-
公开(公告)号：US07018678B2
公开(公告)日：2006-03-28
申请号：US10453337
申请日：2003-06-03
申请人： Dana A. Gronbeck , Michael K. Gallagher , Jeffrey M. Calvert , Gregory P. Prokopowicz , Timothy G. Adams
发明人： Dana A. Gronbeck , Michael K. Gallagher , Jeffrey M. Calvert , Gregory P. Prokopowicz , Timothy G. Adams
IPC分类号： B05D3/02
CPC分类号： H01L21/02126 , C09D183/04 , C09D183/14 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , Y10T428/249987
摘要： Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
-
公开(公告)号：US07723850B2
公开(公告)日：2010-05-25
申请号：US11891857
申请日：2007-08-13
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L27/10 , H01L29/73 , H01L29/74 , H01L29/80 , H01L31/112
CPC分类号： B81B7/0006 , B81B2203/0315 , B81C2201/0108 , H01L21/764 , H01L21/7682 , H01L23/5222 , H01L2924/0002 , Y10T428/24628 , H01L2924/00
摘要： A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
摘要翻译： 提供了一种在固体结构内形成气隙的方法。 在该方法中，牺牲材料被覆盖层覆盖。 然后通过覆盖层去除牺牲材料以留下空隙。 这种气隙特别适用于诸如电互连结构的电子设备中的金属线之间的绝缘。 还提供了包含气隙的结构。
-
公开(公告)号：US07256127B2
公开(公告)日：2007-08-14
申请号：US10661051
申请日：2003-09-13
IPC分类号： H01L21/311
CPC分类号： B81B7/0006 , B81B2203/0315 , B81C2201/0108 , H01L21/764 , H01L21/7682 , H01L23/5222 , H01L2924/0002 , Y10T428/24628 , H01L2924/00
摘要： A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
摘要翻译： 提供了一种在固体结构内形成气隙的方法。 在该方法中，牺牲材料被覆盖层覆盖。 然后通过覆盖层去除牺牲材料以留下空隙。 这种气隙特别适用于诸如电互连结构的电子设备中的金属线之间的绝缘。 还提供了包含气隙的结构。
-
公开(公告)号：US20120298586A1
公开(公告)日：2012-11-29
申请号：US13479409
申请日：2012-05-24
申请人： Matthew L. Grandbois , Harlan Robert Goltz , Jeffrey M. Calvert , Matthew Lawrence Rodgers , Charles R. Marston
发明人： Matthew L. Grandbois , Harlan Robert Goltz , Jeffrey M. Calvert , Matthew Lawrence Rodgers , Charles R. Marston
IPC分类号： B01D15/04
CPC分类号： G21F9/00 , C22B3/42 , G21F9/04 , G21F9/12 , H01L23/556 , H01L24/13 , H01L2224/13111 , H01L2924/12042 , Y02P10/234 , H01L2924/014 , H01L2924/00
摘要： Methods of purifying acidic metal solutions by removing at least a portion of alpha-particle emitting materials are provided. The purified metal solutions are useful in a variety of applications requiring low levels of alpha-particle emission.
摘要翻译： 提供通过去除至少一部分α粒子发射材料来净化酸性金属溶液的方法。 纯化的金属溶液可用于需要低水平的α粒子发射的各种应用中。
-
公开(公告)号：US06682642B2
公开(公告)日：2004-01-27
申请号：US09976422
申请日：2001-10-12
IPC分类号： C25D338
CPC分类号： C25D5/48 , C25D3/02 , C25D3/38 , C25D7/12 , C25D7/123 , H01L21/2885 , H01L21/76843 , H01L21/76868 , H01L21/76873 , H01L2221/1089
摘要： Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.
摘要翻译： 公开了可用于种子层的修复和电镀的组合物。 还公开了修复和电镀这种种子层的方法。
-
6.发明授权Efficient chemistry for selective modification and metallization of substrates 失效用于基板选择性修饰和金属化的高效化学
公开(公告)号：US5648201A
公开(公告)日：1997-07-15
申请号：US991680
申请日：1992-12-16
申请人： Charles S. Dulcey , Timothy S. Koloski , Walter J. Dressick , Jeffrey M. Calvert , Brian M. Peek
发明人： Charles S. Dulcey , Timothy S. Koloski , Walter J. Dressick , Jeffrey M. Calvert , Brian M. Peek
IPC分类号： C23C18/16 , C23C18/20 , C23C18/28 , G03F7/16 , H05K3/18 , G03C5/00 , B05D1/18 , B05D3/04 , G03C1/492
CPC分类号： G03F7/165 , B82Y30/00 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1844 , C23C18/1868 , C23C18/1893 , C23C18/204 , C23C18/2086 , C23C18/30 , C23C18/31 , H05K3/185 , Y10S430/168
摘要： A process for efficient modification and metallization of substrates includes the steps of providing a substrate with highly photoefficient chemical functional groups on at least a portion of this substrate, exposing the substrate to actinic radiation to transform, deactivate, or remove these chemical functional groups, to modify their chemical reactivity, and carrying out further chemical reaction steps on these modified chemical functional groups.
摘要翻译： 用于衬底的有效改性和金属化的方法包括以下步骤：在该衬底的至少一部分上提供具有高光化学官能团的衬底，将衬底暴露于光化辐射以转化，去活化或除去这些化学官能团， 改变其化学反应性，并对这些改性的化学官能团进行进一步的化学反应步骤。
-
公开(公告)号：US5468597A
公开(公告)日：1995-11-21
申请号：US111640
申请日：1993-08-25
申请人： Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
发明人： Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
IPC分类号： C23F1/00 , C23C18/16 , C23C18/31 , C23F4/00 , G03F7/40 , H01L21/288 , H05K3/06 , H05K3/18 , G03F7/00
CPC分类号： C23C18/1605 , C23C18/1608 , C23C18/1689 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , G03F7/40
摘要： The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
摘要翻译： 本发明涉及一种以选择性图案图案化衬底的方法。 在一个实施例中，该方法包括以下步骤：在衬底表面上形成图案化的涂层，由此衬底的部分被图案化的涂层覆盖，并且衬底的部分保持未涂覆。 在至少那些没有图案化涂层的基底部分上涂覆一层结扎材料。 连接层是能够与无电镀金属催化剂连接的结合层。 然后将如此形成的制品与无电金属化催化剂接触，然后与化学镀溶液接触，以在衬底上形成图案化的金属沉积物。
-
公开(公告)号：US5389496A
公开(公告)日：1995-02-14
申请号：US62706
申请日：1993-05-17
IPC分类号： B05D1/18 , C09D4/00 , C12N5/00 , C23C18/16 , C23C18/20 , C23C18/28 , C40B60/14 , G03F7/004 , G06N3/00 , G06N99/00 , H01L21/288 , H05K3/18 , G03C5/00
CPC分类号： G06N99/007 , B05D1/185 , B82Y10/00 , B82Y30/00 , B82Y40/00 , B82Y5/00 , C09D4/00 , C12N5/0068 , C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/1893 , C23C18/2086 , C23C18/28 , C23C18/30 , C23C18/31 , G03F7/004 , G06N3/002 , H01L21/288 , H01L21/2885 , H05K3/185 , B01J2219/00432 , B01J2219/00603 , B01J2219/00605 , B01J2219/00612 , B01J2219/00617 , B01J2219/00626 , B01J2219/00637 , B01J2219/00659 , B01J2219/00711 , C12N2535/10 , C40B60/14 , Y10T428/24917 , Y10T428/31536
摘要： Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.
摘要翻译： 无电镀金属化的方法和组成。 在一个方面，本发明的特征在于使用能够与无电金属化催化剂连接的化学基团，包括使用化学结合到基底上的连接基团。 在优选的方面，本发明提供了一种用于选择性金属化而不使用常规光致抗蚀剂图案化顺序的装置，使得能够以直接且方便的方式制造高分辨率金属图案。
-
公开(公告)号：US20080182204A1
公开(公告)日：2008-07-31
申请号：US12011534
申请日：2008-01-28
CPC分类号： G03F7/0236
摘要： Photoresist compositions are provided comprising a radiation sensitive component and at least two distinct novolak resins. In one aspect, photoresists of the invention exhibit notably high dissolution rates, such as in excess of 800 angstroms per second in aqueous developer solution. In another aspect, photoresists of the invention can exhibit good photospeeds, such as 100 mJ/cm2 or less.
摘要翻译： 提供的光致抗蚀剂组合物包含辐射敏感组分和至少两种不同的酚醛清漆树脂。 在一个方面，本发明的光刻胶显示出非常高的溶解速率，例如在显影剂水溶液中超过每秒800埃。 在另一方面，本发明的光致抗蚀剂可以显示出良好的感光速度，例如100mJ / cm 2以下。
-
公开(公告)号：US06645364B2
公开(公告)日：2003-11-11
申请号：US10046507
申请日：2001-10-19
IPC分类号： C25D2112
CPC分类号： C25D21/14 , C25D21/12 , Y10T436/24
摘要： Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
-
-
-
-
-
-
-
-
-
搜索结果
34 条记录 (耗时 0.048 秒)
