公开(公告)号：US5786633A

公开(公告)日：1998-07-28

申请号：US8734

申请日：1993-01-25

申请人： Eckhard Wolfgang ,  Reinhold Kuhnert

发明人： Eckhard Wolfgang ,  Reinhold Kuhnert

IPC分类号： H01L23/373 ,  H01L23/492 ,  H01L23/36

CPC分类号： H01L24/32 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4928 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/19043

摘要： A semiconductor module having a high dissipated power has an electrically insulating and thermally conducting layer of crystalline carbon provided between a semiconductor chip and a heat elimination element, whereby the semiconductor chip, the insulating layer and the heat elimination element are connected via an intermediate layer and via connecting layers of silver by pressure sintering. For low-voltage applications, a layer of amorphous carbon can alternatively be employed instead of the layer of crystalline carbon. Extremely low heat transmission resistance between the semiconductor chip and the heat elimination element is provided.

摘要翻译： 具有高耗散功率的半导体模块具有设置在半导体芯片和散热元件之间的电绝缘且导热的结晶碳层，由此半导体芯片，绝缘层和散热元件经由中间层和 通过压力烧结连接银层。 对于低电压应用，可替代地使用一层非晶碳代替结晶碳层。 提供半导体芯片和散热元件之间极低的传热阻力。

公开(公告)号：US4220853A

公开(公告)日：1980-09-02

申请号：US22480

申请日：1979-03-21

申请人： Hans-Peter Feuerbaum ,  Eckhard Wolfgang

发明人： Hans-Peter Feuerbaum ,  Eckhard Wolfgang

IPC分类号： G01R31/26 ,  G01R13/00 ,  G01R19/00 ,  G01R29/14 ,  G01R31/302 ,  G01R31/305 ,  H01J37/28 ,  H01L21/66 ,  G01N23/00

CPC分类号： G01R13/00 ,  G01R31/305

摘要： A method for the contactless measurement of the potential waveform in an electronic component with a scanning electron microscope in which the electron beam is aimed at a measuring point of the integrated circuit until at least one phase range of the measuring voltage is determined by phase-shifting the pulses of the primary electron beam with respect to the measuring voltage and subsequently, the electron beam jumped to at least one further measuring point where a phase range is determined in the same manner permitting measurement of the potential waveform at different points of the integrated circuit and displayed together on a picture screen.

摘要翻译： 一种用扫描电子显微镜对电子部件中的电位波形进行非接触式测量的方法，其中电子束瞄准集成电路的测量点，直到测量电压的至少一个相位范围由相移 相对于测量电压的一次电子束的脉冲，随后，电子束跳到至少一个另外的测量点，其中以允许测量集成电路的不同点处的电位波形的相同方式确定相位范围 并一起显示在图片屏幕上。

公开(公告)号：US20060267135A1

公开(公告)日：2006-11-30

申请号：US10566439

申请日：2004-07-12

申请人： Eckhard Wolfgang ,  Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Nobert Seliger ,  Jorg Zapf

发明人： Eckhard Wolfgang ,  Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Nobert Seliger ,  Jorg Zapf

IPC分类号： H01L29/00

CPC分类号： H05K1/16 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/32 ,  H05K2203/1469 ,  H01L2924/00

摘要： A circuit arrangement placed on a substrate has at least one semiconductor component arranged on the substrate and having at least one electrical contact surface and at least one connection line also arranged on the substrate and used to electrically contact the contact surface of the semiconductor component. The connection line forms part of a discrete, passive electrical component arranged on the substrate. The electrical contacting of the contact surface of the semiconductor component is carried out during a step of the process and the part of the secrete, passive electrical component is produced. To this end, especially a film consisting of an electrically insulating material is applied to the power semiconductor and to the substrate under a vacuum, and the contact surface of the power semiconductor is then bared. Furthermore, the connection component is carried out and the part of the discrete, passive electrical component is produced.

摘要翻译： 放置在基板上的电路布置具有布置在基板上的至少一个半导体部件，并且具有至少一个电接触表面和至少一个连接线，该连接线还布置在基板上并用于与半导体部件的接触表面电接触。 连接线构成布置在基板上的离散无源电气部件的一部分。 半导体部件的接触表面的电接触在该过程的步骤期间进行，并且分离的无源电部件的一部分被产生。 为此，特别是由电绝缘材料构成的膜在真空下施加到功率半导体和基板上，然后功率半导体的接触表面露出。 此外，执行连接部件，并且产生分立的无源电部件的一部分。

公开(公告)号：US20100270288A1

公开(公告)日：2010-10-28

申请号：US10567075

申请日：2004-07-15

申请人： Andreas Hackbarth ,  Uwe Has ,  Thomas Komma ,  Dan Neumayer ,  Harald Pfersch ,  Gerhard Schmidmayer ,  Wolfgang Schnell ,  Bernd Stitzl ,  Eckhard Wolfgang ,  Monika Zeraschi ,  Felicitas Ziegler ,  Günter Zschau

发明人： Andreas Hackbarth ,  Uwe Has ,  Thomas Komma ,  Dan Neumayer ,  Harald Pfersch ,  Gerhard Schmidmayer ,  Wolfgang Schnell ,  Bernd Stitzl ,  Eckhard Wolfgang ,  Monika Zeraschi ,  Felicitas Ziegler ,  Günter Zschau

IPC分类号： H05B6/12

CPC分类号： H05B6/1236 ,  H01F38/14

摘要： A device for heating food using induction, including a base element having a secondary winding configured from a current conductor and a heating element that is connected to the winding. To reduce the height of the base element, a winding core is located inside the winding. Further, a device for transmitting energy to a device for heating food by induction, the former device including a primary winding that is configured from a current conductor and is connected to a voltage source.

摘要翻译： 一种用于使用感应加热食物的装置，包括具有由电流导体构成的次级绕组的基座元件和连接到绕组的加热元件。 为了减小基座元件的高度，绕组芯位于绕组内部。 此外，一种用于将能量传递到用于通过感应加热食物的装置的装置，前一装置包括由电流导体配置并连接到电压源的初级绕组。

公开(公告)号：US20050206487A1

公开(公告)日：2005-09-22

申请号：US10521742

申请日：2003-07-21

申请人： Martin Honsberg-Riedl ,  Johann Otto ,  Eckhard Wolfgang

发明人： Martin Honsberg-Riedl ,  Johann Otto ,  Eckhard Wolfgang

IPC分类号： H01F27/28 ,  H01F3/14 ,  H01F17/04 ,  H01F27/02 ,  H01F27/22 ,  H01F27/24 ,  H01F27/32 ,  H01F30/00 ,  H01F37/00 ,  H01F17/06

CPC分类号： H01F3/14 ,  H01F17/043 ,  H01F27/022 ,  H01F27/22 ,  H01F27/327

摘要： The invention relates to an inductive component (1), for the formation of a magnetic circuit, comprising at least one wire winding (3) and at least one core (4) with a ferromagnetic core material. Said core comprises a gap (7, 8) and at least one further gap (8, 7) to interrupt the magnetic circuit. The inductive component is characterised in that the gaps each have a gap width of at least 1.0 mm. The core comprises two pieces, for example, which are arranged opposed to each other across the gaps (7, 8) and separated from each other by the gap width. The component is advantageously symmetrical with an essentially equal gap width for the gaps. A miniaturised inductive component is possible by the use of a hire winding made from high frequency braided wire and core material capable of accepting high frequencies, which has a high Q-factor even on a high power throughput and thus low electrical losses. In order to increase the Q-factor, the inductive component also has a cooling device for cooling the wire winding. The device is thus provided with a composite material with a thermally-conducting filler. The inductive component is used in a so-called electronic ballast (EVG) in the field of illumination.

摘要翻译： 本发明涉及用于形成磁路的电感元件（1），其包括至少一个线绕组（3）和至少一个具有铁磁芯材料的芯（4）。 所述芯包括间隙（7,8）和至少一个另外间隙（8,7）以中断磁路。 电感元件的特征在于，间隙各自具有至少1.0mm的间隙宽度。 芯包括两个例如彼此跨过间隙（7,8）布置并且彼此隔开间隙宽度的两个部件。 该部件有利地对称地具有用于间隙的基本相等的间隙宽度。 通过使用能够接受高频的高频编织线和芯材制成的租用绕组，即使在高功率吞吐量以及因此低的电损耗也具有高Q因子，可以实现小型化的电感元件。 为了提高Q因子，电感元件还具有用于冷却线绕组的冷却装置。 因此，该装置设置有具有导热填料的复合材料。 电感元件用于照明领域的所谓电子镇流器（EVG）。

公开(公告)号：US06904128B2

公开(公告)日：2005-06-07

申请号：US10381883

申请日：2001-09-20

申请人： Andreas Schlögl ,  Peter Tichy ,  Eckhard Wolfgang

发明人： Andreas Schlögl ,  Peter Tichy ,  Eckhard Wolfgang

IPC分类号： F25D9/00 ,  A61B6/03 ,  H01J35/10

CPC分类号： A61B6/035 ,  A61B6/4488

摘要： A device (4) comprises a container (40) for a liquid coolant (41) that is disposed between the axis (1) and the surface (30) facing the axis to co-rotate with the surface. The device is further provided with an atomizer nozzle (42) of the container, facing the surface, from which the coolant is discharged during rotation of the container due to the centrifugal force (F) acting upon the coolant of the container in the form of an atomized jet (43) that strikes the surface. The device cools a surface of an electronic device (3) that runs hot, the electronic device supplying the X-ray source of a computer tomograph with power and rotating about the axis of the gantry (2) of the tomograph.

摘要翻译： 装置（4）包括用于液体冷却剂（41）的容器（40），所述容器（40）设置在所述轴线（1）和面向所述轴线的与所述表面共旋转的所述表面（30）之间。 装置还设置有面向表面的容器的雾化喷嘴（42），由于作用在容器的冷却剂上的离心力（F）以容器的冷却剂的形式 一个撞击表面的雾化射流（43）。 该装置冷却运行热的电子装置（3）的表面，电子装置向计算机断层摄影机的X射线源供电并围绕断层摄影机的台架（2）的轴线旋转。

公开(公告)号：US08890041B2

公开(公告)日：2014-11-18

申请号：US10586692

申请日：2005-01-13

申请人： Dan Neumayer ,  Wolfgang Schnell ,  Eckhard Wolfgang ,  Günter Zschau

发明人： Dan Neumayer ,  Wolfgang Schnell ,  Eckhard Wolfgang ,  Günter Zschau

IPC分类号： H05B6/12 ,  H05B6/36

CPC分类号： H05B6/1236 ,  H05B6/365 ,  Y02B40/123

摘要： A device wherein food can be warmed by means of induction, said device comprising at least one secondary coil which is formed from a current conductor, whereon at least one heating element is connected. The invention also relates to a device which is used to transfer energy in a device in order to warm food by means of induction, said device comprising a primary coil which is connected to a voltage source and which is formed from a current conductor. According to the invention, the primary and secondary coil is cast into a coil body by casting means, and the insulating casting means exhibits a coefficient of thermal expansion which essentially corresponds to the coil body.

摘要翻译： 一种其中可以通过感应加热食物的装置，所述装置包括至少一个由电流导体形成的次级线圈，其中连接有至少一个加热元件。 本发明还涉及一种用于在装置中传递能量以通过感应来加热食物的装置，所述装置包括连接到电压源并由电流导体形成的初级线圈。 根据本发明，初级线圈和次级线圈通过铸造装置铸造成线圈体，并且绝缘铸造装置表现出基本上对应于线圈体的热膨胀系数。

公开(公告)号：US5164666A

公开(公告)日：1992-11-17

申请号：US753555

申请日：1985-07-10

申请人： Eckhard Wolfgang ,  Klaus Zibert

发明人： Eckhard Wolfgang ,  Klaus Zibert

IPC分类号： H01J37/28 ,  G01N23/225 ,  G01R31/02 ,  G01R31/26 ,  G01R31/302 ,  G01R31/305 ,  H01L21/66

CPC分类号： G01R31/305

摘要： Method and apparatus for analyzing errors or failures in integrated circuits wherein the integrated circuit is displayed on the picture screen of a work station (AS) and the circuit is excited with a test signal such that at least one measuring location is selected on a malfunction path and an actual signal tappable at this measuring location is compared to a rated signal and wherein the fault location is identified from the comparison results at the measuring locations. The object is to execute a method using an electron beam testing apparatus (EMG) such that the simplest possible measured data transfer occurs. For this purpose the selection of the measuring location on the malfunctioning path proceeds such that a portion (23) of the layout of the integrated circuit corresponding to the measuring location is displayed on the picture screen of the work station and the measuring location is marked by a cursor (24) and position signals depending on the positon of the cursor (24) are supplied to the electron beam measuring apparatus for aligning the electron beam (2) to the measuring location and such that the electron beam testing apparatus is utilized for the identification of the actual signal.

摘要翻译： 用于分析集成电路中的错误或故障的方法和装置，其中所述集成电路显示在工作站（AS）的画面上，并且所述电路用测试信号激励，使得在故障路径上选择至少一个测量位置 并且将在该测量位置可抽出的实际信号与额定信号进行比较，并且其中根据测量位置处的比较结果来识别故障位置。 目的是执行使用电子束测试装置（EMG）的方法，使得发生最简单的可能的测量数据传送。 为此，在故障路径上的测量位置的选择进行，使得与测量位置相对应的集成电路的布局的部分（23）显示在工作站的画面上，测量位置由 将光标（24）和取决于光标（24）的位置的位置信号提供给用于将电子束（2）与测量位置对准的电子束测量装置，并且使得电子束测试装置用于 识别实际信号。

公开(公告)号：US4705954A

公开(公告)日：1987-11-10

申请号：US766448

申请日：1985-08-19

申请人： Peter Rummel ,  Eckhard Wolfgang

发明人： Peter Rummel ,  Eckhard Wolfgang

IPC分类号： H01J37/28 ,  G01B15/00 ,  G01R31/305 ,  H01J37/304 ,  G01N23/225

CPC分类号： G01R31/305 ,  H01J37/3045

摘要： A particle probe is positioned to a specific region when an actual position of the specific region appears shifted relative to its rated position due to local fields, and can therefore not be defined with high precision. The particle probe is positioned to a prescribed region. The particle probe is then deflected in the environment of this region such that the particle probe impinges different regions at the prescribed region. The position of the specific region is determined from the measured signals which are triggered given incidence of the particle probe on the different regions. The particle probe is then positioned to the specific region. An electrical line may form a test spot at the specific region wherein one dimension thereof is greater than a width thereof.

摘要翻译： 当特定区域的实际位置由于局部场而相对于其额定位置出现偏移时，粒子探针被定位到特定区域，因此不能高精度地定义。 颗粒探针定位到规定区域。 然后，颗粒探针在该区域的环境中被偏转，使得颗粒探针在规定区域上撞击不同的区域。 特定区域的位置由给定的不同区域上的颗粒探针的入射点触发的测量信号确定。 然后将颗粒探针定位到特定区域。 电线可以在其一个尺寸大于其宽度的特定区域处形成测试点。

公开(公告)号：US20090199999A1

公开(公告)日：2009-08-13

申请号：US11989130

申请日：2006-07-19

申请人： Gerhard Mitic ,  Eckhard Wolfgang

发明人： Gerhard Mitic ,  Eckhard Wolfgang

IPC分类号： F28D15/00 ,  H01R43/00

CPC分类号： H01L23/427 ,  F28D15/0241 ,  F28D15/046 ,  F28D15/06 ,  F28F13/187 ,  H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  Y10T29/49169 ,  H01L2924/00

摘要： At least one electric component, such as a power semiconductor component, has at least a two-phase cooling device having at least one evaporator. The evaporator has a liquefier with a structured liquefier surface for evaporating a cooling fluid, formed by an electric connecting line making electrical contact with an electric contact face of the component. The connecting line cools the power semiconductor component and a module equipped therewith. Isothermal cooling with a low thermal loading of the power semiconductor component or of the module is possible by virtue of the two-phase cooling device acting as an evaporating bath cooling system. The device is applied in the planar contact-making technology with a large surface by providing an electric component with an electric contact face and producing the electric connecting line to the evaporator surface on the contact face of the component.

摘要翻译： 至少一个电子部件，例如功率半导体部件，具有至少一个具有至少一个蒸发器的两相冷却装置。 蒸发器具有液化器，其具有结构化的液化器表面，用于蒸发由与组件的电接触面电接触的电连接线形成的冷却流体。 连接线冷却功率半导体部件和配备其的模块。 通过用作蒸发浴冷却系统的两相冷却装置，功率半导体部件或模块的热负荷低的等温冷却是可能的。 该装置通过提供具有电接触面的电气部件并且产生到部件的接触面上的蒸发器表面的电连接线，以大的表面施加在平面接触制造技术中。