摘要:
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
摘要:
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
摘要:
An object of technology disclosed herein is to improve cooling performance for plural heat generating bodies.A cooling system includes a heat dissipating section, plural heat receiving sections, and a bypass section. The heat dissipation section dissipates heat from a coolant by exchanging heat with an external fluid. The plural heat receiving sections are connected in parallel to the heat dissipating section, and heat generated by respective heat generating bodies is absorbed by the coolant. The bypass section couples at least one of the heat receiving sections out of the plurality of heat receiving sections to another heat receiving section.
摘要:
An object of technology disclosed herein is improving cooling efficiency.A heat exchanger includes plural pipes and a tank. The plural pipes are arrayed side-by-side. The tank couples together end portions of neighboring pipes among the plurality of pipes, and allows a coolant to flow from one of the neighboring pipes to another of the neighboring pipes.
摘要:
A cooling device comprising a heat receiver attached to a heat generating member and using a flow of coolant to rob heat from the heat generating member, a heat exchanger radiating off heat from the inflowing coolant to lower the temperature of the coolant, a first channel carrying the coolant from the heat receiver to the heat exchanger, a second channel carrying the coolant from the heat exchanger to the heat receiver, and a pump for making the coolant move, wherein, as the coolant, a mixed working fluid comprised of pure water or impure water containing nanoparticles plus ethanol to give an alcohol concentration of ethanol 0.1 mass % to 5 mass % is used to improve the freezing resistance.