公开(公告)号：US20170072528A1

公开(公告)日：2017-03-16

申请号：US15341534

申请日：2016-11-02

申请人： EBARA CORPORATION

发明人： Tamami TAKAHASHI ,  Masaya SEKI ,  Hiroaki KUSA ,  Kenji YAMAGUCHI ,  Masayuki NAKANISHI

IPC分类号： B24B21/00 ,  B24B49/00 ,  B24B27/00 ,  B24B41/06 ,  B24B9/06 ,  B24B21/20

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20 ,  B24B27/0076 ,  B24B37/042 ,  B24B37/30 ,  B24B41/068 ,  B24B49/00 ,  Y10T428/24777

摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

摘要翻译： 抛光装置抛光基板的周边。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

公开(公告)号：US20150298280A1

公开(公告)日：2015-10-22

申请号：US14745863

申请日：2015-06-22

申请人： EBARA CORPORATION

发明人： Masaya SEKI ,  Tetsuji TOGAWA ,  Masayuki NAKANISHI

IPC分类号： B24B21/00 ,  B24B21/20 ,  H01L21/68 ,  H01L21/306 ,  H01L21/67 ,  H01L21/84 ,  B24B9/06 ,  H01L21/66

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/20 ,  H01L21/30625 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/68 ,  H01L21/84 ,  H01L22/20

摘要： The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

摘要翻译： 抛光装置具有能够通过抛光基板的周边部分而形成直角横截面的抛光单元。 抛光单元包括：抛光头，其具有被配置成从上方将研磨带压靠在基板的周边部分上的按压构件，配置成将抛光带供给到抛光头并将抛光带从 抛光头，构造成沿着基板的径向方向移动抛光头的第一移动机构和被配置为沿着基板的径向移动带供给和恢复机构的第二移动机构。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。

公开(公告)号：US20230326757A1

公开(公告)日：2023-10-12

申请号：US18041256

申请日：2021-06-25

申请人： EBARA CORPORATION

发明人： Masayuki SATAKE ,  Masayuki NAKANISHI ,  Michiyoshi YAMASHITA

IPC分类号： H01L21/687 ,  H01L21/56 ,  H01L21/18 ,  H01L21/67

CPC分类号： H01L21/187 ,  H01L21/56 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6715 ,  H01L21/68792 ,  H01L21/304

摘要： The present application relates to a substrate processing method for suppressing cracking and chipping of a laminated substrate manufactured by bonding a plurality of substrates. Further, the present application relates to a substrate processing apparatus capable of performing such a substrate processing method. The present method includes: rotating a laminated substrate manufactured by bonding a first substrate and a second substrate; applying a filler, having thermosetting property, to a gap between a peripheral portion of the first substrate and a peripheral portion of the second substrate; and curing the filler. Applying the filler and curing the filler are continuously performed in a same processing chamber.

公开(公告)号：US20190118335A1

公开(公告)日：2019-04-25

申请号：US16163070

申请日：2018-10-17

申请人： EBARA CORPORATION

发明人： Kenichi KOBAYASHI ,  Masayuki NAKANISHI ,  Makoto KASHIWAGI ,  Manao HOSHINA

IPC分类号： B24B37/04 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B24B37/005

摘要： A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

公开(公告)号：US20190054594A1

公开(公告)日：2019-02-21

申请号：US16003779

申请日：2018-06-08

申请人： Ebara Corporation

发明人： Masayuki NAKANISHI ,  Yu ISHII ,  Kenya ITO ,  Keisuke UCHIYAMA ,  Makoto KASHIWAGI

IPC分类号： B24B55/12

摘要： A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

公开(公告)号：US20180015508A1

公开(公告)日：2018-01-18

申请号：US15647829

申请日：2017-07-12

申请人： EBARA CORPORATION

发明人： Yu ISHII ,  Masayuki NAKANISHI ,  Keisuke UCHIYAMA

IPC分类号： B08B1/04 ,  H01L21/304 ,  H01L21/67 ,  H01L21/687

CPC分类号： B08B1/04 ,  B24B7/228 ,  B24B27/033 ,  B24B37/013 ,  B24B37/042 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  B24B41/067 ,  B24B49/08 ,  B24D7/06 ,  H01L21/304 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/6875

摘要： An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.

公开(公告)号：US20140220866A1

公开(公告)日：2014-08-07

申请号：US14167934

申请日：2014-01-29

申请人： EBARA CORPORATION

发明人： Yu ISHII ,  Kenya ITO ,  Masayuki NAKANISHI ,  Tetsuji TOGAWA

IPC分类号： B24B7/22

CPC分类号： B24B7/228 ,  B24B21/004 ,  B24B21/06 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30

摘要： A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

摘要翻译： 提供了能够以高去除速度从基板的整个背面除去异物的研磨方法。 抛光方法包括将抛光工具放置在与基板的背面的外周区域滑动接触的同时保持基板的背面的中心侧区域，并且将抛光工具与中心部分滑动接触， 同时保持基板的斜面部分以整体抛光背面。

公开(公告)号：US20240351062A1

公开(公告)日：2024-10-24

申请号：US18685640

申请日：2022-07-14

申请人： EBARA CORPORATION

发明人： Masayuki SATAKE ,  Masayuki NAKANISHI

IPC分类号： B05C11/10 ,  B05C9/14 ,  B05D1/00 ,  B05D3/02

CPC分类号： B05C11/1005 ,  B05C9/14 ,  B05D1/002 ,  B05D3/0254

摘要： The present application relates to a substrate processing apparatus and a substrate processing method for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; curing the applied filler; generating, by an infrared imaging device, an image of an edge portion of the laminated substrate to which the filler is applied; and determining a filling state of the filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate based on the image.

公开(公告)号：US20180169820A1

公开(公告)日：2018-06-21

申请号：US15839191

申请日：2017-12-12

申请人： EBARA CORPORATION

发明人： Masayuki NAKANISHI ,  Kenji KODERA ,  Yasuyuki MIYASAWA

IPC分类号： B24B9/06 ,  B24B21/00 ,  H01L21/02 ,  B24B37/07

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B21/08 ,  B24B31/12 ,  B24B37/07 ,  H01L21/02021

摘要： A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate W and to rotate the substrate W and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate W held by the substrate holder 3. The pressing pad 50 includes an elastic member 55 having a pressing surface 55a configured to press the polishing tool 23 against the peripheral portion of the substrate W and a support member 56 configured to support the elastic member 55. The support member 56 has a recess 57 formed in a front surface 56a of the support member 56, the elastic member 55 being capable of entering the recess 57.

公开(公告)号：US20160318155A1

公开(公告)日：2016-11-03

申请号：US15163064

申请日：2016-05-24

申请人： EBARA CORPORATION

发明人： Yu ISHII ,  Hiroyuki KAWASAKI ,  Masayuki NAKANISHI ,  Kenya ITO

IPC分类号： B24D11/00 ,  B05D5/02

CPC分类号： B24D11/003 ,  B05D5/02 ,  B24D11/00 ,  B24D11/001

摘要： A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

摘要翻译： 制造磨料制品的方法包括制备基膜，用不含磨粒但含有粘合剂树脂的第一涂料涂覆基膜，并干燥涂料以形成第一层。 该方法还包括用含有磨料颗粒和粘合剂树脂的第二种涂料涂覆第一层，并干燥涂料以形成第二层。 该方法还包括加热第一层和第二层以进行酰亚胺化。