公开(公告)号：US20150148546A1

公开(公告)日：2015-05-28

申请号：US14607644

申请日：2015-01-28

Applicant: FUJIFILM Corporation

Inventor： Kyouhei SAKITA ,  Shinji FUJIMOTO ,  Mikio NAKAGAWA ,  Kenta YAMAZAKI

IPC: G03F7/027 ,  C07D277/84 ,  C07D263/60 ,  C07D277/64 ,  C07D263/56

CPC classification number: G03F7/027 ,  C07D263/56 ,  C07D263/60 ,  C07D277/64 ,  C07D277/84 ,  C07D417/12 ,  C08F12/22 ,  C08F20/26 ,  G03F7/0045 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/40 ,  H01L27/3258 ,  H05B33/22

Abstract: Provided is a photosensitive resin composition having high sensitivity and storage stability. The photosensitive resin composition comprises (A) a polymer component including a polymer satisfying at least one of (1) and (2) below:(1) a polymer comprising (a1) a structural unit containing a group in which an acid group is protected by an acid-dissociable group, and (a2) a structural unit containing a crosslinkable group, and (2) a polymer comprising (a1) a structural unit containing a group in which an acid group is protected by an acid-dissociable group, and a polymer comprising (a2) a structural unit containing a crosslinkable group; (B) a compound represented by formula (I) below; and (C) a solvent;

Abstract translation: 提供具有高灵敏度和储存稳定性的感光性树脂组合物。 感光性树脂组合物包含（A）包含满足下述（1）和（2）中至少一项的聚合物的聚合物组分：（1）包含（a1）含有酸基被保护基团的结构单元的聚合物 通过酸解离基团，和（a2）含有可交联基团的结构单元，和（2）包含（a1）含有酸基被酸解离基团保护的基团的结构单元的聚合物，以及 包含（a2）包含可交联基团的结构单元的聚合物; （B）由下式（I）表示的化合物; 和（C）溶剂;

公开(公告)号：US20140121292A1

公开(公告)日：2014-05-01

申请号：US14139971

申请日：2013-12-24

Applicant: FUJIFILM Corporation

Inventor： Kunihiko KODAMA ,  Kyouhei SAKITA ,  Hiroyuki YONEZAWA

IPC: C08F22/10

CPC classification number: C09D4/00 ,  C08F2220/1833

Abstract: Provided is a curable composition for imprints having good patternability and dry etching resistance. Disclosed is a curable composition for imprints comprising at least one kind of polymerizable monomer selected from the following compounds and a photopolymerization initiator;

Abstract translation: 提供了具有良好的图案性和耐干蚀刻性的用于印痕的可固化组合物。 公开了一种用于印痕的可固化组合物，其包含选自以下化合物和光聚合引发剂中的至少一种可聚合单体;

公开(公告)号：US20150014894A1

公开(公告)日：2015-01-15

申请号：US14504583

申请日：2014-10-02

Applicant: FUJIFILM Corporation

Inventor： Kunihiko KODAMA ,  Kyouhei SAKITA ,  Hiroyuki YONEZAWA

IPC: C08F222/20 ,  C08F222/24 ,  B29C59/00 ,  G03F7/004 ,  B05D5/00 ,  C08F222/14 ,  C08F220/18

CPC classification number: C08F222/20 ,  B05D5/00 ,  B29C59/005 ,  B29K2033/04 ,  B29K2105/0085 ,  B82Y10/00 ,  B82Y40/00 ,  C08F2/48 ,  C08F220/18 ,  C08F222/14 ,  C08F222/24 ,  C09D4/00 ,  G03F7/0002 ,  G03F7/004

Abstract: Provided is a curable composition for imprints having good patternability and dry etching resistance. Disclosed is a curable composition for imprints comprising a polymerizable monomer (Ax) having a substituent having an aromatic group and having a molecular weight of 100 or more, and a photopolymerization initiator.

Abstract translation: 提供了具有良好的图案性和耐干蚀刻性的用于印痕的可固化组合物。 公开了一种用于印痕的可固化组合物，其包含具有芳基且具有100以上分子量的取代基的可聚合单体（Ax）和光聚合引发剂。

公开(公告)号：US20130171415A1

公开(公告)日：2013-07-04

申请号：US13779419

申请日：2013-02-27

Applicant: FUJIFILM Corporation

Inventor： Kyouhei SAKITA ,  Wataru KIKUCHI ,  Masatoshi YUMOTO ,  Masanori HIKITA

IPC: C07D335/06 ,  C07D307/81 ,  C08G18/83 ,  C07D335/08

CPC classification number: C07D307/78 ,  C07C309/00 ,  C07C2602/08 ,  C07C2603/16 ,  C07C2603/18 ,  C07D307/92 ,  C07D335/06 ,  C07D335/08 ,  G02F1/133345 ,  G02F1/136227 ,  G02F2202/02 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/40 ,  H01L27/3258 ,  H05B33/22

Abstract: Disclosed is a photosensitive resin composition comprising: (Component A) an oxime sulfonate compound represented by Formula (1); (Component B) a resin comprising a constituent unit having an acid-decomposable group that is decomposed by an acid to form a carboxyl group or a phenolic hydroxy group; and (Component C) a solvent wherein in Formula (1) R1 denotes an alkyl group, an aryl group, or a heteroaryl group, each R2 independently denotes a hydrogen atom, an alkyl group, an aryl group, or a halogen atom, Ar1 denotes an o-arylene group or an o-heteroarylene group, X denotes O or S, and n denotes 1 or 2, provided that of two or more R2s present in the compound, at least one denotes an alkyl group, an aryl group, or a halogen atom.

Abstract translation: 公开了一种光敏树脂组合物，其包含：（组分A）由式（1）表示的肟磺酸盐化合物; （B成分）具有酸分解成羧酸或酚羟基的具有酸分解性基团的构成单元的树脂; 和（组分C）其中在式（1）中的R 1表示烷基，芳基或杂芳基的溶剂，每个R 2独立地表示氢原子，烷基，芳基或卤素原子，Ar 1 表示邻亚芳基或邻亚芳基，X表示O或S，n表示1或2，条件是化合物中存在两个或多个R 2，至少1表示烷基，芳基， 或卤素原子。

公开(公告)号：US20170115564A1

公开(公告)日：2017-04-27

申请号：US15399741

申请日：2017-01-06

Applicant: FUJIFILM CORPORATION

Inventor： Hiroyuki YONEZAWA ,  Kyouhei SAKITA

IPC: G03F7/031 ,  G03F7/40 ,  G03F7/38 ,  G03F7/32 ,  G03F7/16 ,  G03F7/20

CPC classification number: G03F7/031 ,  C08F2/48 ,  C08F222/1006 ,  C08F222/16 ,  C08F222/385 ,  G02F1/133345 ,  G03F7/027 ,  G03F7/0755 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/322 ,  G03F7/38 ,  G03F7/40 ,  G06F3/041 ,  G06F3/0412 ,  G06F2203/04103 ,  H01L51/50 ,  H05B33/22

Abstract: An object is to provide a photosensitive composition capable of obtaining a cured film having excellent reliability even when being heated at a low temperature and patterning by photolithography.A photosensitive composition of the present invention includes a polymerizable monomer having three or more (meth)acryloyl groups and one or more carboxy groups in a molecule as Component A, a polymerizable monomer having three or more (meth)acryloyl groups and not having a carboxy group in a molecule as Component B, a photopolymerization initiator as Component C, a solvent as Component D, a blocked isocyanate compound as Component N, and a polymerization inhibitor as Component K, in which a content of Component A is 10% to 50% by mass with respect to a total content of Component A and Component B.

公开(公告)号：US20160131976A1

公开(公告)日：2016-05-12

申请号：US14995356

申请日：2016-01-14

Applicant: FUJIFILM Corporation

Inventor： Tomotaka TSUCHIMURA ,  Kyouhei SAKITA

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/32 ,  G03F1/76 ,  G03F1/50 ,  G03F7/20

CPC classification number: G03F7/039 ,  G03F1/50 ,  G03F1/76 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0382 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/20 ,  G03F7/32

Abstract: Provided a resist composition for a semiconductor manufacturing process comprising (A) a compound expressed by General Formula (I) below: wherein, in General Formula (I) above, R1 represents an alkyl group, a cycloalkyl group, or an aryl group, R2 represents a univalent organic group, each of R3 to R6 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or a halogen atom, R3 and R4, R4 and R5, or R5 and R6 may be bonded to each other to form an alicyclic ring or an aromatic ring, and X represents an oxygen atom or a sulfur atom.

Abstract translation: 提供一种半导体制造方法用抗蚀剂组合物，其包括（A）由下述通式（I）表示的化合物：其中，在上述通式（I）中，R 1表示烷基，环烷基或芳基，R 2 代表一价有机基团，R 3至R 6各自表示氢原子，烷基，环烷基，芳基或卤原子，R 3和R 4，R 4和R 5或R 5和R 6可以各自键合 另外形成脂环或芳环，X表示氧原子或硫原子。