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    Method of fabricating an RF substrate with selected electrical properties
    2.
    发明授权
    Method of fabricating an RF substrate with selected electrical properties 失效
    制造具有选定电性能的RF衬底的方法

    公开(公告)号：US07353592B2

    公开(公告)日：2008-04-08

    申请号：US11622012

    申请日：2007-01-11

    申请人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

    发明人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

    IPC分类号： H05K3/36

    CPC分类号： H05K1/024 ,  H01P11/00 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2203/0228 ,  H05K2203/0235 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155

    摘要： Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

    摘要翻译： 用于制造用于RF电路的纹理介质衬底（400）的方法。 该方法可以包括选择多个介电衬底材料的步骤（104），每个电介质衬底材料具有不同于电介质衬底材料的每个其它电介质材料的电性能的组合的不同组合或电特性。 选择纹理衬底图案（106），其由分别具有不同组电特性的至少两种类型的不同区域组成，其中每个不同区域的尺寸远小于感兴趣频率处的波长。 将电介质基板材料（202,204）切割成与所选图案的不同区域一致的尺寸和形状，以便形成多个电介质片（206,208）。 根据所选择的图案将电介质片布置在基板（302）上以形成织构化电介质基片。

    Method of fabricating an RF substrate with selected electrical properties
    3.
    发明申请
    Method of fabricating an RF substrate with selected electrical properties 失效
    制造具有选定电性能的RF衬底的方法

    公开(公告)号：US20050087284A1

    公开(公告)日：2005-04-28

    申请号：US10694468

    申请日：2003-10-27

    申请人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

    发明人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

    IPC分类号： C03B29/00 ,  H01P11/00 ,  H01Q17/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

    CPC分类号： H05K1/024 ,  H01P11/00 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2203/0228 ,  H05K2203/0235 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155

    摘要： Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate pattern (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

    摘要翻译： 用于制造用于RF电路的纹理介质衬底（400）的方法。 该方法可以包括选择多个介电衬底材料的步骤（104），每个电介质衬底材料具有不同于电介质衬底材料的每个其它电介质材料的电性能的组合的不同组合或电特性。 选择纹理化衬底图案（106），其由分别具有不同组的电性质的至少两种类型的不同区域组成，每个不同的区域的尺寸远小于感兴趣的频率处的波长。 将电介质基板材料（202,204）切割成与所选图案的不同区域一致的尺寸和形状，以便形成多个电介质片（206,208）。 根据所选择的图案将电介质片布置在基板（302）上以形成织构化电介质基片。

    Method of Fabricating an RF Substrate with Selected Electrical Properties
    4.
    发明申请
    Method of Fabricating an RF Substrate with Selected Electrical Properties 失效
    制造具有所选电性能的RF基板的方法

    公开(公告)号：US20070117403A1

    公开(公告)日：2007-05-24

    申请号：US11622012

    申请日：2007-01-11

    申请人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

    发明人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

    IPC分类号： H01L21/76 ,  H01L21/31

    CPC分类号： H05K1/024 ,  H01P11/00 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2203/0228 ,  H05K2203/0235 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155

    摘要： Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

    摘要翻译： 用于制造用于RF电路的纹理介质衬底（400）的方法。 该方法可以包括选择多个介电衬底材料的步骤（104），每个电介质衬底材料具有不同于电介质衬底材料的每个其它电介质材料的电性能的组合的不同组合或电特性。 选择纹理衬底图案（106），其由分别具有不同组电特性的至少两种类型的不同区域组成，其中每个不同区域的尺寸远小于感兴趣频率处的波长。 将电介质基板材料（202,204）切割成与所选图案的不同区域一致的尺寸和形状，以便形成多个电介质片（206,208）。 根据所选择的图案将电介质片布置在基板（302）上以形成织构化电介质基片。

    Method of fabricating an RF substrate with selected electrical properties
    5.
    发明授权
    Method of fabricating an RF substrate with selected electrical properties 失效
    制造具有选定电性能的RF衬底的方法

    公开(公告)号：US07181834B2

    公开(公告)日：2007-02-27

    申请号：US10694468

    申请日：2003-10-27

    申请人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

    发明人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

    IPC分类号： H05K3/36

    CPC分类号： H05K1/024 ,  H01P11/00 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2203/0228 ,  H05K2203/0235 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155

    摘要： Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate pattern (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

    摘要翻译： 用于制造用于RF电路的纹理介质衬底（400）的方法。 该方法可以包括选择多个介电衬底材料的步骤（104），每个电介质衬底材料具有不同于电介质衬底材料的每个其它电介质材料的电性能的组合的不同组合或电特性。 选择纹理化衬底图案（106），其由分别具有不同组的电性质的至少两种类型的不同区域组成，每个不同的区域的尺寸远小于感兴趣的频率处的波长。 将电介质基板材料（202,204）切割成与所选图案的不同区域一致的尺寸和形状，以便形成多个电介质片（206,208）。 根据所选择的图案将电介质片布置在基板（302）上以形成织构化电介质基片。

    Dielectric substrate with selectively controlled effective permittivity and loss tangent
    7.
    发明授权
    Dielectric substrate with selectively controlled effective permittivity and loss tangent 失效
    电介质衬底具有选择性控制的有效介电常数和损耗角正切

    公开(公告)号：US06992636B2

    公开(公告)日：2006-01-31

    申请号：US11118445

    申请日：2005-04-29

    申请人： Dennis Tebbe ,  Thomas Smyth ,  William Johnson Chappell

    发明人： Dennis Tebbe ,  Thomas Smyth ,  William Johnson Chappell

    IPC分类号： H01Q1/38

    CPC分类号： H05K1/024 ,  H01Q1/38 ,  H01Q15/006 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/063 ,  Y10T29/49016

    摘要： A substrate (300) for an RF device includes a plurality of layers (102) of dielectric material cofired in a stack. The plurality of layers (102) is formed from a material having a permittivity. Selected ones of the layers (102) have a pattern of perforations (106) formed in at least one perforated area (104). The perforated areas (104) are generally aligned with one another in the stack to lower one or more of an effective value of a permittivity and a loss tangent in a least one spatially defined region (504) of the substrate (300).

    摘要翻译： 用于RF器件的衬底（300）包括堆叠在一起的多个介电材料层（102）。 多个层（102）由具有介电常数的材料形成。 所选择的一层（102）具有形成在至少一个穿孔区域（104）中的穿孔图案（106）。 穿孔区域（104）通常在堆叠中彼此对准以降低衬底（300）的至少一个空间限定区域（504）中的介电常数和损耗角正切的有效值中的一个或多个。

    Method of fabricating an RF substrate with selected electrical properties
    8.
    发明授权
    Method of fabricating an RF substrate with selected electrical properties 失效
    制造具有选定电性能的RF衬底的方法

    公开(公告)号：US06770159B1

    公开(公告)日：2004-08-03

    申请号：US10397114

    申请日：2003-03-26

    申请人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero ,  Holly Todd

    发明人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero ,  Holly Todd

    IPC分类号： B32B3110

    CPC分类号： B32B18/00 ,  C04B2237/32 ,  C04B2237/68 ,  H05K1/024 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2203/0228 ,  H05K2203/0235 ,  Y10T156/1074 ,  Y10T156/1077 ,  Y10T156/1089 ,  Y10T156/1092

    摘要： The method includes selecting two or more types of ceramic materials (202, 204), each having a distinct set of electrical properties different from the other of the types of ceramic materials. A substrate pattern can also be selected. The substrate pattern can comprise at least two types of distinct substrate areas having the distinct sets of electrical properties of the ceramic materials. Each distinct area can be selected so as to have dimensions much smaller than a wavelength at a frequency of interest. The ceramic materials (202, 204) can thereafter be fired and then cut into a size and shape consistent with the distinct areas to form dielectric pieces (206, 208). The process continues by selectively arranging the dielectric pieces on a base plate (302) in accordance with the pattern to form the textured ceramic dielectric substrate. The completed textured substrate (400) will have at least one effective electrical property at a frequency of interest that is different from each of said distinct sets of electrical properties of the ceramic materials.

    摘要翻译： 该方法包括选择两种或更多种类型的陶瓷材料（202,204），每种陶瓷材料具有不同于另一类陶瓷材料的不同的一组电性能。 还可以选择衬底图案。 衬底图案可以包括具有陶瓷材料的不同组电特性的至少两种不同的衬底区域。 可以选择每个不同的区域以使其尺寸远小于感兴趣的频率处的波长。 然后可以将陶瓷材料（202,204）烧制，然后切割成与不同区域一致的尺寸和形状，以形成电介质片（206,208）。 该过程通过根据图案将介电片选择性地布置在基板（302）上以形成织构化的陶瓷电介质基板而继续。 完成的纹理基底（400）将具有与感兴趣的频率不同的至少一个有效电特性，其不同于陶瓷材料的所述不同组的电特性。