公开(公告)号：US07091595B2

公开(公告)日：2006-08-15

申请号：US10985051

申请日：2004-11-10

申请人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

发明人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

IPC分类号： H01L23/22 ,  H01L23/29

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/19 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/82 ,  H01L24/86 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/73277 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

摘要翻译： 本发明涉及具有半导体芯片和再布线层的半导体器件，其半导体芯片通过其后侧接触嵌入壳体塑料组合物中。 半导体芯片的有源顶侧与外壳塑料组合物的顶侧形成共面整体顶侧。 后侧接触件通过扁平导体片带被引导到整个顶侧，从而可以从整个顶侧接近半导体芯片的后侧接触。

公开(公告)号：US20050098871A1

公开(公告)日：2005-05-12

申请号：US10985051

申请日：2004-11-10

申请人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

发明人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L21/98 ,  H01L23/498 ,  H01L25/065 ,  H01L23/02

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/19 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/82 ,  H01L24/86 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/73277 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

摘要翻译： 本发明涉及具有半导体芯片和再布线层的半导体器件，其半导体芯片通过其后侧接触嵌入壳体塑料组合物中。 半导体芯片的有源顶侧与外壳塑料组合物的顶侧形成共面整体顶侧。 后侧接触件通过扁平导体片带被引导到整个顶侧，从而可以从整个顶侧接近半导体芯片的后侧接触。

公开(公告)号：US07883993B2

公开(公告)日：2011-02-08

申请号：US11476046

申请日：2006-06-28

申请人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

发明人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

IPC分类号： H01L21/00 ,  H01L23/14

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/19 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/82 ,  H01L24/86 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/73277 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

摘要翻译： 本发明涉及具有半导体芯片和再布线层的半导体器件，其半导体芯片通过其后侧接触嵌入壳体塑料组合物中。 半导体芯片的有源顶侧与外壳塑料组合物的顶侧形成共面整体顶侧。 后侧接触件通过扁平导体片带被引导到整个顶侧，从而可以从整个顶侧接近半导体芯片的后侧接触。

公开(公告)号：US20060246624A1

公开(公告)日：2006-11-02

申请号：US11476046

申请日：2006-06-28

申请人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

发明人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

IPC分类号： H01L21/58

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/19 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/82 ,  H01L24/86 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/73277 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

公开(公告)号：US07772105B2

公开(公告)日：2010-08-10

申请号：US11925117

申请日：2007-10-26

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US07327023B2

公开(公告)日：2008-02-05

申请号：US11246545

申请日：2005-10-11

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US20070278639A1

公开(公告)日：2007-12-06

申请号：US11572873

申请日：2005-07-21

申请人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/02 ,  H01L21/00 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

摘要翻译： 公开了一种具有布线基板和半导体器件堆叠的中间布线板的半导体堆叠和半导体基底器件。 在一个实施例中，半导体芯片布置在中间布线板和布线基板之间，该布线基板一方面通过布线基板与布线基板的下侧的外部触点电连接，另一方面与布线基板 布线基板的边缘区域的区域。 中间布线板具有成角度的外部扁平导体，其电连接在布线板的接触端子区域中。 此外，在中间布线板的上侧，布置在内部扁平导体的自由端上的是外部接触端子区域，其尺寸和布置对应于要堆叠的半导体器件的外部触点。

公开(公告)号：US20080050907A1

公开(公告)日：2008-02-28

申请号：US11925117

申请日：2007-10-26

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US20060076667A1

公开(公告)日：2006-04-13

申请号：US11246545

申请日：2005-10-11

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US07009288B2

公开(公告)日：2006-03-07

申请号：US10889801

申请日：2004-07-13

申请人： Michael Bauer ,  Christian Birzer ,  Georg Ernst ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner

发明人： Michael Bauer ,  Christian Birzer ,  Georg Ernst ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner

IPC分类号： H01L23/48

CPC分类号： H01L23/552 ,  H01L23/295 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas and at least one ground terminal area. The semiconductor also includes a package that contains the semiconductor chip and also a chip carrier. The chip carrier has a number of external electrical terminals and an external ground terminal. The electrical terminal areas and the ground terminal areas of the semiconductor chip are electrically connected to the external electrical terminals and the external ground terminals of the chip carrier by connecting means. The semiconductor chip and the connecting means are in this case encapsulated by an electrically insulating passivation. The semiconductor chip encapsulated in this way is in turn encapsulated with an electrically and thermally conductive plastics compound, which forms the package and is electrically connected to the ground terminal.

摘要翻译： 提出了具有抗α辐射，β辐射和高频电磁辐射的电磁屏蔽装置的半导体部件。 半导体部件包括半导体芯片，其中集成有多个电端子区域的电路和至少一个接地端子区域。 半导体还包括包含半导体芯片以及芯片载体的封装。 芯片载体具有多个外部电气端子和外部接地端子。 半导体芯片的电气端子区域和接地端子区域通过连接装置电连接到芯片载体的外部电端子和外部接地端子。 在这种情况下，半导体芯片和连接装置被电绝缘钝化物封装。 以这种方式封装的半导体芯片又被形成封装并且电连接到接地端子的导电和导热塑料化合物封装。