公开(公告)号：US20220288650A1

公开(公告)日：2022-09-15

申请号：US17636299

申请日：2020-07-13

Applicant: EBARA CORPORATION

Inventor： Kenji Kodera ,  Keisuke Uchiyama ,  Satoru Yamamoto ,  Hokuto Yamanobe

IPC: B08B3/02 ,  B05B1/04 ,  B05B7/04

Abstract: The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (6); rotating the substrate (W) about its central axis by rotating the holding rollers (6) about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle (2) to a surface of the substrate (W) while moving the two-fluid jet nozzle (2) in a radial direction of the substrate (W), the two-fluid jet (2) being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle (3) to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.

公开(公告)号：US09738483B2

公开(公告)日：2017-08-22

申请号：US14720068

申请日：2015-05-22

Applicant: Ebara Corporation ,  IS ENGINEERING CO., LTD.

Inventor： Kenya Ito ,  Keisuke Uchiyama ,  Tomiichi Matsui ,  Mahito Shibuya

IPC: C09J5/00 ,  B65H37/06 ,  B65H35/00

CPC classification number: B65H37/06 ,  B65H35/0013 ,  B65H2701/11112 ,  C09J5/00

Abstract: A tape sticking apparatus for sticking a masking tape for protecting a peripheral portion of a substrate, such as a wafer, is disclosed. The tape sticking apparatus includes: a substrate holder configured to hold and rotate a substrate; and a tape sticking unit configured to stick a masking tape onto a peripheral portion of the substrate held on the substrate holder.

公开(公告)号：US11436392B2

公开(公告)日：2022-09-06

申请号：US15982814

申请日：2018-05-17

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Keisuke Uchiyama ,  Kunio Oishi ,  Hiroyuki Takenaka

IPC: G06F17/18 ,  G06F30/20 ,  H01L21/67 ,  G06N3/08 ,  G06N5/00 ,  G06F111/10

Abstract: A substrate processing apparatus for processing a substrate includes a setting device that sets a plurality of recipe items including operation conditions of the substrate processing apparatus and a recipe generating device that acquires a plurality of recipe models obtained by changing values of the plurality of recipe items and experimenting or simulating a processing result of the substrate and analyzes the plurality of recipe models to generate a recipe, the recipe generating device combining a part or all of the plurality of recipe models to generate the recipe such that a calculation value of a processing result of the substrate by the recipe satisfies a predetermined condition.

公开(公告)号：US10926376B2

公开(公告)日：2021-02-23

申请号：US16003779

申请日：2018-06-08

Applicant: Ebara Corporation

Inventor： Masayuki Nakanishi ,  Yu Ishii ,  Kenya Ito ,  Keisuke Uchiyama ,  Makoto Kashiwagi

IPC: B24B55/12 ,  B24B21/00 ,  B24B41/06 ,  B24B47/12 ,  B24D11/02 ,  B24B21/08 ,  B24B7/22

Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

公开(公告)号：US10854473B2

公开(公告)日：2020-12-01

申请号：US15909758

申请日：2018-03-01

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Kenya Ito ,  Keisuke Uchiyama ,  Masayuki Nakanishi

IPC: H01L21/461 ,  H01L21/68 ,  B24B37/10 ,  B24B37/005 ,  G06F9/06 ,  H01L21/02

Abstract: A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.

公开(公告)号：US12030092B2

公开(公告)日：2024-07-09

申请号：US17636299

申请日：2020-07-13

Applicant: EBARA CORPORATION

Inventor： Kenji Kodera ,  Keisuke Uchiyama ,  Satoru Yamamoto ,  Hokuto Yamanobe

IPC: B08B3/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: B08B3/024 ,  B08B3/022 ,  H01L21/67051 ,  H01L21/68728

Abstract: The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (6); rotating the substrate (W) about its central axis by rotating the holding rollers (6) about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle (2) to a surface of the substrate (W) while moving the two-fluid jet nozzle (2) in a radial direction of the substrate (W), the two-fluid jet (2) being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle (3) to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.

公开(公告)号：US11139160B2

公开(公告)日：2021-10-05

申请号：US16184694

申请日：2018-11-08

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Keisuke Uchiyama

IPC: B24B1/00 ,  B24B41/06 ,  H01L21/02 ,  B24B21/06 ,  H01L21/67 ,  B24B37/10 ,  B24B21/00 ,  B24B9/06 ,  H01L21/683 ,  H01L21/687

Abstract: An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.

公开(公告)号：US09808836B2

公开(公告)日：2017-11-07

申请号：US14316709

申请日：2014-06-26

Applicant: EBARA CORPORATION

Inventor： Tetsuji Togawa ,  Kenya Ito ,  Yu Ishii ,  Keisuke Uchiyama

IPC: B08B1/04 ,  H01L21/304 ,  H01L21/687 ,  B24B37/10 ,  B24B37/30 ,  B08B1/00 ,  H01L21/67

CPC classification number: B08B1/04 ,  B08B1/001 ,  B08B1/006 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

公开(公告)号：US10651057B2

公开(公告)日：2020-05-12

申请号：US15583327

申请日：2017-05-01

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Yu Ishii ,  Keisuke Uchiyama

IPC: H01L21/02 ,  H01L21/67 ,  B08B1/00 ,  H01L21/304 ,  B08B3/04 ,  B08B1/04

Abstract: An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward; a scrub cleaning tool configured to be rotatable; a two-fluid nozzle disposed above the substrate holder; and a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.

公开(公告)号：US10376929B2

公开(公告)日：2019-08-13

申请号：US15647829

申请日：2017-07-12

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Masayuki Nakanishi ,  Keisuke Uchiyama

IPC: B24B37/013 ,  B24B37/10 ,  B24B37/30 ,  B08B1/04 ,  B24B37/04 ,  H01L21/687 ,  H01L21/304 ,  H01L21/67 ,  B24B27/033 ,  B24B41/06 ,  B24B49/08 ,  B24D7/06 ,  B24B7/22

Abstract: An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.