公开(公告)号：US11487202B2

公开(公告)日：2022-11-01

申请号：US16689389

申请日：2019-11-20

Applicant: FUJIFILM Corporation

Inventor： Takeshi Kawabata ,  Kenta Yoshida ,  Yu Iwai ,  Akinori Shibuya

IPC: G03F7/037 ,  G03F7/004 ,  C08G73/10 ,  C08G73/22 ,  H01L23/29 ,  H01L21/56 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38

Abstract: A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

公开(公告)号：US10501580B2

公开(公告)日：2019-12-10

申请号：US15824360

申请日：2017-11-28

Applicant: FUJIFILM Corporation

Inventor： Takeshi Kawabata ,  Takuma Amemiya ,  Hidekazu Oohashi ,  Yu Iwai ,  Akinori Shibuya

IPC: C08G73/10 ,  G03F7/021 ,  G03F7/023 ,  G03F7/038 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  C08F290/14 ,  G03F7/031 ,  G03F7/037 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L23/00

Abstract: A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.

公开(公告)号：US09448477B2

公开(公告)日：2016-09-20

申请号：US14656997

申请日：2015-03-13

Applicant: FUJIFILM CORPORATION

Inventor： Takeshi Kawabata ,  Hideaki Tsubaki ,  Hiroo Takizawa

IPC: G03F7/038 ,  G03F7/039 ,  G03F7/20 ,  G03F7/30 ,  G03F7/32 ,  G03F7/004 ,  C08F8/32

CPC classification number: G03F7/0388 ,  C08F8/32 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/2002 ,  G03F7/2037 ,  G03F7/2041 ,  G03F7/30 ,  G03F7/32 ,  G03F7/325

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a repeating unit represented by the specific formula and a group capable of decomposing by an action of an acid to produce a polar group; and an ionic compound represented by the specific formula, and a resist film comprising the actinic ray-sensitive or radiation-sensitive resin composition.

Abstract translation: 提供了光化射线敏感或辐射敏感性树脂组合物，其包含：（A）具有由特定式表示的重复单元的树脂和能够通过酸的作用分解以产生极性基团的基团; 和由该具体式表示的离子化合物，以及包含光化射线敏感或辐射敏感性树脂组合物的抗蚀剂膜。

公开(公告)号：US10234759B2

公开(公告)日：2019-03-19

申请号：US14751669

申请日：2015-06-26

Applicant: FUJIFILM Corporation

Inventor： Takeshi Kawabata ,  Hiroo Takizawa ,  Akinori Shibuya ,  Akiyoshi Goto ,  Masafumi Kojima ,  Keita Kato

IPC: G03F7/004 ,  G03F7/039 ,  C07D217/06 ,  C07D333/48 ,  C07D333/46 ,  C07D333/76 ,  C07D335/02 ,  C07D295/185 ,  C07D327/06 ,  C07C309/12 ,  C07C309/29 ,  C07C309/17 ,  C07C309/06 ,  C07C311/48 ,  C07C317/04 ,  C07C381/12 ,  C07J9/00 ,  C07J17/00 ,  C07J31/00 ,  G03F7/038

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (A) and any of compounds (B) of general formula (I) below. (In general formula (I), Rf represents a fluorine atom or a monovalent organic group containing at least one fluorine atom; R1 represents a hydrogen atom or a monovalent substituent containing no fluorine atom; X1 represents a monovalent organic group having at least two carbon atoms, or a methyl group in which a substituent other than a fluorine atom is optionally introduced, provided that X1 may be bonded to R1 to thereby form a ring; and Z represents a moiety that when exposed to actinic rays or radiation, is converted to a sulfonic acid group, an imidic acid group or a methide acid group).

公开(公告)号：US09557643B2

公开(公告)日：2017-01-31

申请号：US14451901

申请日：2014-08-05

Applicant: FUJIFILM Corporation

Inventor： Hiroo Takizawa ,  Tomotaka Tsuchimura ,  Takeshi Kawabata ,  Takuya Tsuruta

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/039 ,  G03F7/32 ,  G03F7/20

CPC classification number: G03F7/0388 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/0397 ,  G03F7/20 ,  G03F7/2002 ,  G03F7/325

Abstract: There is provided a pattern forming method comprising (1) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin containing an acid-decomposable repeating unit and being capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a compound capable of decomposing by the action of an acid to generate an acid, and (D) a solvent; (2) a step of exposing the film by using an actinic ray or radiation, and (4) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern.

Abstract translation: 提供了一种图案形成方法，其包括（1）通过使用含有（A）含有酸可分解重复单元的树脂并且能够降低溶解度的光化射线敏感性或辐射敏感性树脂组合物形成膜的步骤 对于含有机溶剂的显影剂，通过酸的作用，（B）能够在用光化射线或辐射照射时能够产生酸的化合物，（C）能够通过酸的作用分解以产生酸的化合物， 酸，和（D）溶剂; （2）通过使用光化射线或辐射使膜曝光的步骤，以及（4）通过使用含有机溶剂的显影剂显影曝光的膜以形成负图案的步骤。

公开(公告)号：US09152047B2

公开(公告)日：2015-10-06

申请号：US14451814

申请日：2014-08-05

Applicant: FUJIFILM Corporation

Inventor： Takeshi Kawabata ,  Hideaki Tsubaki ,  Hiroo Takizawa

IPC: G03F7/004 ,  G03F7/027 ,  G03F7/039 ,  G03F7/038 ,  C08K5/42 ,  G03F7/11 ,  G03F7/20

CPC classification number: G03F7/027 ,  C08K5/42 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0388 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/20 ,  G03F7/2041 ,  G03F7/2059

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a compound that when exposed to actinic rays or radiation, generates any of acids of general formula (I) below.

Abstract translation: 本发明提供一种光化学射线或辐射敏感性树脂组合物，其包括当暴露于光化射线或辐射时产生下列通式（I）的任何酸的化合物。

公开(公告)号：US11860538B2

公开(公告)日：2024-01-02

申请号：US16541794

申请日：2019-08-15

Applicant: FUJIFILM Corporation

Inventor： Takeshi Kawabata ,  Yu Iwai ,  Akinori Shibuya

IPC: C08L79/08 ,  C08L79/04 ,  C08L79/00 ,  B32B15/08 ,  B32B27/28 ,  G03F7/031 ,  C08G73/12 ,  G03F7/038 ,  H01L23/29 ,  H01L23/532 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38

CPC classification number: G03F7/031 ,  B32B27/281 ,  C08G73/128 ,  G03F7/038 ,  H01L23/293 ,  H01L23/5329 ,  B32B2255/10 ,  B32B2255/205 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/325 ,  G03F7/38

Abstract: Provided are a photosensitive resin composition in which the progress of cyclization reaction is fast and storage stability over time is excellent, a heterocyclic ring-containing polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device, using the photosensitive resin composition. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, and a solvent, in which a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.

公开(公告)号：US11567405B2

公开(公告)日：2023-01-31

申请号：US16689389

申请日：2019-11-20

Applicant: FUJIFILM Corporation

Inventor： Takeshi Kawabata ,  Kenta Yoshida ,  Yu Iwai ,  Akinori Shibuya

IPC: G03F7/037 ,  G03F7/004 ,  C08G73/10 ,  C08G73/22 ,  H01L23/29 ,  H01L21/56 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38

Abstract: A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

公开(公告)号：US10538627B2

公开(公告)日：2020-01-21

申请号：US15824360

申请日：2017-11-28

Applicant: FUJIFILM Corporation

Inventor： Takeshi Kawabata ,  Takuma Amemiya ,  Hidekazu Oohashi ,  Yu Iwai ,  Akinori Shibuya

IPC: C08G73/10 ,  G03F7/021 ,  G03F7/023 ,  G03F7/038 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  C08F290/14 ,  G03F7/031 ,  G03F7/037 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L23/00

Abstract: A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.

公开(公告)号：US10526448B2

公开(公告)日：2020-01-07

申请号：US15852992

申请日：2017-12-22

Applicant: FUJIFILM Corporation

Inventor： Akinori Shibuya ,  Yu Iwai ,  Takeshi Kawabata ,  Ichiro Koyama

IPC: C08G73/10 ,  C08G73/22 ,  C08F110/02 ,  C08F136/00 ,  C08F290/14 ,  G03F7/031 ,  G03F7/038 ,  H01L21/02 ,  G03F7/023 ,  G03F7/037 ,  C08G73/14

Abstract: Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.