Abstract:
An improved apparatus for CVD processing is described wherein a wafer mounted on a vertically movable susceptor beneath a gas outlet or showerhead is raised into contact with a shield ring which normally rests on a ring support in the chamber. The shield ring engages the frontside edge of the wafer, lifting the shield ring off its support, when the susceptor and the wafer are raised to a deposition position in the chamber. The shield ring, by engaging the frontside edge of the wafer, shields the edge of the top surface of the wafer, as well as the end edge and the backside of the wafer, during the deposition. Matching tapered edges, respectively, on the susceptor and the shield ring permit alignment of the shield ring with respect to the susceptor, and alignment of the wafer to the susceptor and the shield ring. Alignment means are also disclosed to circularly align the shield ring to its support in the chamber. Multi-unit shield rings permit the use of wider shield rings and prevent cracking of the shield ring due to thermal stresses caused by temperature differences near and away from the wafer during processing. These shield rings may also have tapered edges to ensure alignment of the rings with respect to each other.
Abstract:
A magnetic field enhanced single wafer plasma etch reactor is disclosed. The features of the reactor include an electrically-controlled stepped magnetic field for providing high rate uniform etching at high pressures; temperature controlled reactor surfaces including heated anode surfaces (walls and gas manifold) and a cooled wafer supporting cathode; and a unitary wafer exchange mechanism comprising wafer lift pins which extend through the pedestal and a wafer clamp ring. The lift pins and clamp ring are moved vertically by a one-axis lift mechanism to accept the wafer from a cooperating external robot blade, clamp the wafer to the pedestal and return the wafer to the blade. The electrode cooling combines water cooling for the body of the electrode and a thermal conductivity-enhancing gas parallel-bowed interface between the wafer and electrode for keeping the wafer surface cooled despite the high power densities applied to the electrode. A gas feed-through device applies the cooling gas to the RF powered electrode without breakdown of the gas. Protective coatings/layers of materials such as quartz are provided for surfaces such as the clamp ring and gas manifold. The combination of these features provides a wide pressure regime, high etch rate, high throughput single wafer etcher which provides uniformity, directionality and selectivity at high gas pressures, operates cleanly and incorporates in-situ self-cleaning capability.
Abstract:
An improved process is disclosed for the deposition of a layer of tungsten on a semiconductor wafer in a vacuum chamber wherein the improvements comprise depositing tungsten on the semiconductor wafer in the presence of nitrogen gas to improve the reflectivity of the surface of the resulting layer of tungsten; maintaining the vacuum chamber at a pressure of from about 20 to 760 Torr to improve the deposition rate of the tungsten, as well as to improve the reflectivity of the tungsten surface; and, when needed, the additional step of forming a nucleation layer on the semiconductor layer prior to the step of depositing tungsten on the semiconductor wafer to improve the uniformity of the deposited tungsten layer.
Abstract:
A process is disclosed for the treatment of the backside or back surface of a semiconductor wafer such as a silicon wafer. By spacing the back side of a semiconductor wafer a predetermined distance from a cathode in a vacuum chamber and controlling the rf power and the pressure, a confined plasma may be used both to clean the back side of the wafer to remove impurities, including moisture and other occluded gases; as well as to deposit a layer of oxide on the back surface of the wafer to inhibit subsequent deposition of poorly adherent materials on the back side of the wafer which might otherwise flake off during processing of the front side of the wafer to form integrated circuits thereon.
Abstract:
A magnetic field enhanced single wafer plasma etch reactor is disclosed. The features of the reactor include an electrically-controlled stepped magnetic field for providing high rate uniform etching at high pressures; temperature controlled reactor surfaces including heated anode surfaces (walls and gas manifold) and a cooled wafer supporting cathode; and a unitary wafer exchange mechanism comprising wafer lift pins which extend through the pedestal and a wafer clamp ring. The lift pins and clamp ring are moved vertically by a one-axis lift mechanism to accept the wafer from a cooperating external robot blade, clamp the wafer to the pedestal and return the wafer to the blade. The electrode cooling combines water cooling for the body of the electrode and a thermal conductivity-enhancing gas parallel-bowed interface between the wafer and electrode for keeping the wafer surface cooled despite the high power densities applied to the electrode. A gas feed-through device applies the cooling gas to the RF powered electrode without breakdown of the gas. Protective coatings/layers of materials such as quartz are provided for surfaces such as the clamp ring and gas manifold. The combination of these features provides a wide pressure regime, high etch rate, high throughput single wafer etcher which provides uniformity, directionality and selectivity at high gas pressures, operates cleanly and incorporates in-situ self-cleaning capability.
Abstract:
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
Abstract:
There is disclosed systems and methods for retrieving files from a file server using file attributes. In one embodiment, an audio file server is accessed to retrieve prerecorded audio files using file attributes. In one embodiment, the HTTP protocol is used by adding query attributes, such as a text version of the desired message, along with other required attributes of the audio file, to the audio file server. The audio file server accepts the attributes, including the message text attributes and parses them to resolve which audio (.wav) message to retrieve. The retrieved audio file is then returned to the voice browser, which normally plays the message. In this way, IVR application developers can specify the content, speaker, language, dialect, emotion, and other attributes of a required audio file utilizing standard voice browsers to access audio files.
Abstract:
To communicate requirements for a digital license from a receiver of corresponding digital content to a computing device upon which the digital content is to be rendered, the receiver tunes the content and locates within the content information relating to the requirements for the license, constructs the requirements from the located information, and sends such constructed requirements to the computing device. The computing device upon receiving the sent requirements constructs the license based on such received requirements, stores such constructed license in a license store of such computing device, and thereafter renders the content only in accordance with the license. Thus, the receiver need not communicate the license itself to the computing device.
Abstract:
In one embodiment of the present invention's a system for tracking and managing data over a computer network including a plurality of application computers each operating a computer software application program is provided, comprising a key master (106, 108); a system startup module (100) connected to the key master (106, 108); a gatekeeper (102) connected to the system startup module (100); as task manager (122, 124, 126, 128's 130) connected to the key master (106, 108) and the gatekeeper (102); a central database (112, 114, 116) connected to the gatekeeper (102); a plurality of agents (132, 134, 136, 138, 140) connected to the task manager; a plurality of sub-agents (142, 144, 146, 148, 150) independently connected to the plurality of agents (132, 134, 136, 138, 140) and the plurality of application computers (152, 154,156, 158, 160); and an alert dispatcher (104) connected to the system startup module (100) and the gatekeeper (102).