Organometallic compounds, processes for the preparation thereof and methods of use thereof
    1.
    发明申请
    Organometallic compounds, processes for the preparation thereof and methods of use thereof 有权
    有机金属化合物,其制备方法及其使用方法

    公开(公告)号:US20080081127A1

    公开(公告)日:2008-04-03

    申请号:US11900382

    申请日:2007-09-11

    IPC分类号: C07F11/00 C23C16/00

    CPC分类号: C07F17/00

    摘要: This invention relates to organometallic compounds represented by the formula (L1)yM(L2)z-y wherein M is a Group 5 metal or a Group 6 metal, L1 is a substituted or unsubstituted anionic 6 electron donor ligand, L2 is the same or different and is (i) a substituted or unsubstituted anionic 2 electron donor ligand, (ii) a substituted or unsubstituted cationic 2 electron donor ligand, or (iii) a substituted or unsubstituted neutral 2 electron donor ligand; y is an integer of 1, and z is the valence of M; and wherein the sum of the oxidation number of M and the electric charges of L1 and L2 is equal to 0.; a process for producing the organometallic compounds; and a method for depositing a metal and/or metal carbide/nitride layer, e.g., a tungsten, tungsten nitride, tungsten carbide, or tungsten carbonitride layer, on a substrate by the thermal or plasma enhanced dissociation of the organometallic precursor compounds, e.g., by CVD or ALD techniques. The metal and/or metal carbide layer is useful as a liner or barrier layer for conducting metals and high dielectric constant materials in integrated circuit manufacturing.

    摘要翻译: 本发明涉及由下式(L 1/2)M(L 2)z y表示的有机金属化合物,其中 M是第5族金属或第6族金属,L 1是取代或未取代的阴离子6电子给体配体,L 2相同或不同,为(i 取代或未取代的阴离子2电子供体配体,(ii)取代或未取代的阳离子2电子给体配体,或(iii)取代或未取代的中性2电子供体配体; y是1的整数,z是M的化合价; 并且其中M的氧化数和L 1和L 2的电荷之和等于0。 一种生产有机金属化合物的方法; 以及用于通过有机金属前体化合物的热或等离子体增强的解离在衬底上沉积金属和/或金属碳化物/氮化物层(例如钨,氮化钨,碳化钨或碳氮化钨)的方法,例如, 通过CVD或ALD技术。 金属和/或金属碳化物层可用作集成电路制造中用于导电金属和高介电常数材料的衬垫或阻挡层。

    Amine-free deposition of metal-nitride films
    2.
    发明申请
    Amine-free deposition of metal-nitride films 有权
    无氮化物沉积金属氮化物膜

    公开(公告)号:US20070075427A1

    公开(公告)日:2007-04-05

    申请号:US11240005

    申请日:2005-09-30

    IPC分类号: H01L29/40 H01L21/44

    摘要: A method for forming a metal carbide layer begins with providing a substrate, an organometallic precursor material, at least one doping agent such as nitrogen, and a plasma such as a hydrogen plasma. The substrate is placed within a reaction chamber; and heated. A process cycle is then performed, where the process cycle includes pulsing the organometallic precursor material into the reaction chamber, pulsing the doping agent into the reaction chamber, and pulsing the plasma into the reaction chamber, such that the organometallic precursor material, the doping agent, and the plasma react at the surface of the substrate to form a metal carbide layer. The process cycles can be repeated and varied to form a graded metal carbide layer.

    摘要翻译: 形成金属碳化物层的方法开始于提供衬底,有机金属前体材料,至少一种掺杂剂如氮气,以及诸如氢等离子体的等离子体。 将基板放置在反应室内; 并加热。 然后进行处理循环,其中工艺循环包括将有机金属前体材料脉冲到反应室中,将掺杂剂脉冲到反应室中,并将等离子体脉冲到反应室中,使得有机金属前体材料,掺杂剂 并且等离子体在基板表面反应形成金属碳化物层。 可以重复和改变工艺循环以形成渐变的金属碳化物层。

    Organometallic compounds, processes for the preparation thereof and methods of use thereof
    3.
    发明申请
    Organometallic compounds, processes for the preparation thereof and methods of use thereof 有权
    有机金属化合物,其制备方法及其使用方法

    公开(公告)号:US20070069177A1

    公开(公告)日:2007-03-29

    申请号:US11501075

    申请日:2006-08-09

    IPC分类号: H01M4/88 H01B1/12 H01B1/00

    CPC分类号: C07F17/00

    摘要: This invention relates to organometallic precursor compounds represented by the formula (Cp(R′)x)yM(H)z-y, a process for producing the organometallic precursor compounds, and a method for depositing a metal and/or metal carbide layer, e.g., Ta metal and/or TaC layer, on a substrate by the thermal or plasma enhanced disassociation of the organometallic precursor compounds, e.g., by CVD or ALD techniques. The metal and/or metal carbide layer is useful as a liner or barrier layer for conducting metals and high dielectric constant materials in integrated circuit manufacturing.

    摘要翻译: 本发明涉及由式(Cp(R')x M(H)zy)表示的有机金属前体化合物, 生产有机金属前体化合物的方法,以及通过有机金属前体化合物的热或等离子体增强分离来沉积金属和/或金属碳化物层例如Ta金属和/或TaC层的方法,例如通过CVD 或ALD技术。 金属和/或金属碳化物层可用作集成电路制造中用于导电金属和高介电常数材料的衬垫或阻挡层。

    Instrumented foam pig
    4.
    发明授权
    Instrumented foam pig 有权
    仪器型泡沫猪

    公开(公告)号:US08925400B2

    公开(公告)日:2015-01-06

    申请号:US13512685

    申请日:2010-11-30

    IPC分类号: F16L55/26 F16L55/28 F16L55/40

    CPC分类号: F16L55/28 F16L55/40

    摘要: An instrumented pig comprises a foam body having an outer surface and an inner cavity in which, in use, is located a sealed unit housing at least a part of a parameter measurement apparatus configured to measure at least one parameter from which the extent of deflection of the outer surface of the foam body may be derived, the sealed unit including at least one sensor configured to generate an output signal representative of the at least one measured parameter.

    摘要翻译: 仪表式猪包括具有外表面和内腔的泡沫体,在使用中,所述发泡体位于密封单元中,所述密封单元容纳参数测量装置的至少一部分,所述参数测量装置被配置成测量至少一个参数, 可以导出泡沫体的外表面,密封单元包括至少一个被配置为产生表示至少一个测量参数的输出信号的传感器。

    Method For Producing Nickel-Containing Films
    7.
    发明申请
    Method For Producing Nickel-Containing Films 有权
    生产含镍薄膜的方法

    公开(公告)号:US20140023785A1

    公开(公告)日:2014-01-23

    申请号:US13555832

    申请日:2012-07-23

    IPC分类号: C23C16/18

    CPC分类号: C23C16/18 C07F17/00

    摘要: Provided are precursors and methods of using same to deposit film consisting essentially of nickel. Certain methods comprise providing a substrate surface; exposing the substrate surface to a vapor comprising a precursor having a structure represented by formula (I): wherein R1 is t-butyl and each R2 is each independently any C1-C3 alkyl group; and exposing the substrate to a reducing gas to provide a film consisting essentially of nickel on the substrate surface.

    摘要翻译: 提供的是使用其沉积基本上由镍组成的膜的前体和方法。 某些方法包括提供基底表面; 将基材表面暴露于包含具有由式(I)表示的结构的前体的蒸气:其中R 1是叔丁基,每个R 2各自独立地是任何C 1 -C 3烷基; 并将衬底暴露于还原气体,以在衬底表面上提供基本上由镍组成的膜。

    Deposition Of N-Metal Films Comprising Aluminum Alloys
    8.
    发明申请
    Deposition Of N-Metal Films Comprising Aluminum Alloys 有权
    包含铝合金的N-金属膜的沉积

    公开(公告)号:US20140017408A1

    公开(公告)日:2014-01-16

    申请号:US13930194

    申请日:2013-06-28

    IPC分类号: C23C18/00

    摘要: Provided are methods of depositing films comprising alloys of aluminum, which may be suitable as N-metal films. Certain methods comprise exposing a substrate surface to a metal halide precursor comprising a metal halide selected from TiCl4, TaCl5 and HfCl4 to provide a metal halide at the substrate surface; purging metal halide; exposing the substrate surface to an alkyl aluminum precursor comprising one or more of dimethyaluminum hydride, diethylhydridoaluminum, methyldihydroaluminum, and an alkyl aluminum hydrides of the formula [(CxHy)3-aAlHa]n, wherein x has a value of 1 to 3, y has a value of 2x+2, a has a value of 1 to 2, and n has a value of 1 to 4; and exposing the substrate surface to an alane-containing precursor comprising one or more of dimethylethylamine alane, methylpyrrolidinealane, di(methylpyrolidine)alane, and trimethyl amine alane borane. Other methods comprise exposing a substrate surface to a metal precursor and trimethyl amine alane borane.

    摘要翻译: 提供了沉积包括铝合金的膜的方法,其可以适合作为N-金属膜。 某些方法包括将衬底表面暴露于包含选自TiCl 4,TaCl 5和HfCl 4的金属卤化物的金属卤化物前体,以在衬底表面提供金属卤化物; 清洗金属卤化物; 将基材表面暴露于包含一种或多种二氢化铝氢化物,二乙基氢化铝,甲基二氢铝和式[(C x H y)3-a AlHa] n的烷基铝氢化物的烷基铝前体,其中x具有1至3的值,y 具有2x + 2的值,a具有1至2的值,并且n具有1至4的值; 并将基材表面暴露于含有二甲基乙基胺丙烷,甲基吡咯烷烃,二(甲基吡咯烷)甲烷和三甲基胺丙烷硼烷中的一种或多种的含Alane的前体。 其他方法包括将基底表面暴露于金属前体和三甲基胺丙烷硼烷。

    Deposition Of Films Containing Alkaline Earth Metals
    9.
    发明申请
    Deposition Of Films Containing Alkaline Earth Metals 审中-公开
    沉积含碱性地球金属的薄膜

    公开(公告)号:US20140004274A1

    公开(公告)日:2014-01-02

    申请号:US13923599

    申请日:2013-06-21

    申请人: David Thompson

    发明人: David Thompson

    IPC分类号: C23C16/40

    CPC分类号: C23C16/404

    摘要: Described are methods of depositing a metal film by chemical reaction on a substrate. The method comprises: exposing the substrate to flows of a first reactant gas comprising a group 2 metal and a second reactant gas comprising a halide to form a first layer containing a metal halide on the substrate; exposing the substrate to a third reactant gas comprising an oxidant to form a second layer containing a metal peroxide or metal hydroxide on the substrate during; exposing the substrate to heat or a plasma to convert the metal peroxide or metal hydroxide to metal oxide. The method may be repeated to form the metal oxide film absent any metal carbonate impurity.

    摘要翻译: 描述了通过化学反应将金属膜沉积在基底上的方法。 该方法包括:将衬底暴露于包含第2族金属的第一反应气体和包含卤化物的第二反应气体的流动,以在衬底上形成含有金属卤化物的第一层; 将衬底暴露于包含氧化剂的第三反应气体,以在衬底期间在衬底上形成含有金属过氧化物或金属氢氧化物的第二层; 将基底暴露于加热或等离子体以将金属过氧化物或金属氢氧化物转化为金属氧化物。 可以重复该方法以形成没有金属碳酸盐杂质的金属氧化物膜。