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公开(公告)号：US09538666B2
公开(公告)日：2017-01-03
申请号：US14218803
申请日：2014-03-18
Inventor： Kwang-Seong Choi , Hyun-cheol Bae , Haksun Lee , Yong Sung Eom
CPC classification number: H05K3/3436 , H01L23/48 , H01L2924/0002 , H05K1/0283 , H05K1/189 , H05K2201/10128 , H05K2201/10734 , Y02P70/613 , H01L2924/00
Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.
Abstract translation: 提供了一种电子设备的接合结构，包括：在第一方向上延伸并沿第二方向布置在具有拉伸性的可拉伸显示面板上的第一电极，第二电极沿第一方向延伸并沿基板上的第二方向布置， 第一电极和介于第一电极和第二电极之间的焊接接合部分，在第二方向上彼此面对，并且在第一方向上构成多行。
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公开(公告)号：US11107790B2
公开(公告)日：2021-08-31
申请号：US16555060
申请日：2019-08-29
Inventor： Kwang-Seong Choi , Yong Sung Eom , KeonSoo Jang , Seok-Hwan Moon , Hyun-cheol Bae
IPC: H01L23/00
Abstract: A laser bonding method includes forming a bonding part including an adhesive layer and a conductive particle disposed within the adhesive layer on a substrate; aligning a bonding target by disposing the bonding target on a surface of the bonding part opposite the substrate; disposing a pressing part on a surface of the bonding target that is opposite to the bonding part and pressing the bonding target onto the bonding part through the pressing part; heating the bonding target by irradiating at least the pressing part with a laser and conducting heat from the pressing part to the bonding target and from the bonding target to the bonding part; and bonding together the bonding part and the bonding target by the heat conducted from the bonding target to the bonding part so that the conductive particle electrically connects the substrate and the bonding target. The pressing part may be removed.
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3.发明申请METHOD OF FABRICATING A SOLDER-ON-PAD STRUCTURE AND FLIP-CHIP BONDING METHOD USING THE SAME 有权使用该方法制造焊接片式结构和使用其的片芯粘合方法公开(公告)号：US20140117070A1
公开(公告)日：2014-05-01
申请号：US13846057
申请日：2013-03-18
Inventor： Kwang-Seong Choi , Ho-eun Bae , Hyun-cheol Bae , Yong Sung EOM , Su Jeong Jeon
IPC: B23K1/20
CPC classification number: B23K1/20 , B23K3/0623 , H01L24/11 , H01L2224/11005 , H01L2224/1134 , H01L2224/1152 , H01L2924/00014
Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
Abstract translation: 提供了一种制造焊接焊盘结构的方法。 该方法可以包括：提供具有衬垫的衬底，在衬底上涂覆包括第一树脂和焊料粉末的焊料凸块制造器，将焊料凸块制造器加热到低于焊料粉末的熔点的温度以将焊料粉末聚集 并且移除第一树脂。
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4.发明授权Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same 有权制造焊接焊盘结构的方法和使用其的倒装焊接方法公开(公告)号：US09034750B2
公开(公告)日：2015-05-19
申请号：US13846057
申请日：2013-03-18
Inventor： Kwang-Seong Choi , Ho-eun Bae , Hyun-cheol Bae , Yong Sung Eom , Su Jeong Jeon
CPC classification number: B23K1/20 , B23K3/0623 , H01L24/11 , H01L2224/11005 , H01L2224/1134 , H01L2224/1152 , H01L2924/00014
Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
Abstract translation: 提供了一种制造焊接焊盘结构的方法。 该方法可以包括：提供具有衬垫的衬底，在衬底上涂覆包括第一树脂和焊料粉末的焊料凸块制造器，将焊料凸块制造器加热到低于焊料粉末的熔点的温度以将焊料粉末聚集 并且移除第一树脂。
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5.发明授权公开(公告)号：US09031421B2
公开(公告)日：2015-05-12
申请号：US13934589
申请日：2013-07-03
Inventor： Joong-Seon Choe , Chun Ju Youn , Jong-Hoi Kim , Duk Jun Kim , Yong-Hwan Kwon , Kwang-Seong Choi , Eun Soo Nam
IPC: H04B10/06 , H04B10/077
CPC classification number: H04B10/0779
Abstract: Provided is a method of measuring signal transmission time difference of a measuring device. The measuring device according to embodiments, by measuring a skew on two optical paths through signal delays of sufficient sizes for skew measurement on the optical paths, even a skew having a minute size can be measured within a measurable range.
Abstract translation: 提供了测量装置的信号传输时间差的测量方法。 根据实施例的测量装置可以在可测量的范围内测量通过在光路上经过足够尺寸的信号延迟的信号延迟测量两个光路上的偏斜测量，甚至具有微小尺寸的偏斜。
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Patent Agency Ranking
公开(公告)号：US09024511B2
公开(公告)日：2015-05-05
申请号：US13864341
申请日：2013-04-17
Inventor： Chi Hoon Jun , Sang Choon Ko , Seok-Hwan Moon , Kwang-Seong Choi
IPC: H01L41/09 , H01L41/113
CPC classification number: H01L41/1136 , H02N2/186
Abstract: The present inventive concept discloses an impact-type piezoelectric micro power generator. The impact-type piezoelectric micro power generator may comprise a base having a cavity and at least one stop area adjacent to the cavity; a frame fastened to the base; a vibrating body comprising a plurality of first vibrating beams extended from the frame toward a top of the cavity, an impact beam connected to between first tips of the plurality of first vibrating beams and extended onto the stop area, and a second vibrating beam extended from the impact beam to between the plurality of first vibrating beams, the second vibrating beam having a second tip; and a piezoelectric device disposed on one of a top and a bottom of the second vibrating beam and the impact beam, the piezoelectric device generating electric power according to impacts of the vibrating body to the stop area and bending of the impact beam and the second vibrating beam.
Abstract translation: 本发明构思公开了一种冲击式压电微型发电机。 冲击型压电微型发电机可以包括具有空腔的基座和与空腔相邻的至少一个止动区域; 固定在基座上的框架; 振动体，包括从所述框架朝向所述空腔的顶部延伸的多个第一振动梁，连接到所述多个第一振动梁的第一末端之间并延伸到所述停止区域上的冲击梁，以及从所述第二振动梁延伸的第二振动梁 所述冲击梁到达所述多个第一振动梁之间，所述第二振动梁具有第二尖端; 以及设置在所述第二振动梁和所述冲击梁的顶部和底部中的一个上的压电装置，所述压电装置根据所述振动体对所述停止区域的冲击产生电力，并且所述冲击梁和所述第二振动 光束。
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公开(公告)号：US11618109B2
公开(公告)日：2023-04-04
申请号：US17364128
申请日：2021-06-30
Inventor： Gwang-Mun Choi , Yong Sung Eom , Kwang-Seong Choi , Jiho Joo , Chanmi Lee , Ki Seok Jang
Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
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公开(公告)号：US09980393B2
公开(公告)日：2018-05-22
申请号：US14704597
申请日：2015-05-05
Inventor： Yong Sung Eom , Kwang-Seong Choi , Hyun-cheol Bae , Jung Hyun Noh , Jong Tae Moon
CPC classification number: H05K3/1216 , C25D5/02 , H01B1/02 , H01B1/22 , H05K1/09 , H05K1/095 , H05K3/102 , H05K3/188 , H05K3/246 , H05K2201/0245 , H05K2201/0302 , H05K2203/0425
Abstract: A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.
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公开(公告)号：US09006037B2
公开(公告)日：2015-04-14
申请号：US13904572
申请日：2013-05-29
Inventor： Kwang-Seong Choi , Yong Sung Eom , Hyun-cheol Bae , Haksun Lee
CPC classification number: H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/1152 , H01L2224/1181 , H01L2224/13022 , H01L2224/13109 , H01L2224/13111 , H01L2224/16237 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81815 , H01L2924/07802 , H01L2924/15788 , H01L2924/3841 , H05K3/3484 , H05K2201/0367 , H05K2203/043 , H01L2924/00 , H01L2924/00014 , H01L2924/0105 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029
Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.
Abstract translation: 提供了形成凸块的方法和具有该凸块的半导体器件。 该方法可以包括提供具有衬垫的衬底，形成覆盖焊盘的凸块制作器层并且包括树脂和焊料颗粒，热处理凸块制造器层以将焊料颗粒聚集到焊盘上，去除树脂以暴露聚集的焊料 颗粒，形成树脂层以覆盖聚集的焊料颗粒，并且回流聚集的焊料颗粒以在焊盘上形成凸块。
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公开(公告)号：US12206056B2
公开(公告)日：2025-01-21
申请号：US17399754
申请日：2021-08-11
Inventor： Kwang-Seong Choi , Yong Sung Eom , Jiho Joo , Gwang-Mun Choi , Seok-Hwan Moon , Chanmi Lee , Ki Seok Jang
Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.
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