摘要:
Magnetic bubble domain memory circuit in which magnetizable overlay patterns of magnetically soft material, e.g. permalloy, are provided as bubble propagation elements on a bubble-supporting magnetic layer to define major and minor bubble propagation paths. The major bubble propagation paths provide interchangeable bubble input and output sections, and the minor bubble propagation paths are in the form of closed storage loops providing a bubble storage section comprising first and second pairs of blocks. Bubble generators are provided for each of the blocks included in the first and second pairs thereof comprising the bubble storage section, along with first and second detectors and input/output tracks of bubble propagation elements associated with the respective pairs of blocks of storage loops. Swap transfer/replicate gates are disposed between the input/output tracks and each of the storage loops included in the blocks of storage loops. These gates are alternately operable in a swap transfer mode and a replicate mode so as to simultaneously transfer data as represented by magnetic bubbles and voids from the tracks to the storage loops and from the storage loops to the tracks when operated in a swap transfer mode, and to split respective magnetic bubbles incident thereon in a replicate mode to form a duplicate magnetic bubble in addition to the original magnetic bubble so as to preserve the data intact in the minor storage loop while delivering a bubble to a detector for readout. The first and second bubble detectors are 180.degree. out of phase with respect to each other and are operable during respective halfcycles of a bubble propagation cycle to sense the presence or absence of magnetic bubbles. Thus, respective data bits from different blocks are alternately sensed by the first and second bubble detectors in each bubble propagation cycle to provide a data readout rate twice the field rate.
摘要:
Magnetic bubble domain memory circuit in which magnetizable overlay patterns of magnetically soft material, e.g. permalloy, are provided as bubble propagation elements on a bubble-supporting magnetic layer to define major and minor bubble propagation paths. The bubble propagation elements are arranged to form major propagation paths defining a bubble input section and a bubble output section respectively. A plurality of minor propagation paths in the form of closed storage loops defining a bubble storage section are disposed between the input and output bubble sections, being arranged in even and odd blocks of minor propagation paths. Input swap transfer gates and output replicate gates are provided between the bubble storage loops and the input and output sections respectively. The input swap transfer gates and the output replicate gates are of double level construction, each type of gate including a hairpin element at the first level and a 90.degree. hook-like element at the second level which is correlated into bubble propagation elements included in a minor storage loop. The 90.degree. hook-like elements of corresponding swap transfer and replicate gates are respectively situated at the input and output ends of the minor storage loops, forming the opposite bights of the loop. Bubble generators and detectors are associated with the input and output bubble sections respectively at the opposite ends of the minor storage loops to provide a magnetic bubble domain memory chip for data processing purposes. Data as represented by the presence or absence of a magnetic bubble is transferred into the minor storage loops and replicated outwardly therefrom into the bubble output section for detection in a manner enabling such data to be received by the bubble detector for readout at the field rate.
摘要:
Method of fabricating a magnetic bubble memory device in which the magnetizable upper overlay pattern of magnetically soft material, e.g. permalloy, defining bubble propagation elements and bubble function-determining components as located above a bubble-supporting magnetic film is disposed in a wholly planar configuration to avoid bubble propagation anomalies encountered with typical non-planar overlay patterns of magnetically soft material. The fabrication method provides for the consecutive deposition onto a substrate having a magnetic film capable of supporting magnetic bubbles of a layer of non-magnetic electrically conductive material, a layer of insulating material, and a layer of magnetically soft material, such as permalloy. Patterning of the layers then proceeds from the uppermost layer downwardly in stages to form magnetically soft components defining the elements of magnetic bubble propagation paths and magnetic bubble function-determining components as a planar upper overlay pattern from the layer of magnetically soft material, insulation spacers from the layer of insulating material, and control conductors as a planar lower overlay pattern from the layer of non-magnetic electrically conductive material. Patterning of the respective layers is preferably achieved by ion milling of selected portions of the layer of magnetically soft material as defined by a first mask and by sequential plasma etching of selected portions of the underlying layer of insulating material and the layer of non-magnetic electrically conductive material as defined by a second composite mask partially comprising the overlay pattern of magnetically soft material and photoresist material.
摘要:
A thin film coupled inductor, a thin film spiral inductor, and a system that includes an electronic device and a power supply or power converter incorporating one or more such inductors. A thin film coupled inductor includes a wafer substrate; a bottom yoke comprising a magnetic material above the wafer substrate; a first insulating layer above the bottom yoke; a first conductor above the bottom yoke and separated therefrom by the first insulating layer; a second insulating layer above the first conductor; a second conductor above the second insulating layer; a third insulating layer above the second conductor; and a non-planar top yoke above the third insulating layer, the top yoke comprising a magnetic material.
摘要:
A structure for preventing Electrostatic Discharge (ESD) damage to a magnetoresistive sensor during manufacture. The structure includes a switching element that can be switched off during testing of the sensor and then switched back on to provide ESD shunting to the sensor. The switch can be a thermally activated mechanical relay built onto the slider. The switch could also be a programmable resistor that includes a solid electrolyte sandwiched between first and second electrodes. One of the electrodes functions as an anode. When voltage is applied in a first direction an ion bridge forms across through the electrolyte across electrodes making the resistor conductive. When a voltage is applied in a second direction, the ion bridge recedes and the programmable resistor becomes essentially non-conductive.
摘要:
Magnetic sensing chips and methods of fabricating the magnetic sensing chips are disclosed. A magnetic sensing chip as described herein includes an EMR sensor formed on a substrate from multiple semiconductor layers. One or more of the semiconductor layers form a quantum well comprising a two-dimensional electron gas (2DEG) or hole gas (2DHG). The magnetic sensing chip also includes one or more transistors formed on the substrate from the multiple semiconductor layers. The transistor(s) likewise include a quantum well comprising a 2DEG or 2DHG. The EMR sensor and the transistor(s) are connected by one or more connections so that the transistor(s) amplifies data signals from the EMR sensor.
摘要:
A method and apparatus for oxidizing conductive redeposition in TMR sensors is disclosed. A TMR stack having a first electrode that includes at least a pinned layer and an antiferromagnetic (AFM) layer, a second electrode that includes a free layer and a tunnel barrier is formed. The TMR barrier layer is etched. Redeposition material is oxidized and the barrier is healed using an oxidizing agent selected from the group consisting of ozone and water vapor.
摘要:
A method is presented for fabricating a CPP read head having a CPP read head sensor and a hard bias layer which includes forming a strip of sensor material in a sensor material region, and depositing strips of fast-milling dielectric material in first and second fast-milling dielectric material regions adjacent to the sensor material region. A protective layer and a layer of masking material are deposited on the strip of sensor material and the strips of fast-milling dielectric material to provide masked areas and exposed areas. A shaping source, such as an ion milling source, is provided which shapes the exposed areas. Hard bias material is then deposited on the regions of sensor material and fast-milling dielectric material to form caps on each of these regions. The caps of hard bias material and the masking material are then removed from each of these regions.
摘要:
Solid-state memories are disclosed that are comprised of cross-point memory arrays. The cross-point memory arrays include a first plurality of electrically conductive lines and a second plurality of electrically conductive lines that cross over the first plurality of electrically conductive lines. The memory arrays also include a plurality of memory cells located between the first and second conductive lines. The memory cells are formed from a metallic material, such as FeRh, having the characteristic of a first order phase transition due to a change in temperature. The first order phase transition causes a corresponding change in resistivity of the metallic material.
摘要:
A magnetic head (slider) for perpendicular recording which requires no lapping is described. The head is fabricated with an air bearing surface that is parallel to the wafer surface. The coil and pole pieces are formed from thin films disposed parallel to the air bearing surface. Standard lithographic techniques can be used to define the shapes, gaps and pole piece dimensions. Non-rectilinear shapes can be formed; for example, side shields that conform around the write pole piece region. The thickness of the main and return pole pieces are controlled by the deposition process rather than by lapping. The saw cuts used to separate the individual sliders from the rest of the wafer are perpendicular to the air-bearing surface and do not pass through any critical features.