0315 , B81C2201/0108 , H01L21/764 , H01L21/7682 , H01L23/5222 , H01L2924/0002 , Y10T428/24628 , H01L2924/00
摘要： A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
摘要翻译： 提供了一种在固体结构内形成气隙的方法。 在该方法中，牺牲材料被覆盖层覆盖。 然后通过覆盖层去除牺牲材料以留下空隙。 这种气隙特别适用于诸如电互连结构的电子设备中的金属线之间的绝缘。 还提供了包含气隙的结构。
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公开(公告)号：US20100297539A1
公开(公告)日：2010-11-25
申请号：US12582673
申请日：2009-10-20
CPC分类号： G03F7/0752 , G03F7/0757 , G03F7/091 , G03F7/11 , H01L21/0276 , H01L21/3081
摘要： The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.
摘要翻译： 本发明包括可用作外涂光致抗蚀剂的抗反射层的新的含有机组合物。 通过从底涂层显示出足够的等离子体蚀刻选择性，本发明的组合物也可有效地用作硬掩模层。 本发明的优选组合物具有高Si含量并且包含不同树脂的共混物。
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公开(公告)号：US08373241B2
公开(公告)日：2013-02-12
申请号：US12582673
申请日：2009-10-20
IPC分类号： H01L21/76
CPC分类号： G03F7/0752 , G03F7/0757 , G03F7/091 , G03F7/11 , H01L21/0276 , H01L21/3081
摘要： The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.
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公开(公告)号：US07605439B2
公开(公告)日：2009-10-20
申请号：US11512140
申请日：2006-08-29
IPC分类号： H01L21/76
CPC分类号： G03F7/0752 , G03F7/0757 , G03F7/091 , G03F7/11 , H01L21/0276 , H01L21/3081
摘要： The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.
摘要翻译： 本发明包括可用作外涂光致抗蚀剂的抗反射层的新的含有机组合物。 通过从底涂层显示出足够的等离子体蚀刻选择性，本发明的组合物也可有效地用作硬掩模层。 本发明的优选组合物具有高Si含量并且包含不同树脂的共混物。
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公开(公告)号：US08911927B2
公开(公告)日：2014-12-16
申请号：US12862639
申请日：2010-08-24
CPC分类号： G03F7/2041 , G03F7/0046 , G03F7/11
摘要： The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing.
摘要翻译： 本发明涉及用于浸没式光刻处理的光致抗蚀剂组合物上的阻挡层组合物。 在另一方面，提供了用于浸没式光刻处理的新方法。
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公开(公告)号：US07781141B2
公开(公告)日：2010-08-24
申请号：US11173932
申请日：2005-07-01
CPC分类号： G03F7/2041 , G03F7/0046 , G03F7/11
摘要： The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing.
摘要翻译： 本发明涉及用于浸没式光刻处理的光致抗蚀剂组合物上的阻挡层组合物。 在另一方面，提供了用于浸没式光刻处理的新方法。
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公开(公告)号：US08889344B2
公开(公告)日：2014-11-18
申请号：US11417374
申请日：2006-05-04
CPC分类号： G03F7/091 , C08K3/36 , C09D129/04 , C09D133/02 , G03F7/11 , G03F7/2041
摘要： In one aspect, coating compositions are provided that comprise a component a component that comprises one or more silicon, antimony, aluminum, yttrium, cerium, lanthanum, tin, titanium, zirconium, hafnium, indium or zinc compounds. In another aspect, coating compositions are provided that comprise a plurality of discrete particles. Preferred coating compositions of the invention are useful for antireflective purposes, particularly with an underlaying photoresist coating layer, as well as for a barrier layer in immersion lithography.
摘要翻译： 在一个方面，提供了包含组分的涂料组合物，该组分包含一种或多种硅，锑，铝，钇，铈，镧，锡，钛，锆，铪，铟或锌化合物。 在另一方面，提供包含多个离散颗粒的涂料组合物。 本发明优选的涂料组合物可用于抗反射目的，特别是对于底涂光致抗蚀剂涂层以及浸没式光刻中的阻挡层而言是有用的。
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公开(公告)号：US09958780B2
公开(公告)日：2018-05-01
申请号：US12858213
申请日：2010-08-17
CPC分类号： G03F7/11 , G03F7/0392 , G03F7/2041
摘要： In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing.
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