Deep trench etching using HDP chamber
    1.
    发明申请
    Deep trench etching using HDP chamber 审中-公开
    深沟槽蚀刻使用HDP室

    公开(公告)号:US20050029221A1

    公开(公告)日:2005-02-10

    申请号:US10637360

    申请日:2003-08-09

    IPC分类号: C23F1/00

    CPC分类号: B81C1/00619

    摘要: A process for etching deep trenches in a substrate for purposes such as the fabrication of microelectromechanical systems (MEMS), for example, on the substrate. The two-step process includes first etching a tapered trench having a tapered profile and enhanced sidewall passivation in a substrate along a protective mask which defines the desired trench profile on the substrate surface. Next, the tapered trench is trimmed by high-density plasma in an isotropic etching step to provide a straight-profile deep trench with minimum sidewall passivation.

    摘要翻译: 用于蚀刻基板中的深沟槽的方法,例如在基板上制造微机电系统(MEMS)。 两步工艺包括首先沿着保护掩模在衬底中蚀刻具有锥形轮廓和增强的侧壁钝化的锥形沟槽,所述保护掩模在衬底表面上限定所需的沟槽轮廓。 接下来,在各向同性蚀刻步骤中通过高密度等离子体修剪锥形沟槽,以提供具有最小侧壁钝化的直轮廓深沟槽。

    Wafer transfer system with temperature control apparatus
    2.
    发明授权
    Wafer transfer system with temperature control apparatus 有权
    带温度调节装置的晶圆传送系统

    公开(公告)号:US06679064B2

    公开(公告)日:2004-01-20

    申请号:US10144521

    申请日:2002-05-13

    IPC分类号: F25B2102

    摘要: A wafer transfer system having a temperature control apparatus. The temperature control apparatus is constructed and arranged so that a material, element, or atomic particle may flow therethrough to heat or cool a wafer carried by the wafer transfer system. The material, element or atomic particle flowing through the temperature control apparatus causes heat to be pumped to or from an upper surface or lower surface. Preferably the temperature control apparatus is a thermoelectric device. Preferably the thermoelectric device includes a plurality of alternating N-type and P-type semiconductor pellets arranged electrically in series and thermally in parallel, and connected to a DC power supply. A switch or relay is provided for altering the direction of current flow to the thermoelectric device from a DC supply.

    摘要翻译: 一种具有温度控制装置的晶片传送系统。 温度控制装置被构造和布置成使得材料,元素或原子粒子可以流过其中以加热或冷却由晶片传送系统承载的晶片。 流过温度控制装置的材料,元素或原子粒子使得热量被泵送到上表面或下表面。 优选地,温度控制装置是热电装置。 优选地,热电装置包括多个交替的N型和P型半导体芯片,其电串联并联并联并且并联连接到DC电源。 提供开关或继电器,用于从直流电源改变到热电装置的电流的方向。

    Interconnect structure for integrated circuits
    3.
    发明授权
    Interconnect structure for integrated circuits 失效
    集成电路的互连结构

    公开(公告)号:US4956749A

    公开(公告)日:1990-09-11

    申请号:US123488

    申请日:1987-11-20

    申请人: Cheng-Cheng Chang

    发明人: Cheng-Cheng Chang

    摘要: A semiconductor integrated device support structure having a transmission line interconnect structure in a metal block on which the devices are mounted. The metal block is formed photolithographically from layers which define X,Y sections of the block. A plurality of stacked layers contains the complete wireline interconnect network. Each wire is a true coaxial transmission line having an inner conductor, a surrounding dielectric material and an outer conductor. By appropriate choice of radii of the inner conductor and the surrounding dielectric material, favorable impedances may be selected.

    摘要翻译: 一种半导体集成器件支撑结构,在其上安装有器件的金属块中具有传输线互连结构。 金属块由限定块的X,Y部分的层光刻地形成。 多个堆叠层包含完整的有线互连网络。 每条线是具有内部导体,周围介质材料和外部导体的真正的同轴传输线。 通过适当选择内部导体和周围介质材料的半径,可以选择有利的阻抗。

    Stationary exercise bicycle with horizontal flywheel

    公开(公告)号:US10022584B2

    公开(公告)日:2018-07-17

    申请号:US15406799

    申请日:2017-01-16

    申请人: Cheng-Cheng Chang

    发明人: Cheng-Cheng Chang

    摘要: An exercise machine such as a stationary exercise bicycle includes a body supported by the ground; an axle disposed in the body; a first gear disposed on the axle; a driving shaft vertically disposed in the body; a second gear disposed on the driving shaft and meshed the first gear; and a horizontally disposed flywheel disposed in a base of the body. A rotation of the axle rotates the flywheel via the first gear, the second gear, and the driving shaft.

    Scissors with precise control and labor-saving functions
    7.
    发明申请
    Scissors with precise control and labor-saving functions 审中-公开
    剪刀具有精确的控制和省力的功能

    公开(公告)号:US20050081386A1

    公开(公告)日:2005-04-21

    申请号:US10687640

    申请日:2003-10-20

    申请人: Cheng-Cheng Chang

    发明人: Cheng-Cheng Chang

    摘要: The present invention is scissors with precise control and labor-saving functions. It is to accurately control shears and cooperate with extendable force-arms with double fulcrums to save labor. The present invention comprises: a pair of cutting portions with a pair of cutters, the cutters being connected pivotally; two handle portions having two handle rods with double fulcrums and interaction force-arms, the double fulcrums including two front fulcrums connecting and exactly controlling the cutting portions and two rear fulcrums pivotally located on two rear ends of two handle rods, the rear fuilcrums cooperating with an elastic member to let the handle rods restore; two sliding sleeves located on the handle portions and being extendable based on length demands to assist as handle rods. Therefore, the shears can be controlled easily and precisely.

    摘要翻译: 本发明是具有精确控制和省力的剪刀。 准确控制剪切机,配合双支点伸缩力臂,节约劳力。 本发明包括:一对具有一对切割器的切割部分,切割器可枢转地连接; 两个把手部分具有两个具有双支点和相互作用力臂的把手杆,双支点包括两个前支点,两个前支点连接并精确地控制切割部分,两个后支点枢转地位于两个手柄杆的两个后端上,后部的支点与 弹性部件使手柄恢复; 两个滑动套管位于把手部分上,并且可根据长度要求而延伸,以辅助手柄杆。 因此,可以方便,准确地控制剪切。

    Integrated circuit packaging for optical sensor devices
    8.
    发明授权
    Integrated circuit packaging for optical sensor devices 有权
    用于光学传感器设备的集成电路封装

    公开(公告)号:US06396116B1

    公开(公告)日:2002-05-28

    申请号:US09513797

    申请日:2000-02-25

    IPC分类号: H01L27148

    摘要: An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate. In the embodiment, contact pads of the first substrate are flip chip bonded to contact pads of the circuit board with conductive balls. The connection between the first substrate and the circuit board provides the electrical connection between the optical sensor and the circuit board.

    摘要翻译: 光学器件封装技术涉及形成在第一衬底上的光学传感器和与第二衬底结合的倒装芯片。 第二基板包括与光学传感器对准的通孔或透明部分,以允许光接触光学传感器。 光学装置结构的实施例包括光学传感器,第一基板,第二基板和电路板。 光学传感器形成在第一基板上或内部,并且光学传感器的各个传感器或像素电连接到暴露在第一基板上的接触焊盘。 第一衬底被倒装芯片接合到第二衬底。 第二基板被倒装芯片接合到电路板上。 光学装置结构的另一实施例包括光学传感器,第一基板和作为第二基板的电路板。 在本实施例中,第一基板的接触焊盘与导电球倒装芯片接合到电路板的接触焊盘。 第一基板和电路板之间的连接提供光学传感器和电路板之间的电连接。

    Fault-isolating apparatus and method for connecting circuitry
    9.
    发明授权
    Fault-isolating apparatus and method for connecting circuitry 失效
    用于连接电路的故障隔离装置和方法

    公开(公告)号:US5031073A

    公开(公告)日:1991-07-09

    申请号:US518389

    申请日:1990-05-02

    申请人: Cheng-Cheng Chang

    发明人: Cheng-Cheng Chang

    摘要: A method and apparatus for electrically connecting circuitry on a printed circuit board having a plurality of circuit regions, with each circuit region having components operatively associated with input and output signal lines that are electrically isolated from the signal lines of adjacent circuit regions. The input and output signal lines of a particular circuit region are arranged in a closely spaced pattern aligned with a corresponding pattern of traces on an adjacent circuit region. A plurality of connector members are selectively attached to the printed circuit board to provide signal communication among the regions. Each connector member has closely spaced conductive bars which are exposed to contact the signal lines. The conductive bars have a length and a pitch such that the bars place parallel trace patterns in electrical communication when pressed in place. The connector members are multi-layered members having the conductive bars attached to a dielectric substrate and having an elastomeric material captured between a dielectric substrate and a metallic cap.

    摘要翻译: 一种用于在具有多个电路区域的印刷电路板上电连接电路的方法和装置,其中每个电路区域具有与与相邻电路区域的信号线电绝缘的输入和输出信号线可操作地相关联的部件。 特定电路区域的输入和输出信号线布置成与相邻电路区域上的相应迹线图案对准的紧密间隔的图案。 多个连接器构件选择性地附接到印刷电路板以提供区域之间的信号通信。 每个连接器构件具有紧密间隔的导电条,其暴露以接触信号线。 导电棒具有长度和间距,使得当按压就位时,条将电子通路中的平行轨迹图形放置。 连接器构件是多层构件,其具有连接到电介质基底的导电棒,并且具有捕获在电介质基底和金属帽之间的弹性体材料。