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14 条记录 (耗时 0.023 秒)

    Board to board interconnect
    4.
    发明授权
    Board to board interconnect 失效
    板对板互连

    公开(公告)号：US6056557A

    公开(公告)日：2000-05-02

    申请号：US56972

    申请日：1998-04-08

    申请人： David R. Crotzer ,  Stephen D. DelPrete

    发明人： David R. Crotzer ,  Stephen D. DelPrete

    IPC分类号： H01R12/52 ,  H01R13/03 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

    CPC分类号： H05K3/368 ,  H01R12/523 ,  H05K2201/10378 ,  H05K3/325

    摘要： A board-to-board interconnect socket (40) provides electrical interconnection between printed circuit boards (50, 52). Resilient metalized particle interconnects (28) are disposed in holes in a rigid substrate (14) of desired thickness. Each resilient interconnect (28) includes first and second cap members (18, 20) that extend from opposing ends of the hole and beyond the respective surfaces of the substrate. The first and second cap members (18, 20) may be connected with a stem member (22) or conductive paste (34) that is disposed inside the hole. The hole may be lined with conductive material (26) such as conductive plating to facilitate conduction of electricity.

    摘要翻译： 板对板互连插座（40）提供印刷电路板（50,52）之间的电互连。 弹性金属化颗粒互连（28）设置在所需厚度的刚性衬底（14）中的孔中。 每个弹性互连（28）包括第一和第二盖构件（18,20），其从孔的相对端延伸并且超过衬底的相应表面。 第一和第二盖构件（18,20）可以与设置在孔内部的杆构件（22）或导电糊（34）连接。 该孔可以衬有诸如导电电镀的导电材料（26），以促进电的传导。

    Electrical contact having a particulate surface
    6.
    发明授权
    Electrical contact having a particulate surface 失效
    具有颗粒表面的电接触

    公开(公告)号：US5527591A

    公开(公告)日：1996-06-18

    申请号：US349042

    申请日：1994-12-02

    申请人： David R. Crotzer ,  Gregory E. Dean

    发明人： David R. Crotzer ,  Gregory E. Dean

    IPC分类号： H01H1/06 ,  H01H1/60 ,  H05K3/10 ,  H05K3/32 ,  H05K3/40 ,  B32B9/00

    CPC分类号： H01H1/06 ,  H05K3/102 ,  H05K3/4007 ,  H01H1/60 ,  H05K2201/0133 ,  H05K2201/023 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/095 ,  H05K2203/1168 ,  H05K2203/1344 ,  H05K3/326 ,  Y10S439/931 ,  Y10T428/24917

    摘要： The present invention comprises an electrical contact having solid homogenous conductive particles on the contact surface. The particles are of greater hardness than that of the contact material to deform the contact material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer. The particles are applied to the contact surface by a technique which results in the particles being intimately bonded to the contact surface, usually as a layer of particles. A preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact material.

    摘要翻译： 本发明包括在接触表面上具有固体均匀导电颗粒的电接触。 这些颗粒的硬度比接触材料的硬度大，使接触材料变形并导致氧化物或其它污染层的断裂或断裂，或者穿透污染层。 颗粒通过导致颗粒紧密结合到接触表面的技术施加到接触表面，通常作为一层颗粒。 用于这种颗粒应用的优选技术是超高速氧燃料喷射（HVOF）或等离子体喷涂，通过该喷涂，颗粒嵌入在接触表面上，以在施加的颗粒和接触材料之间提供基本上永久的颗粒间粘结。

    BGA interconnectors
    7.
    发明授权
    BGA interconnectors 失效
    BGA互连器

    公开(公告)号：US5766021A

    公开(公告)日：1998-06-16

    申请号：US725341

    申请日：1996-10-01

    申请人： Charles S. Pickles ,  David R. Crotzer

    发明人： Charles S. Pickles ,  David R. Crotzer

    IPC分类号： H01R12/51 ,  H05K7/10 ,  H01R9/09

    CPC分类号： H01R12/714 ,  H05K7/1084

    摘要： A reusable socket adapted for use in making an electrical connection between an integrated circuit of a ball grid array (BGA) type package and a circuit board or test fixture. In one embodiment, the socket includes a return member for reshaping the socket. In a further embodiment, a socket assembly includes a plurality of spaced sockets. In an alternative embodiment, a socket assembly further includes a base member. In another embodiment, a socket is formed from a temperature dependent smart memory material. In a further embodiment, a socket assembly includes a plurality of sockets formed from a shape memory material. In an alternative embodiment, a zero insertion force (ZIF) or a low insertion force (LIF) socket assembly for a BGA package includes a plurality of sockets and a lever adapted for frictionally engaging respective BGA contact balls.

    摘要翻译： 一种可重复使用的插座，适用于在球栅阵列（BGA）型封装的集成电路与电路板或测试夹具之间进行电连接。 在一个实施例中，插座包括用于重塑插座的返回构件。 在另一实施例中，插座组件包括多个间隔开的插座。 在替代实施例中，插座组件还包括基座构件。 在另一个实施例中，插座由温度依赖的智能存储器材料形成。 在另一实施例中，插座组件包括由形状记忆材料形成的多个插座。 在替代实施例中，用于BGA封装的零插入力（ZIF）或低插入力（LIF）插座组件包括多个插座和适于摩擦接合相应的BGA接触球的杆。

    Method for manufacturing hygristors
    8.
    发明授权
    Method for manufacturing hygristors 失效
    制造茄子的方法

    公开(公告)号：US5273777A

    公开(公告)日：1993-12-28

    申请号：US681987

    申请日：1991-04-08

    申请人： David R. Crotzer ,  Roberto Falcone

    发明人： David R. Crotzer ,  Roberto Falcone

    IPC分类号： G01N27/12 ,  B05D5/12

    CPC分类号： G01N27/121 ,  Y10T29/49099

    摘要： A method for manufacturing hygristors includes preparing a hygroscopic gel containing a substantially greater proportion of carbon than the prior art, and milling the gel for a period of at least 24 hours to produce a smooth mixture. Substrates are dipped into the milled gel at controlled rates to coat the substrates. The coated substrates are cured under controlled temperature and humidity. Adhesion of the coating is improved by the smoother mixture resulting from the longer milling time, and by the differences in components of the mixture compared to the prior art. Long term stability and dynamic range are both increased.

    摘要翻译： 制造茄子的方法包括制备含有比现有技术大得多的碳的吸湿凝胶，并将凝胶研磨至少24小时以产生光滑的混合物。 将底物以受控的速率浸入研磨的凝胶中以涂覆基材。 涂覆的基材在受控的温度和湿度下固化。 通过由较长的研磨时间得到的更平滑的混合物以及与现有技术相比的混合物的组分差异，改善了涂层的附着力。 长期稳定性和动态范围都增加。

    Conductive elastomer for grafting to thermoplastic and thermoset substrates
    9.
    发明授权
    Conductive elastomer for grafting to thermoplastic and thermoset substrates 失效
    用于接枝到热塑性和热固性基材的导电弹性体

    公开(公告)号：US06180221B2

    公开(公告)日：2001-01-30

    申请号：US08931130

    申请日：1997-09-16

    申请人： David R. Crotzer ,  Mark G. Hanrahan ,  Neill N. Silva

    发明人： David R. Crotzer ,  Mark G. Hanrahan ,  Neill N. Silva

    IPC分类号： B32B522

    CPC分类号： B32B27/08 ,  H01H1/029 ,  H01H13/702 ,  H01R13/2414 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/38 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0245 ,  H05K2203/1168 ,  Y10T428/249958 ,  Y10T428/249981 ,  Y10T428/249986 ,  Y10T428/24999 ,  Y10T428/249994

    摘要： An electrically conductive elastomer for grafting to thermoplastic and thermoset substrates is disclosed. If the substrate is a thermoset substrate, the electrically conductive elastomer comprises a mixture of an elastic material, a quantity of electrically conductive flakes, a thermoplastic elastomer material, and a thermoset material. If the substrate is a thermoplastic substrate, the electrically conductive elastomer comprises a mixture of an elastic material, a quantity of electrically conductive flakes, a thermoplastic elastomer material, and a thermoplastic material. The electrically conductive elastomer may further comprise a quantity of electrically conductive particles interspersed within the mixture. Alternatively, a quantity of electrically conductive particles may be imbedded in an outer surface of the electrically conductive elastomer. The electrically conductive elastomer is typically grafted to the substrate by a thermal process.

    摘要翻译： 公开了用于接枝到热塑性和热固性基底的导电弹性体。 如果衬底是热固性衬底，则导电弹性体包括弹性材料，一定量的导电薄片，热塑性弹性体材料和热固性材料的混合物。 如果基材是热塑性基材，则导电弹性体包括弹性材料，一定数量的导电薄片，热塑性弹性体材料和热塑性材料的混合物。 导电弹性体还可以包含散布在混合物内的一定数量的导电颗粒。 或者，一定数量的导电颗粒可以嵌入导电弹性体的外表面中。 导电弹性体通常通过热过程接枝到基底上。

    Dust sensor apparatus
    10.
    发明授权
    Dust sensor apparatus 失效
    除尘传感器

    公开(公告)号：US5910700A

    公开(公告)日：1999-06-08

    申请号：US45458

    申请日：1998-03-20

    申请人： David R. Crotzer

    发明人： David R. Crotzer

    IPC分类号： G01N27/00 ,  G01N29/036 ,  H01L41/08

    CPC分类号： G01N29/036 ,  G01N2291/02408 ,  G01N2291/0257

    摘要： A dust sensing apparatus uses a transducer element oscillating at a resonant frequency to detect changes in dust concentration. The transducer is fabricated from a polymer material which oscillates when a voltage is applied. The presence of dust affects the oscillation frequency. Dampening of the frequency by the dust presence changes the electrical resistance provided by the transducer. Electronic circuitry computes the level of dust by measuring and controlling the level of the AC signal required to maintain the oscillation frequency by monitoring the resistance.

    摘要翻译： 尘埃检测装置使用以共振频率振荡的换能器元件来检测灰尘浓度的变化。 传感器由施加电压时振荡的聚合物材料制成。 灰尘的存在影响振荡频率。 通过灰尘存在使频率的衰减改变了传感器提供的电阻。 电子电路通过测量和控制通过监测电阻来维持振荡频率所需的交流信号的电平来计算灰尘水平。